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ASEMI代理英飞凌LED驱动器TLD2314EL规格书
2023-06-08 | 阅:  转:  |  分享 
  


LITIX? Basic

1 Overview

Applications

? Exterior LED lighting applications such as tail/brake light, turn indicator,

position light, side marker,...

? Interior LED lighting applications such as ambient lighting (e.g. RGB),

interior illumination and dash board lighting.

Application Diagram with TLD2314EL

TLD2314EL

3 Channel High-Side Current Source

Package PG-SSOP-14

Marking TLD2314

to ot her LITIX? Basic

47

0

k

?



In case PWM via VS is performed

For E MI improvement if required

C

ST

=1

0

0

p

F





C

mo

d

=2

.2μ

F

GND

C

VS

=4.

7

n

F

R

SE

T

1

R

SE

T

2

R

SE

T

3

ISO-Pulse

protection circuit

depending on

requirements

Internal

supply

Output

control

Thermal

protection

DEN

TLD2314EL

VS

Status

ST GN

D

IN_SET3

Current

adjustment

IN_SET2

IN_SET1

Diagnosis

enable

OUT3

OUT2

OUT1

4.7

n

F





4.7

n

F





4.7

n

F





VBATT

Data Sheet Rev. 1.2

www.infineon.com 2018-04-26





LITIX? Basic

TLD2314EL

Overview

Basic Features

? 3 Channel device with integrated output stages (current sources), optimized to drive LEDs with output

current up to 120 mA per channel

? Low current consumption

? PWM-operation supported via VS-pin

? Output current adjustable via external low power resistor and possibility to connect PTC resistor for LED

protection during over temperature conditions

? Reverse polarity protection and overload protection

? Undervoltage detection

? Open load and short circuit to GND diagnosis

? Wide temperature range: -40°C < T

j

< 150°C

? PG-SSOP-14 package with exposed heatslug

Description

The LITIX? Basic TLD2314EL is a three channel high side driver IC with integrated output stages. It is designed

to control LEDs with a current up to 120 mA. In typical automotive applications the device is capable to drive

i.e. 3 red LEDs per chain (total 9 LEDs) with a current up to 60 mA, which is limited by thermal cooling aspects.

The output current is controlled practically independent of load and supply voltage changes.

Protective Functions

? ESD protection

? Under voltage lock out

?Over Load protection

? Over Temperature protection

? Reverse Polarity protection

Diagnostic Functions

? Diagnosis enable function

?OL detection

? SC to Vs (indicated by OL diagnosis)

? SC to GND detection

Table 1 Product Summary

Parameter Symbol Value

Operating voltage range V

S(nom)

5.5 V ... 40 V

Maximum voltage V

S(max)

V

OUTx(max)

40 V

Nominal output (load) current I

OUTx(nom)

60 mA when using a supply voltage range of 8 V - 18 V (e.g.

Automotive car battery). Currents up to I

OUT(max)

possible in

applications with low thermal resistance R

thJA

Maximum output (load) current I

OUTx(max)

120 mA; depending on thermal resistance R

thJA

Output current accuracy at R

SETx

= 12 k? k

LT

750 ± 7%

Data Sheet 2 Rev. 1.2

2018-04-26



Data Sheet 3 Rev. 1.2

2018-04-26

LITIX? Basic

TLD2314EL



Block Diagram

2 Block Diagram

Figure 1 Basic Block Diagram

Internal

supply

Output

control

Thermal

protection

DEN

TLD2314EL

VS

St atus

ST GN

D

IN_SET3

Current

adjustment

IN_SET2

IN_SET1

Diagnosis

enable

OUT3

OUT2

OUT1





LITIX? Basic

TLD2314EL

Pin Configuration

3 Pin Configuration

3.1 Pin Assignment

Figure 2 Pin Configuration

11

12

13

14

TLD2314EL

EP

10

4

3

2

1

5

NC

ST

OUT3

OUT2DEN

OUT1NC

VS

VS

IN_SET3

6

7

IN_SET2

IN_SET1

9

8NC

GND

Data Sheet 4 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Pin Configuration

3.2 Pin Definitions and Functions

Pin Symbol Input/

Output

Function

1, 2 VS – Supply Voltage; battery supply, connect a decoupling capacitor (100 nF - 1 μF)

to GND

3DENI Diagnosis enable pin

4NC– Pin not connected

5 IN_SET3 I/O Input / SET pin 3; Connect a low power resistor to adjust the output current

6 IN_SET2 I/O Input / SET pin 2; Connect a low power resistor to adjust the output current

7 IN_SET1 I/O Input / SET pin 1; Connect a low power resistor to adjust the output current

8NC– Pin not connected

9GND

1)

Ground

1) Connect all GND-pins together.

10 ST I/O Status pin

11 OUT1 O Output 1

12 OUT2 O Output 2

13 OUT3 O Output 3

14 NC – Pin not connected

Exposed

Pad

GND –

1)

Exposed Pad; connect to GND in application

Data Sheet 5 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

General Product Characteristics

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Absolute Maximum Ratings

1)

T

j

= -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin for input pins (I),

positive currents flowing out of the I/O and output pins (O) (unless otherwise specified)

1) Not subject to production test, specified by design

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Max.

Voltages

4.1.1 Supply voltage V

S

-16 40 V –

4.1.2 Diagnosis enable voltage DEN V

DEN

-16 40 V –

4.1.3 Diagn. enable voltage DEN related to V

S

V

DEN(VS)

V

S

- 40 V

S

+ 16 V –

4.1.4 Diagn. enable voltage DEN related to

V

OUTx

V

DEN

- V

OUTx

V

DEN

-

V

OUTx

-16 40 V –

4.1.5 Output voltage V

OUTx

-1 40 V –

4.1.6 Power stage voltage

V

PS

= V

S

- V

OUTx

V

PS

-16 40 V –

4.1.7 IN_SETx voltage V

IN_SETx

-0.3 6 V –

4.1.8 Status voltage V

ST

-0.3 6 V –

Currents

4.1.9 IN_SETx current I

IN_SETx





2

3

mA –

Diagnosis output

4.1.10 Output current I

OUTx

– 130 mA –

Temperatures

4.1.11 Junction temperature T

j

-40 150 °C –

4.1.12 Storage temperature T

stg

-55 150 °C –

ESD Susceptibility

4.1.13 ESD resistivity to GND V

ESD

-2 2 kV Human Body

Model (100 pF via

1.5 k?)

2)

2) ESD susceptibility, Human Body Model “HBM” according to ANSI/ESDA/JEDEC JS-001-2011

4.1.14 ESD resistivity all pins to GND V

ESD

-500 500 V CDM

3)

3) ESD susceptibility, Charged Device Model “CDM” according to JESD22-C101E

4.1.15 ESD resistivity corner pins to GND V

ESD

-750 750 V CDM

3)

Data Sheet 6 Rev. 1.2

2018-04-26

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in

the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions

are not designed for continuous repetitive operation.





LITIX? Basic

TLD2314EL

General Product Characteristics

4.2 Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

4.3 Thermal Resistance

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Max.

4.2.16 Supply voltage range for

normal operation

V

S(nom)

5.5 40 V –

4.2.17 Power on reset threshold V

S(POR)

–5VR

SETx

=12k?

I

OUTx

= 80% I

OUTx(nom)

V

OUTx

=2.5V

4.2.18 Junction temperature T

j

-40 150 °C –

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

4.3.1 Junction to Case R

thJC

–810K/W

1)



2)



1) Not subject to production test, specified by design. Based on simulation results.

2) Specified R

thJC

value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad

are fixed to ambient temperature). T

a

= 85°C, Total power dissipation 1.5 W.

4.3.2 Junction to Ambient 1s0p board R

thJA1





61

56





K/W

1)



3)

T

a

=85°C

T

a

= 135 °C

3) The R

thJA

values are according to Jedec JESD51-3 at natural convection on 1s0p FR4 board. The product

(chip + package) was simulated on a 76.2 x 114.3 x 1.5 mm

3

board with 70 μm Cu, 300 mm

2

cooling area.

Total power dissipation 1.5 W distributed statically and homogenously over all power stages.

4.3.3 Junction to Ambient 2s2p board R

thJA2





45

43





K/W

1)



4)

T

a

=85°C

T

a

= 135 °C

4) The R

thJA

values are according to Jedec JESD51-5,-7 at natural convection on 2s2p FR4 board. The product

(chip + package) was simulated on a 76.2 x 114.3 x 1.5 mm

3

board with 2 inner copper layers (outside 2 x

70 μm Cu, inner 2 x 35 μm Cu). Where applicable, a thermal via array under the exposed pad contacted the

first inner copper layer. Total power dissipation 1.5 W distributed statically and homogenously over all

power stages.

Data Sheet 7 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

DEN Pin

5 DEN Pin

The DEN pin is a single function pin:

Figure 3 Block Diagram DEN pin

This pin is used to activate or deactivate the device internal diagnosis functions. The diagnostic functions are

described in Chapter 6.2, Chapter 7 and Chapter 8. The diagnosis is activated, if the voltage applied at the

DEN pin V

DEN

is higher than V

DEN(act)

. The diagnosis is disabled for voltages below V

DEN(dis)

.

A possibility to use the DEN pin is via a Zener diode, which is connected between VS and DEN pin. A circuit

example is shown in the application information section Chapter 10.

The diagnosis is activated, if the following condition is fulfilled:

(1)

The current consumption on the DEN pin has to be considered for the total device current consumption. The

current is specified in Pos. 5.1.9. The typical current consumption I

DEN(H)

as a function of the supply voltage V

S

for a Zener diode voltage of V

ZD

= 6 V is shown in the following diagram.

Figure 4 Typical I

DEN(H)

current for a Zener diode voltage of 6 V

The device and channel turn on is independent of the V

DEN

-voltage. After applying a supply voltage the device

is activated after the power on reset time t

POR

.

V

DEN

DEN

Output Control

I

DEN

V

S

V

DEN act??

V

ZD

+?

0

20

40

60

80

100

120

140

160

0 2 4 6 8 10 12 14 16 18

I

DE

N

[μA]

V

S

[V]

Typical I

DEN

=f(V

S

) with (V

S

-V

DEN

)=6V

Tj=-40°C

Tj=25°C

Tj=150°C

Data Sheet 8 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

DEN Pin

Figure 5 Power on reset

The DEN voltage V

DEN

does not influence the disable function via the ST pin. If V

DEN

< V

DEN(dis)

the device can still

be disabled via the ST pin, if V

ST

> V

ST(H)

. For details, please refer to Chapter 7.3.



5.1 Electrical Characteristics Internal Supply / DEN Pin

Electrical Characteristics Internal Supply / DEN pin

Unless otherwise specified: V

S

= 5.5 V to 40 V, T

j

= -40°C to +150°C, R

SETx

=12kΩ all voltages with respect to

ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output

pins (O) (unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

5.1.1 Current consumption,

active mode

I

S(on)

–– 1.9mA

1)

I

IN_SET

= 0μA

T

j

< 105 °C

V

S

= 18 V

V

OUTx

= 3.6V

5.1.2 Current consumption,

device disabled via ST

I

S(dis,ST)

–– 1.7mA

1)

V

S

= 18 V

T

j

< 105 °C

V

ST

= 5 V

5.1.3 Current consumption,

device disabled via

IN_SETx

I

S(dis,IN_SET)

–– 1.7mA

1)

V

S

= 18 V

T

j

< 105 °C

V

IN_SETx

= 5 V (all)

5.1.4 Current consumption,

active mode in single fault

detection condition with

ST-pin unconnected

I

S(fault,STu)

–– 2.1mA

1)

V

S

= 18 V

T

j

< 105 °C

R

SETx

= 12 kΩ

V

OUTx

= 18 V or 0 V

t

80%

t

POR

I

OUT

100%

V

S

Data Sheet 9 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

DEN Pin

5.1.5 Current consumption,

active mode in single fault

detection condition with

ST-pin connected to GND

I

S(fault,STG)

–– 6.2mA

1)

V

S

= 18 V

T

j

< 105 °C

R

SET1

= 12 kΩ

R

SET2,3

= unconnected

V

OUTx

= 18 V or 0 V

V

ST

= 0 V

5.1.6 Current consumption,

active mode in double

fault detection condition

one output disabled via

IN_SETx and with ST-pin

connected to GND

I

S(dfault,STG)

–– 9.2mA

1)

V

S

= 18 V

T

j

< 105 °C

R

SET1,2

= 12 kΩ

R

SET3

= unconnected

V

OUTx

= 18 V or 0 V

V

ST

= 0 V

5.1.7 Power-on reset delay time

2)

t

POR

–– 25μs

3)

V

S

=0→13.5 V

V

OUTx(nom)

= 3.6 ± 0.3V

I

OUTx

= 80% I

OUTx(nom)

5.1.8 Required supply voltage

for current control

V

S(CC)

–– 5.VV

OUTx

= 3.6 V

I

OUTx

≥ 90% I

OUTx(nom)

5.1.9 DEN high input current I

DEN(H)

















0.1

0.1

0.2

0.4

mA T

j

< 105 °C

V

S

= 13.5 V, V

DEN

= 5.5 V

V

S

= 18 V, V

DEN

= 5.5 V

V

S

= 18 V, V

DEN

= 12 V

V

S

= V

DEN

= 18 V

5.1.10 DEN activation threshold

(diagnosis enabled above

V

DEN(act)

)

V

DEN(act)

2.45 – 3.2 V V

S

= 8...18 V

5.1.11 DEN deactivation

threshold (diagnosis

disabled below V

DEN(dis)

)

V

DEN(dis)

1.5 – 2.3 V V

S

= 8...18 V

1) The total device current consumption is the sum of the currents I

S

and I

DEN(H)

, please refer to Pos. 5.1.9

2) See also Figure 4

3) Not subject to production test, specified by design

Electrical Characteristics Internal Supply / DEN pin (cont’d)

Unless otherwise specified: V

S

= 5.5 V to 40 V, T

j

= -40°C to +150°C, R

SETx

=12kΩ all voltages with respect to

ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output

pins (O) (unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

Data Sheet 10 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

IN_SETx Pin

6 IN_SETx Pin

The IN_SET pin is a multiple function pin for output current definition, input and diagnostics:

Figure 6 Block Diagram IN_SET pin

6.1 Output Current Adjustment via RSET

The output current of each channel can be adjusted independently. The current adjustment can be done by

placing a low power resistor (R

SET

) at the IN_SETx pin to ground. The dimensioning of the resistor can be done

using the formula below:

(2)

The gain factor k (R

SET

output current) is specified in Pos. 9.2.4 and Pos. 9.2.5. The current through the R

SET

is defined by the resistor itself and the reference voltage V

IN_SET(ref)

, which is applied to the IN_SET during

supplied device.

6.2 Smart Input Pin

The IN_SETx pin can be connected via R

SET

to the open-drain output of a μC or to an external NMOS transistor

as described in Figure 7 This signal can be used to turn off the output stages of the IC. A minimum IN_SET

current of I

IN_SET(act)

is required to turn on the output stages. This feature is implemented to prevent glimming

of LEDs caused by leakage currents on the IN_SET pin, see Figure 10 for details. In addition, the IN_SET pin

offers the diagnostic feedback information, if the status pin is connected to GND and V

DEN

> V

DEN(act)

(refer to

Chapter 5). Another diagnostic possibility is shown in Figure 8, where the diagnosis information is provided

via the ST pin (refer to Chapter 7 and Chapter 8) to a micro controller In case of a fault event with the ST pin

connected to GND the IN_SET voltage is increased to V

IN_SET(OL/SC)

Pos. 8.4.2. Therefore, the device has two

voltage domains at the IN_SET-pin, which is shown in Figure 11.

Note: If one output has a present fault (open load or short circuit) and one or both of the other channels are

dimmed via PWM at the IN_SET-pins a short spike to V

IN_SET(OL/SC)

is possible. Please refer to Chapter 8.3.

I

IN_SET

V

IN_SET(OL/SC)

IN_SET

GND

V

IN_SET

Logic

high impedance

R

SET

k

I

OUT

-----------=

Data Sheet 11 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

IN_SETx Pin

Figure 7 Schematics IN_SET interface to μC, diagnosis via IN_SET pin

Figure 8 Schematics IN_SET interface to μC, diagnosis via ST pin

The resulting switching times are shown in Figure 9:

R

SET

/2

Microcontroller

(e.g. XC866)

OUT

V

DDP

= 5 V

Current

adjust

IN_SET

GND

Basic LED Driver

R

SET

/2

IN

Status

ST

Microcontroller

(e.g. XC866)

OUT

V

DDP

= 5 V

Current

adjust

IN_SET

GND

Basic LED Driver

IN

Status

ST

R

SET

optional

I

IN_SET

t

t

20%

80%

t

ON(IN_SET )

I

OUT

100%

t

OFF(IN_SET)

Data Sheet 12 Rev. 1.2

2018-04-26

Figure 9 Switching times via IN_SET





LITIX? Basic

TLD2314EL

IN_SETx Pin

Figure 10 I

OUT

versus I

INSET

Figure 11 Voltage domains for IN_SET pin, if ST pin is connected to GND

I

IN_SET(ACT)

I

IN_SET

[μA]

I

OUT

[mA]

k = I

OUTx

V

IN_SET(ref)

/ I

IN_SETx

I

OUTx

I

IN_SETx

V

IN _S E T (ref ) m ax

V

IN_SET(OL/SC)min

V

IN_SET

V

IN _SET(OL/SC)max

Normal operation and high temperature current

reduction range

Diagnostic voltage range

Data Sheet 13 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

ST Pin

7 ST Pin

The ST pin is a multiple function pin.

Figure 12 Block Diagram ST pin

7.1 Diagnosis Selector

If the voltage at the DEN pin V

DEN

is higher than V

DEN(act)

, the diagnosis is activated. For details, please refer to

Chapter 5. If the status pin is unconnected or connected to GND via a high ohmic resistor (V

ST

to be below

V

ST(L)

), the ST pin acts as diagnosis output pin. In normal operation (device is activated) the ST pin is pulled to

GND via the internal pull down current I

ST(PD)

. In case of an open load or short circuit to GND condition the ST

pin is switched to V

ST(OL/SC)

after the open load or short circuit detection filter time (Pos. 8.4.9, Pos. 8.4.12).

If the device is operated in PWM operation via the VS pin the ST pin should be connected to GND via a high

ohmic resistor (e.g. 470 kΩ) to ensure proper device behavior during fast rising VS slope.

If the ST pin is shorted to GND the diagnostic feedback is performed via the IN_SET-pin, which is shown in

Chapter 6.2 and Chapter 8.

7.2 Diagnosis Output

If the status pin is unconnected or connected to GND via a high ohmic resistor (V

ST

to be below V

ST(L)

), it acts as

a diagnostic output, if the voltage at the DEN pin is above V

DEN(act)

. In case of a fault condition the ST pin rises

its voltage to V

ST(OL/SC)

(Pos. 8.4.7). Details are shown in Chapter 8.

7.3 Disable Input

If an external voltage higher than V

ST(H)

(Pos. 8.4.5) is applied to the ST pin, the device is switched off. This

function is working independently of the voltage at the DEN pin. Even if the diagnosis is disabled via

V

DEN

< V

DEN(dis)

the disable function of the ST pin is working. This function is used for applications, where

multiple drivers should be used for one light function. It is possible to combine the drivers’ fault diagnosis via

the ST pins. If a single LED chain fails, the entire light function is switched off. In this scenario e.g. the

diagnostic circuit on the body control module can easily distinguish between the two cases (normal load or

I

ST(OL/SC)

V

ST

ST

Output Control

FaultNo fault

V

ST(OL/SC)

I

ST(PD)

FaultNo fault

Data Sheet 14 Rev. 1.2

2018-04-26

load fault), because nearly no current is flowing into the LED module during the fault scenario - the drivers

consume a current of I

S(fault,STu)

(Pos. 5.1.4) or I

S(dis,ST)

(Pos. 5.1.2).





LITIX? Basic

TLD2314EL

ST Pin

As soon as one LED chain fails, the ST-pin of this device is switched to V

ST(OL/SC)

. The other devices used for the

same light function can be connected together via the ST pins. This leads to a switch off of all devices

connected together.

Figure 13 Switching times via ST Pin

V

ST

t

t

20%

80%

t

ON(ST)

I

OUT

100%

t

OFF(ST)

Data Sheet 15 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Load Diagnosis

8 Load Diagnosis

The diagnosis function is enabled, if the voltage at the DEN pin V

DEN

is above V

DEN(act)

as described in Chapter 5.

8.1 Open Load

An open load diagnosis feature is integrated in the TLD2314EL driver IC. If there is an open load on one of the

outputs, the respective output is turned off. The potential on the IN_SET pin rises up to V

IN_SET(OL/SC)

, if the ST

is connected to GND. This high voltage can be used as input signal for an μC as shown in Figure 8. If the ST pin

is open or connected to GND via a high ohmic resistor, the ST pin rises to a high potential as described in

Chapter 7. More details are shown in Figure 17. The open load status is not latched, as soon as the open load

condition is no longer present, the output stage will be turned on again. An open load condition is detected, if

the voltage drop over the output stage V

PS

is below the threshold according Pos. 8.4.10 and a filter time of t

OL

is passed.

Figure 14 IN_SET behavior during open load condition with ST pin connected to GND and V

DEN

> V

DEN(act)

t

V

S

–V

PS(OL)

t

OL

V

OUT

t

V

F

V

IN_SET(ref)

V

IN _SET(OL/SC)

V

S

V

IN_SET

open load

occurs

open load

disappears

t

IN_SET (reset)

Data Sheet 16 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Load Diagnosis

Figure 15 IN_SET and ST behavior during open load condition (ST unconnected) and V

DEN

> V

DEN(act)

8.2 Short Circuit to GND detection

The TLD2314EL has an integrated SC to GND detection. If the output stage is turned on and the voltage at the

output falls below V

OUT(SC)

the potential on the IN_SET pin is increased up to V

IN_SET(OL/SC)

after t

SC

, if the ST pin

is connected to GND. If the ST is open or connected to GND via a high ohmic resistor the fault is indicated on

the ST pin according to Chapter 7 after t

SC

. More details are shown in Figure 17. This condition is not latched.

For detecting a normal condition after a short circuit detection an output current according to I

OUT(SC)

is driven

by the channel.

t

V

S

–V

PS(OL)

t

OL

V

OUT

V

F

V

S

open load

occurs

open load

disappears

t

IN_SET(reset)

V

ST

t

VST(OL/SC)

V

IN_SET

t

V

IN _SET(ref)

Data Sheet 17 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Load Diagnosis

Figure 16 IN_SET behavior during short circuit to GND condition with ST connected to GND and V

DEN

>

V

DEN(act)

t

VOUT (SC)

t

SC

V

OUT

V

IN_SET

t

V

F

V

IN _SET(ref)

VIN _SET(OL/SC)

t

IN_SET( reset)

short circuit

occurs

short circuit

disappears

t

VOUT (SC)

t

SC

V

OUT

V

ST

t

V

F

VST(OL/SC)

t

IN_SET (reset)

short circuit

occurs

short circuit

disappears

V

IN_SET

t

V

IN_SET(ref )

Data Sheet 18 Rev. 1.2

2018-04-26

Figure 17 IN_SET and ST behavior during short circuit to GND condition (ST unconnected) and V

DEN

>

V

DEN(act)





LITIX? Basic

TLD2314EL

Load Diagnosis

8.3 Double Fault Conditions

The TLD2314EL allows the diagnosis of each channel separately, as long as the ST-pin is shorted to GND The

diagnosis filter times t

OL

and t

SC

(Pos. 8.4.9 and Pos. 8.4.12) are valid only for the channel, which diagnoses

first the fault condition. For the other channel or channels with a subsequential fault the diagnosis is reported

immediately without the diagnosis filter time, if the filter time t

OL

has been elapsed for the channel with the

first fault. During activation via IN_SET of a non-faulty output, where one channel has already a fault detected,

a short spike to V

IN_SET(OL/SC)

could occur on the channel, which should be activated. Therefore, in general a

diagnosis should be done earliest after the diagnosis filter times t

OL

and t

SC

to avoid any incorrect diagnosis

readout. In the scenario mentioned above the turn on time t

ON(IN_SET)

could be extended. The following figure

shows the example behavior, if OUT1 has a fault and OUT2 is operated in PWM-mode. OUT3 is disabled.

Data Sheet 19 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Load Diagnosis

Figure 18 Example single channel fault on OUT1 and PWM-operation on OUT2 with ST pin connected

to GND and V

DEN

> V

DEN(act)

t

V

S

–V

PS(OL)

t

OL

V

OUT1

t

VF

V

IN _SET(ref)

V

IN _SET(OL/SC)

V

S

V

IN_SET 1

open load

occurs

t

V

OUT2

t

V

F

V

IN _SET(ref)

V

IN _SET(OL/SC)

V

IN_SET2

V

OUT ( SC)

turn on command

I

IN_SET1

t

I

IN_SET2

t

VIN_SET(OL/SC) / RSET1

VIN_SET(ref ) / RSET1

V

IN _SET(OL/SC)

/ R

SET2

V

IN _SET(ref )

/ R

SET2

Data Sheet 20 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Load Diagnosis

8.4 Electrical Characteristics IN_SET Pin and Load Diagnosis

Electrical Characteristics IN_SET pin and Load Diagnosis

Unless otherwise specified: V

S

= 5.5 V to 40 V, T

j

= -40°C to +150°C, R

SETx

= 12 kΩ, V

DEN

= 5.5 V, all voltages with respect

to ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins (O)

(unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

8.4.1 IN_SET reference

voltage

V

IN_SET(ref)

1.19 1.23 1.27 V

1)

V

OUTx

=3.6V

T

j

= 25...115 °C

8.4.2 IN_SET open load/short

circuit voltage

V

IN_SET(OL/SC)

4– 5.V

1)

V

S

> 8 V

T

j

= 25...150 °C

V

S

= V

OUTx

(OL) or V

OUTx

=

0V (SC)

8.4.3 IN_SET open load/short

circuit current

I

IN_SET(OL/SC)

0.5 – 2.5 mA

1)

V

S

> 8 V

T

j

= 25...150 °C

V

IN_SET

= 4 V

V

S

= V

OUTx

(OL) or

V

OUT

= 0 V (SC)

8.4.4 ST device turn on

threshold (active low) in

case of voltage applied

from external (ST-pin

acting as input)

V

ST(L)

0.8 – – V –

8.4.5 ST device turn off

threshold (active low) in

case of voltage applied

from external (ST-pin

acting as input)

V

ST(H)

–– 2.5V–

8.4.6 ST pull down current I

ST(PD)

–– 15μAV

ST

=0.8V

8.4.7 ST open load/short

circuit voltage (ST-pin

acting as diagnosis

output)

V

ST(OL/SC)

4– 5.V

1)

V

S

> 8 V

T

j

= 25...150 °C

R

ST

= 470 kΩ

V

S

= V

OUTx

(OL) or

V

OUT

= 0 V (SC)

8.4.8 ST open load/short

circuit current (ST-pin

acting as diagnosis

output)

I

ST(OL/SC)

100 – 220 μA

1)

V

S

> 8 V

T

j

= 25...150 °C

V

ST

= 2.5 V

V

S

= V

OUTx

(OL) or

V

OUT

= 0 V (SC)

8.4.9 OL detection filter time t

OL

10 22 35 μs

1)

V

S

>8V

8.4.10 OL detection voltage

V

PS(OL)

= V

S

- V

OUTx

V

PS(OL)

0.2 – 0.4 V V

S

>8V

Data Sheet 21 Rev. 1.2

2018-04-26

8.4.11 Short circuit to GND

detection threshold

V

OUT(SC)

0.8 – 1.4 V V

S

>8V

8.4.12 SC detection filter time t

SC

10 22 35 μs

1)

V

S

> 8 V





LITIX? Basic

TLD2314EL

Load Diagnosis

8.4.13 IN_SET diagnosis reset

time

t

IN_SET(reset)

–5 20μs

1)

V

S

> 8 V

8.4.14 SC detection current in

case of unconnected ST-

pin

I

OUT(SC,STu)

100 200 300 μA V

S

> 8 V

V

OUTx

= 0 V

8.4.15 SC detection current in

case of ST-pin shorted

to GND

I

OUT(SC,STG)

0.1 2 4.75 mA V

S

> 8 V

V

OUTx

= 0 V

V

ST

= 0 V

8.4.16 IN_SET activation

current without turn on

of output stages

I

IN_SET(act)

2– 15μASe Figure 10

1) Not subject to production test, specified by design

Electrical Characteristics IN_SET pin and Load Diagnosis (cont’d)

Unless otherwise specified: V

S

= 5.5 V to 40 V, T

j

= -40°C to +150°C, R

SETx

= 12 kΩ, V

DEN

= 5.5 V, all voltages with respect

to ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins (O)

(unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

Data Sheet 22 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

Power Stage

9 Power Stage

The output stages are realized as high side current sources with a current of 120 mA. During off state the

leakage current at the output stage is minimized in order to prevent a slightly glowing LED. To increase the

overall output current for high brightness LED applications it is possible to connect two or all three output

stages in parallel.

The maximum current of each channel is limited by the power dissipation and used PCB cooling areas (which

results in the applications R

thJA

).

For an operating current control loop the supply and output voltages according to the following parameters

have to be considered:

? Required supply voltage for current control V

S(CC)

, Pos. 5.1.8

? Voltage drop over output stage during current control V

PS(CC)

, Pos. 9.2.6

? Required output voltage for current control V

OUTx(CC)

, Pos. 9.2.7

9.1 Protection

The device provides embedded protective functions, which are designed to prevent IC destruction under fault

conditions described in this data sheet. Fault conditions are considered as “outside” normal operating range.

Protective functions are neither designed for continuous nor for repetitive operation.

9.1.1 Over Load Behavior

An over load detection circuit is integrated in the LITIX? Basic IC. It is realized by a temperature monitoring of

the output stages (OUTx).

As soon as the junction temperature exceeds the current reduction temperature threshold T

j(CRT)

the output

current will be reduced by the device by reducing the IN_SET reference voltage V

IN_SET(ref)

. This feature avoids

LED’s flickering during static output overload conditions. Furthermore, it protects LEDs against over

temperature, which are mounted thermally close to the device. If the device temperature still increases, the

three output currents decrease close to 0 A. As soon as the device cools down the output currents rise again.

Figure 19 Output current reduction at high temperature

Note: This high temperature output current reduction is realized by reducing the IN_SET reference voltage

voltage (Pos. 8.4.1). In case of very high power loss applied to the device and very high junction

temperature the output current may drop down to I = 0 mA, after a slight cooling down the current

T

j

I

OUT

T

j(CRT)

V

IN_SET

Data Sheet 23 Rev. 1.2

2018-04-26

OUTx

increases again.





LITIX? Basic

TLD2314EL

Power Stage

9.1.2 Reverse Battery Protection

The TLD2314EL has an integrated reverse battery protection feature. This feature protects the driver IC itself,

but also connected LEDs. The output reverse current is limited to I

OUTx(rev)

by the reverse battery protection.

Note: Due to the reverse battery protection a reverse protection diode for the light module may be obsolete. In

case of high ISO-pulse requirements and only minor protecting components like capacitors a reverse

protection diode may be reasonable. The external protection circuit needs to be verified in the application.

9.2 Electrical Characteristics Power Stage

Electrical Characteristics Power Stage

Unless otherwise specified: V

S

= 5.5 V to 18 V, T

j

= -40°C to +150°C, V

OUTx

= 3.6 V, all voltages with respect to

ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output

pins (O) (unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

9.2.1 Output leakage current I

OUTx(leak)









7

3

μA I

IN_SET

= 0μA

V

OUTx

=2.5V

T

j

= 150 °C

1)

T

j

= 85 °C

9.2.2 Output leakage current in

boost over battery setup

-

I

OUTx(leak,B2B)

––50μA

1)

I

IN_SET

=0μA

V

OUTx

= V

S

= 40 V

9.2.3 Reverse output current -I

OUTx(rev)

––1μA

1)

V

S

= -16 V

Output load: LED with

break down voltage

<-0.6V

9.2.4 Output current accuracy

limited temperature range

k

LT

697

645

750

750

803

855

1)

T

j

= 25...115 °C

V

S

= 8...18 V

V

PS

= 2 V

R

SETx

= 6...12 kΩ

R

SETx

= 30 kΩ

9.2.5 Output current accuracy

over temperature

k

ALL

697

645

750

750

803

855

1)

T

j

= -40...115 °C

V

S

= 8...18 V

V

PS

= 2 V

R

SETx

= 6...12 kΩ

R

SETx

= 30 kΩ

9.2.6 Voltage drop over power

stage during current

control V

PS(CC)

= V

S

- V

OUTx

V

PS(CC)

0.75 – – V

1)

V

S

= 13.5 V

R

SETx

= 12 kΩ

I

OUTx

≥ 90% of

(k

LT(typ)

/R

SETx

)

9.2.7 Required output voltage

for current control

V

OUTx(CC)

2.3 – – V

1)

V

S

= 13.5 V

R

SETx

= 12 kΩ

I

OUTx

≥ 90% of

Data Sheet 24 Rev. 1.2

2018-04-26

(k

LT(typ)

/R

SETx

)





LITIX? Basic

TLD2314EL

Power Stage

9.2.8 Maximum output current I

OUT(max)

120 – – mA R

SETx

= 4.7 kΩ

The maximum output

current is limited by the

thermal conditions.

Please refer to

Pos. 4.3.1 - Pos. 4.3.3

9.2.9 ST turn on time t

ON(ST)

––15μs

2)

V

S

= 13.5 V

R

SETx

= 12 kΩ

ST → L

I

OUTx

= 80% of

(k

LT(typ)

/R

SETx

)

9.2.10 ST turn off time t

OFF(ST)

––10μs

2)

V

S

= 13.5 V

R

SETx

= 12 kΩ

ST →H

I

OUTx

= 20% of

(k

LT(typ)

/R

SETx

)

9.2.11 IN_SET turn on time t

ON(IN_SET)

––15μsV

S

= 13.5 V

I

IN_SET

= 0 → 100 μA

I

OUTx

= 80% of

(k

LT(typ)

/R

SETx

)

9.2.12 IN_SET turn off time t

OFF(IN_SET)

––10μsV

S

= 13.5 V

I

IN_SET

= 100 → 0μA

I

OUTx

= 20% of

(k

LT(typ)

/R

SETx

)

9.2.13 Current reduction

temperature threshold

T

j(CRT)

– 140 – °C

1)

I

OUTx

= 95% of

(k

LT(typ)

/R

SETx

)

9.2.14 Output current during

current reduction at high

temperature

I

OUT(CRT)

85% of

(k

LT(typ)

/R

SETx

)

––A

1)

R

SETx

=12kΩ

T

j

= 150 °C

1) Not subject to production test, specified by design

2) see also Figure 13

Electrical Characteristics Power Stage (cont’d)

Unless otherwise specified: V

S

= 5.5 V to 18 V, T

j

= -40°C to +150°C, V

OUTx

= 3.6 V, all voltages with respect to

ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output

pins (O) (unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

Data Sheet 25 Rev. 1.2

2018-04-26



Data Sheet 26 Rev. 1.2

2018-04-26

LITIX? Basic

TLD2314EL



Application Information

10 Application Information

Note: The following information is given as a hint for the implementation of the device only and shall not be

regarded as a description or warranty of a certain functionality, condition or quality of the device.

Figure 20 Application Diagram with Diagnosis for each channel

Note: This is a very simplified example of an application circuit. In case of high ISO-pulse requirements a reverse

protection diode may be used for LED protection. The function must be verified in the real application.

10.1 Further Application Information

? For further information you may contact http://www.infineon.com/

Micro-

controller

(e.g.

XC866)

OUT3

IN3

OUT2

IN2

OUT1

IN1

Open Drain

RSET/2 RSET/2

V

BATT C

mod

=2.2μF

ISO-Pulse protection circuit

depending on requirements

C

VS

=4.7nF

4.7nF 4.7nF 4.7nF

For EMI improvement, if required.

Output

control

OUT2

Current

adjust

Basic LED Driver

GND

IN_SET2

Status

ST

OUT3

OUT1

IN_SET1

IN_SET3

Internal

supply

Thermal

protection

DEN

VS

Diagnosis

enable

LITIX

TM

Basic



Data Sheet 27 Rev. 1.2

2018-04-26

LITIX? Basic

TLD2314EL



Package Outlines

11 Package Outlines

Figure 21 PG-SSOP-14

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant

with government regulations the device is available as a green product. Green products are RoHS-Compliant

(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

PG-SSOP-14-1,-2,-3-PO V02

1 7

14 8

14

17

8

14x

0.25±0.05

2)

M

0.15 DC A-B

0.65

C

Stand Off0 ...

0.1

(1.45)

1.7 MAX.

0.08 C

A

B

4.9±0.1

1)

A-BC0.1 2x

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Does not include dambar protrusion

Bottom View

±0.23

±0.2

2.65

0.2

±0.2

D

6

M D 8x

0.64

±0.25

3.9±0.1

1)

0.35 x 45?

0.1 CD

+0.06

0.19

8

?

MAX.

Index Marking

Exposed

Diepad

Dimensions in mm

For further information on alternative packages, please visit our website:

http://www.infineon.com/packages.



Data Sheet 28 Rev. 1.2

2018-04-26

LITIX? Basic

TLD2314EL



Revision History

12 Revision History

Revision Date Changes

1.0 2013-08-08 Inital revision of data sheet

1.1 2015-03-19 Updated parameters K

LT

and K

ALL

in the chapter Power Stage

1.2

2018-04-26

Updated to latest template

1.2 2018-04-26 Updated application drawing

1.2 2018-04-26 Updated package marking

1.2 2018-04-26 Updated package figure

Data Sheet 29 Rev. 1.2

2018-04-26





LITIX? Basic

TLD2314EL

1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 DEN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5.1 Electrical Characteristics Internal Supply / DEN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

6 IN_SETx Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.1 Output Current Adjustment via RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.2 Smart Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

7 ST Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.1 Diagnosis Selector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.2 Diagnosis Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.3 Disable Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8 Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.1 Open Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.2 Short Circuit to GND detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

8.3 Double Fault Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

8.4 Electrical Characteristics IN_SET Pin and Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

9 Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

9.1 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

9.1.1 Over Load Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

9.1.2 Reverse Battery Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

9.2 Electrical Characteristics Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

10.1 Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

11 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

12 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table of Contents

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

Edition 2018-04-26

Published by

Infineon Technologies AG

81726 Munich, Germany

? 2018 Infineon Technologies AG.

All Rights Reserved.

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aspect of this document?

Email: erratum@infineon.com

Document reference

TLD2314EL

IMPORTANT NOTICE

The information given in this document shall in no

event be regarded as a guarantee of conditions or

characteristics ("Beschaffenheitsgarantie").

With respect to any examples, hints or any typical

values stated herein and/or any information regarding

the application of the product, Infineon Technologies

hereby disclaims any and all warranties and liabilities

of any kind, including without limitation warranties of

non-infringement of intellectual property rights of any

third party.

In addition, any information given in this document is

subject to customer''s compliance with its obligations

stated in this document and any applicable legal

requirements, norms and standards concerning

customer''s products and any use of the product of

Infineon Technologies in customer''s applications.

The data contained in this document is exclusively

intended for technically trained staff. It is the

responsibility of customer''s technical departments to

evaluate the suitability of the product for the intended

application and the completeness of the product

information given in this document with respect to

such application.

For further information on technology, delivery terms

and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

WARNINGS

Due to technical requirements products may contain

dangerous substances. For information on the types

in question please contact your nearest Infineon

Technologies office.

Except as otherwise explicitly approved by Infineon

Technologies in a written document signed by

authorized representatives of Infineon Technologies,

Infineon Technologies’ products may not be used in

any applications where a failure of the product or any

consequences of the use thereof can reasonably be

expected to result in personal injury.

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