系统级封装SIP-(system-in-package)及Embedded Substrate埋入式基板技术(2023精华版)

系统级封装SIP-(system-in-package)及EST-(Embedded Substrate Technology)埋入式基板技术

板级器件埋入式基板技术

Panel Level Embedded Substrate Technology

Contents目录

• Driving force of embedded substrate 

• Panel level embedded substrate technology

  面板级嵌入式基板技术

1. Components embedded

   埋入式元器件组件
   

2. Line embedded

   埋入式线路
   

3. Alternative interposer solution

   埋入式内插替代性解决方案
   

•  Summary and conclusions

摘要和结论

Electronic Product Trend

电子产品趋势

高密度封装基板应用领域

Advantages of Embedded Substrate

埋入式基板的优点

• Small Form-Facto  小形Fac to

外形尺寸缩小30`40%

PoP堆叠厚度减少10%

• Increase Electrical Performance提高电气性能

更低的信噪比

• Heterogeneous Integration 异构集成

Integration of different function device (memory, logic, MEMS, IPD..) in one package在一个封装中集成不同功能器件（存储器、逻辑、MEMS、IPD...）

• Layout Density and Flexibility 布局密度和灵活性

Bump pads of dies can be flexibly placed for substrate interconnect for layout optimization  可以更灵活地放置芯片凸点焊盘，用于衬底互连，以优化布局

Advantages of Embedded Substrate  嵌入式基板的优点

Total cost saving !!   总节省成本！！

• Thinner & Smaller (min ~ 200um thinner & ~ 20% PWB size）

更薄更小（最小值）节省200微米厚度和约20%的PWB尺寸

• smaller (depends on components embedded)

更小（取决于嵌入的组件）

• Better Performance:  ~15%

更好的性能:  提升~15%

•  Better drop test: ~ 2.5X     (10KG shock test passed)

更好的跌落测试:~2.5倍（可以通过10KG冲击试验）

Embedded Passive Substrate  嵌入式无源基板

• n/2/n Structure (EPS-FCBGA)

• n/2/n Structure (EPS-FCCSP)

• Embedded Process Flow 埋入式工艺流程

埋入技术分类

平面埋入式电容、电阻高密度封装基板

埋入分立器件的种类

普通电容侧面图

GRU15Y电容侧面图

• Cavity Layout Design Rule (w/ Cu Ring)腔体布局设计规则（含铜环）

  

• 

  

• EPS Technology Roadmap  EPS技术路线图

  

Key Point of Embedded Active  有源嵌入式的关键点：

• Interface Adhesion with PCB    与PCB的界面粘合

• Metallurgy on UBM  UBM上的冶金学

• Structure Properties  结构性质

• Extra-Process  其它工艺

  Unimicron EAS Example 1  Unimicron公司的EAS 展示 1

  Design

•    Body Size: 120x120mm    本体尺寸：120x120mm

•    Structure: 2/2/2                 结构：2/2/2

•    Embedded Die Size:  0.8x0.8 ~ 6x6mm  埋入芯片尺寸

•    Die Thickness: 200um ~ 360um   芯片厚度

• Results

• Reliability Result:   TCT 1500X Pass   THB 1000hrs Pass

  

  Unimicron EAS Example 2

  Design

•    Body Size: 25x4mm

•    Structure: 2/2/2

•    Embedded Type: Active & Passive component

•    Die Thickness: Multi-Thickness

  Results

•    Reliability Result:  Reflow 30X Pass

  

  EAS Technology Roadmap  EAS技术路线图

  

  Integrated Heat Slug (iHS)

• The slugs are embedded in the laminate as heat sink

  块状物作为散热片埋入到层压板中

•  Both ceramic and copper can be used as slug material

   陶瓷和铜都可以用作塞块材料

•  Multi-layers for design flexibility were developed

  多层设计的灵活性开发

  

  Construction of Embedded Heat Slugs  埋入式热芯块的实施

  Patent No: US8415780B2, US8441121B2, JP#5296894, JP#5331217

  

Heat Slug Specification  热块规格

Line Embedded (LE) Technology  线埋入式（LE）技术

LE:

·    Laser patterning of dielectric  介质的激光图案化

·   Embedded circuits  嵌入式电路

·   Capable of stereo copper features  具备立体铜功能

·   Covers FC, CSP, CIS, Coreless structures  涵盖FC, CSP, CIS, 无芯结构

埋入式分立器件工艺路线( 1 )

埋入式分立器件工艺路线( 2 )

系统集成---埋入式芯片介绍

高密度封装基板设计(特殊SiP设计结构)

Cavity down基板设计示意图

器件埋入式基板设计图

热分析

好处 Benefit:

• Better electric performance with lower variation of trench width/depth.

更好的电气性能与更低的沟槽宽度/深度的变化

• L/S≤8/8um fine pitch trench can be formed.

L/S≤8/8um 可以形成精细的沥青沟槽

• Better design flexibility & reliability than SAP process.

比SAP流程更好的设计灵活性和可靠性

Patent Radar Map 专利雷达图

Laser Patterning Quality & Geometry  激光图案化质量和几何

Pattern ablation by excimer laser 准分子激光消融模式

Line width:4um,5um,6um,8um&10um were evaluated.  L/S≤8/8um can be achieved by LE technology可以通过LE技术实现.

L/S≤5/5um Development

Smaller size filler Material B get better laser ablation result than

Material A.  材料B比材料A的尺寸小，激光烧蚀效果更好。

Solutions for Next Generation Substrate  下一代基板的解决方案

Alternative Interposer Solution_FC-EIC 替代性内插器解决方案_FC-EIC

Combine interposer and organic substrate:Eliminates the solder joints between interposer and organic substrate.

将内插层与有机基板结合：消除了内插层与有机基板之间的焊点。

Benefits:

• Layer reduction compare with conventional organic substrate.

与传统的有机基板相比，减少了层。

• Alternative solution for high density SiP.

  高密度SiP的替代解决方案
  

• Cost reduction by interposer/carrier integration.

• Cost reduction by interposer/carrier integration.

• 通过内插器/载波集成降低成

FC-EIC  :

Flip Chip-Embedded Interposer Carrier 倒装芯片嵌入式内插载体

Embedded technology for substrate can meet the small form factor

requirement, enjoy the benefits of better electric performance and    cost reduction.

    Unimicron has developed EAS  technology based on existing EPS

(Embedded Passive Substrate) HVM process flow, and passed internal and customer reliability requirements.

    FC-EIC could be one of the alternative interposer solutions as system

integrator.

EAS、FO-WLP和FO-PLP是新兴的技术。

实际应用案例:

平面埋入基板产品，应用于MEMS封装

CMMB模组埋入分立式电容

普通的功率芯片通过埋入线路板内部，可以实现器件的集成及体积的缩小

嵌入式有源器件,适用于基板的嵌入式技术可以满足小尺寸要求，享受更好的电气性能和降低成本的好处。

Unimicron在现有EPS的基础上开发了EAS技术

（嵌入式无源基板）HVM的工艺流程，并通过了内部和客户的可靠性要求。

FC-EIC可以作为系统的替代中间件解决方案之一。