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REV.ECN/DESCRIPTIONBYDATE
REACH&RoHS
A0NEWMQ.Qu2017.12.28
COMPLIANT
PROFILEOFWAVESOLDER
HH
A
BC
GG
TiP
180℃
FF
120℃
EE
20℃
DD
A.PreheatingB.SolderingC.GradualCooling
Tiptemperature:260±5°C.
Tiptemperaturetime:5SecMax.
120
60～12060
TipmeltingpointofSn96.5/Ag3/Cu0.5:217°C.
TIME(Sec.)
Remarks:afterwavesoldering,theplastic
CC
positioningcolumnsoftheproductwhichunderthe
PCBwillbeslightlymelted,butitwon''taffectits
function.
BB
TITLE:SIZEUNITSGENERALTOLERANCESAPPROVEDBY:
JP.Gong
A4MM[INCH]UNLESSSPECIFIED
180oTAB-UP1X1100BASE
深圳市腾霏尔科技有限公司CHECKEDBY:
PARTNO.:SACLEREVx±0.35x°±3.0°
ShenzhenTengPhilTechnologyCo.,Ltd.
TW.Xu
1:1A0
.x±0.30.x°±2.0°
AA
微信手机：18025334326余先生QQ:1341092936
DESIGNDBY:
REMARK:SHEET.xx±0.25.xx°±1.5°
3/3.xxx±0.10.xxx°±1.0°MQ.Qu
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