Training&
Reference
Guide
Through-HoleThrough-Hole
SolderJointSolderJoint
EvaluationEvaluation
IPCDRM-PTH-D
References:
IPC-A-610Dand
IPCJ-STD-001D
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Through-HoleSolderJointEvaluationTrainingandReferenceGuide1
Component
(Primary)Side
Barrel
Solder
(Secondary)
Side
Introduction&Classification
Introduction
ThisThrough-HoleSolderJointEvaluationTrainingandReferenceGuideprovides
visualexamplesofacceptabilityrequirements,defectsandconditionsfoundin
through-holesolderjointsonelectronicassemblies.Thismanualisintendedfor
useasanillustratedsupportdocumenttoassistinthetrainingandpracticeof
through-holesolderjointevaluation,andtherefore,itreferencesportionsofthefol-
lowingtwoIPCstandards:
First,theIPC-A-610Rev.D,AcceptabilityofElectronicAssemblies,whichillustrates
therequirementsformanytypesofsolderconnections.
Second,theIPCJ-STD-001Rev.D,RequirementsforSolderedElectricaland
ElectronicAssemblies,establishestheminimumacceptabilityrequirementsfor
printedboardassembliessoldering.
Classification
Through-holesolderjointrequirementsaredividedintothreeclassesdepending
ontheultimateuse,lifeexpectancyandoperatingenvironmentoftheelectronic
assembly.Thoseclassesareasfollows:
Class1GeneralElectronicProducts
Includesconsumertypeproductssuitableforapplicationswherethemajorrequire-
mentisthefunctionofthecompletedassembly,notnecessarilyforextendedlife,
reliabilityofservice,orcosmeticperfection.
Class2DedicatedServiceElectronicProducts
Includescommercialtypeproductswherecontinuedperformanceandextendedlife
isrequiredandforwhichuninterruptedserviceisdesiredbutnotcritical.Typically,
theenduseenvironmentwouldnotcausefailuresthroughextremesoftemperature
orcontamination.
Class3HighPerformanceElectronicProducts
Includesproductswherecontinuedhighperformanceorperformance-on-demandiscriti-
cal,equipmentdowntimecannotbetolerated,end-useenvironmentmaybeuncommonly
harsh,andtheequipmentmustfunctionwhenrequired.Thesehigh-reliabilitytypeprod-
uctsareusedinsuchsystemsaslife-supportandaerospace.
Note:Theinspectordoesnotselecttheclassforthepartunderinspection.
Documentationwhichspecifiestheapplicableclassforthepartunderinspection
shouldbeprovidedtotheinspector.
TableofContents
2
2
3
5
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28-29
30
Introduction
Classification
Terminology
AcceptanceCriteria
LeadFree
ConditionLevels
LandCoverage
ExcessSolder
VerticalFill
Wetting,Lead&Barrel
WettingofLead,Land&Barrel
ContactAngle
DiscerningtheLead
SolderBalls
SolderBridging
Cavities
ColdSolderJoint
CoatingMeniscusinSolderJoint
Corrosion/SurfaceAppearance
DisturbedSolderJoint
ExposedBasisMetal
LeadCutting/FracturedSolderJoint
LeadProtrusion
LeadProtrusion/Clinched
NonwettingofSolder
ParticulateMatter
Projections
Residue
SplashesofSolder/Webbing
DimensionalCriteria
SolderConditions
Page
Through-HoleSolderJointEvaluationTrainingandReferenceGuide2
TerminologyTerminology
ComponentSide:Theside
ofathrough-holeassembly
containingthemostcom-
ponentbodies.Alsocalled
the“primaryside”orthe
“solderdestinationside.”
Cross-sectionViewofaTargetPlated-ThroughHole
SolderSide:Thesidethat
iscoatedwithsolderinthe
solderwavemachine.Also
calledthe“secondaryside”
or“soldersourceside.”
Belowarethedefinitionsoftermsyouwillrunacrosswhileusingthismanual:(taken
fromIPC-T-50,TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits)
ClinchedLead-AcomponentleadthatisinsertedthroughaholeinaPWBandis
thenbentorclinchedtoholdthecomponentinplaceandtomakemetal-to-metal
contactwithalandbeforesoldering.
ColdSolderConnection-Asolderconnectionthatexhibitspoorwetting,andthat
ischaracterizedbyagray,porousappearance.
Component-Anindividualpartorcombinationofpartsthat,whentogether,
performadesignfunction.
Conductor-Asingleconductive(metal)pathinaconductivepattern.
Contactangle-Theangleformedbytheedgeofthesolderfilletandtheland’s
surface.
Dewetting-Aconditionthatresultswhenmoltensoldercoatsasurfaceandthen
recedestoleaveirregularly-shapedmoundsofsolderthatareseparatedbyarea
thatarecoveredwithathinfilmofsolderandwiththebasismetalnotexposed.
Disturbedsolderconnection-Asolderconnectionthatischaracterizedbythe
appearancethattherewasmotionbetweenthemetalsbeingjoinedwhenthe
solderwassolidifying.
Excesssolderconnection-Asolderconnectionthatischaracterizedbythe
completeobscuringofthesurfacesoftheconnectedmetalsand/orbythe
presenceofsolderbeyondtheconnectionarea.
Fillet-Anormally-concavesurfaceofsolderthatisattheintersectionofthe
metalsurfacesofasolderconnection.
Fluxresidue-Aflux-relatedcontaminantthatispresentonornearthesurfaceof
asolderconnection.
Icicle(solderprojection)-Anundesirableprotrusionofsolderfromasolidifiedsol-
derjointorcoating.
Land-Aportionofaconductivepatternthatisusuallyusedformakingelectrical
connections,forcomponentattachment,orboth.
Lead-Thewireorformedmetalconductorthatextendsfromacomponentto
serveasamechanicaland/orelectricalconnector.
continued….
Nonwetting-Thepartialadherenceofmoltensoldertoasurfacethatithascon-
tactedandbasismetalremainsexposed.
Pinhole-Asmallholethatpenetratesfromthesurfaceofasolderconnectiontoa
voidofindeterminatesizewithinthesolderconnection.
Plated-throughhole-Aholewithplatingonitswalls(supportedhole)thatmakes
anelectricalconnectionbetweenconductivepatternsoninternallayers,external
layers,orboth,ofaprintedboard.
Residue-Anyvisualormeasurableformofprocess-relatedcontamination.
Solder-Ametalalloywithameltingtemperaturethatisbelow427°C(800°F).
Solderability-Theabilityofametaltobewettedbymoltensolder.
Soldering-Thejoiningofmetallicsurfaceswithsolderandwithoutthemeltingof
thebasematerial.
Solderbridging-Theunwantedformationofaconductivepathofsolderbetween
conductors.
Spatter-Extraneousfragmentsofsolderwithanirregularshape.
Webbing-Acontinuousfilmorcurtainofsolderthatisparallelto,bynot
necessarilyadheringto,asurfacethatshouldbefreeofsolder.
Wetting-Theformationofarelativelyuniform,smooth,unbroken,andadherentfilm
ofsoldertoabasismetal.
Component
Side
Barrel
Solder
Side
Through-HoleSolderJointEvaluationTrainingandReferenceGuideThrough-HoleSolderJointEvaluationTrainingandReferenceGuide34
Through-HoleSolderJointEvaluationTrainingandReferenceGuide6
AcceptanceCriteria
InthisDeskReferenceManual,criteriaaregivenforeachclassinoneormore
ofthefollowinglevelsofcondition—
Photographsorillustrationsofeachconditionareshownintheleftcolumn
(examplesonoppositepage).Thelevelofacceptance,class(es)anddescrip-
tionoftheillustrationareallcontainedintherightcolumn.Inthefollowing
examples,definitionsofeachacceptancecriterionareprintedtotheright
ofsamplephotographs.Foreasierviewing,coloredbarsconnecteachphoto-
graphorillustrationtoeachdescription,withadifferentcolorusedforeach
acceptancelevel.
Notes:Acceptand/orrejectdecisionsmustbebasedonapplicabledocumentation
suchascontract,drawings,specificationssuchasIPC-A-610andIPCJ-STD-001
orotherreferenceddocuments.
DenotescriteriathathavechangedfromRevisionC
ofthesetwostandards.
LeadFreeSoldering
Theprimarydifferencebetweenthesolderconnectionscreatedwithprocessesusing
tin-leadalloysandprocessesusingleadfreealloysisrelatedtothevisualappear-
anceofthesolder.
Acceptableleadfreeandtin-leadconnectionsmayexhibitsimilarappearances,but
leadfreealloysaremorelikelytohave:
-Surfaceroughness(grainyordull)
-Greaterwettingcontactangles
Allothersoldercriteriaarethesame.
Wettingcannotalwaysbejudgedbysurfaceappearance.Thewiderangeofsolder
alloysinusemayexhibitfromlowornearzerodegreecontactanglestonearly90
degreecontactanglesastypical.
DenotesLeadFree
Adefectisaconditionthatisinsufficient
toensuretheform,fitorfunctionofthe
assemblyinitsenduseenvironment.The
manufacturershallrework,repair,scrap,
or“useasis”basedondesign,serviceand
customerrequirements.
AcceptableClass1,2,3
TargetClass1,2,3
ProcessIndicatorClass1,2,3
DefectClass1,2,3
Aprocessindicatorisaconditionthat
doesnotaffecttheform,fitandfunction
ofaproduct.However,processindicators
signalalackofgoodworkmanshiptothe
customerandshouldbeusedtoimprove
themanufacturingprocess—eventhough
theproductisconsideredusable.
Thischaracteristicindicatesacondition
that,whilenotnecessarilyperfect,will
maintaintheintegrityandreliabilityofthe
assemblyinitsserviceenvironment.
Aconditionthatisclosetoperfect;how-
ever,itisadesirableconditionandnot
alwaysachievableandmaynotbeneces-
sarytoensurereliabilityoftheassembly
initsserviceenvironment.
ConditionLevels
Acceptable
Target
ProcessIndicator
Defect
Pb
Through-HoleSolderJointEvaluationTrainingandReferenceGuide5
Through-HoleSolderJointEvaluationTrainingandReferenceGuide7Through-HoleSolderJointEvaluationTrainingandReferenceGuide8
DefectClass1,2,3
References:
A-610D:7.5.5.3,Table7-6
J-STD-001D:6.3.2,Table6-5
0%ofthecomponentsidelandareais
coveredwithwettedsolder.
Properlywettedsolderfilletcovers100%
ofcomponentsidelandareaandfeathers
outtoathinedgeonlandarea.
ComponentSide-ExcessSolderComponentSide-LandCoverage
Solderinleadbendareacomesincontact
withthecomponentbodyorendseal.
References:
A-610D:7.5.5.6
J-STD-001D:4.14.3
Solderinleadbendareadoesnotcontact
thecomponentbody.
Solderfilletendsbelowleadbendarea.
AcceptableClass1,2,3
TargetClass1,2,3
AcceptableClass1,2,3
Target/ComparisonClass1,2,3
Through-HoleSolderJointEvaluationTrainingandReferenceGuide9Through-HoleSolderJointEvaluationTrainingandReferenceGuide10
Aminimumof180°circumferentialwetting
(50%)presentoncomponent(primary)
sideofleadandbarrel.Verticalfillat
75%.
Aminimumof270°circumferentialwetting
(75%)presentoncomponent(primary)
sideofleadandbarrel.Verticalfillat75%.
Note:
Minimumacceptableconditionforcir-
cumferentialwettingofleadandbarrelon
componentsideforClass1isnotspecified.
References:
A-610D:7.5.5.2,Table7-6
J-STD-001D:6.3.2,Table6.5
100%(360°)circumferentialwettingpres-
entoncomponent(primary)sideoflead
andbarrel.Verticalfillat100%.
Notes:
Minimumacceptableconditionforvertical
fillofsolderonClass1assembliesisnot
specified.Lessthan100%solderfillmay
notbeacceptableinsomeapplications,
e.g.,thermalshock.
References:
A-610D:7.5.5.1,Table7-6
J-STD-001D:6.3.2,Table6-5,Fig.6-2
Asanexceptiontofillrequirementson
internallayerthermalheatsinkplanes
associatedwithplatedthroughholes,a
50%verticalfillofsolderispermitted,
butwithsolderextending360°around
theleadwith100%wettingtobarrelwalls
andtotheleadonthesolder(secondary)
side.Componentleadmustalsobevisible
onsoldersideofconnection.
Aminimumof75%solderfill,oratotal
maximumof25%depressionincludingboth
component(primary)andsolder(second-
ary)sidesispermitted.
75%fill
Barrel-WettingofLead&BarrelBarrel-VerticalFillofSolder
AcceptableClass2,3
DefectClass3
AcceptableClass2
AcceptableClass2
TargetClass1,2,3
AcceptableClass3
50%fill
Pb
Through-HoleSolderJointEvaluationTrainingandReferenceGuide11Through-HoleSolderJointEvaluationTrainingandReferenceGuide12
Note:Alsoappliestoleadandlandof
unsupportedholes.
Aminimumof270°circumferential(75%)
wettingpresentonsolder(secondary)
sideoflead,landandbarrel.
Aminimumof330°circumferential(approx.
90%)wettingpresentonsolder(second-
ary)sideofleadandbarrel.
Aminimumof270°circumferential(75%)
wettingfortheland.
References:
A-610D:7.5.5.4,7.5.5.5,Table7-6
J-STD-001D:6.3.2,Table6-5
100%solderfilletandcircumferentialwet-
tingpresentonsolder(secondary)sideof
solderjoint.
References:
A-610D:5,5.1
J-STD-001D:4.14
Nonwettingresultsin
thesolderformingaball
orbeadingonthesur-
face.Thefilletisconvex
andthecontactangle
isgreaterthan90°,but
solderdoesnotextend
overtheland.(Seenotesonpage5,lead
freewettingcontactangles.)
Verypoorwettingresultsinthesolder
clumpingonthesurface.Nofeatherededge
isapparent.Contactangleisirregular.
Thesolderfilletforms
acontactangleof
morethan90°due
toquantityofsolder
extendingoverthe
edgeoftheland.
Thesolderfillet
formsacontact
angleof90°
orless.
SolderSide-ContactAngleSolderSide-WettingofLead,Land&Barrel
AcceptableClass1,2
TargetClass1,2,3
AcceptableClass3
AcceptableClass1,2,3
TargetClass1,2,3
DefectClass1,2,3
Pb
Through-HoleSolderJointEvaluationTrainingandReferenceGuide13Through-HoleSolderJointEvaluationTrainingandReferenceGuide14
Leadnotdiscernibleonsolder(secondary)
sideduetoliftedcomponentorbentlead
oncomponent(primary)side.
Liftedcomponentorbentleadoncompo-
nent(primary)side.
References:
A-610D:7.5.5
J-STD-001D:6.1.3,Table6-3
Filletisslightlyconvexwithgoodwetting,
andtheleadisnotdiscernibleonthesol-
der(secondary)sideduetoexcesssolder.
However,visualevidenceoftheleadinthe
holecanbedeterminedonthecomponent
(primary)side.
Leadandlandarewellwetted,secondary
sideleadisclearlyvisible.Solderfilletis
concave.
Notes:
Entrapped/encapsulated/attachedisintendedtomeannormalserviceenvironment
ofproductwillnotcauseasolderballtobecomedislodged.
References:
A-610D:5.2.6.1
J-STD-001D:8.3.1
Solderballsnotentrappedinno-clean
residueorencapsulatedwithconformal
coating,ornotattached(soldered)toa
metalsurface,orthatviolateminimum
electricalclearance.
Encapsulatedsolderball.
SolderSide-DiscerningtheLeadSolderBalls
AcceptableClass1
TargetClass1,2,3
ProcessIndicatorClass2,3
DefectClass1,2,3
AcceptableClass1,2,3
DefectClass1,2,3
Through-HoleSolderJointEvaluationTrainingandReferenceGuide15Through-HoleSolderJointEvaluationTrainingandReferenceGuide16
Soldercavitiesthatreducecircumferential
wettingofleadandbarrel,landcoverage
orverticalfillbelowminimumacceptable
requirementsforclass.
References:
A-610D:5.2.2
J-STD-001D:4.14
Soldercavitieswhichdonotreducecir-
cumferentialwettingofleadandbarrel,
landcoverage,orverticalfillbelowmini-
mumacceptablerequirementsforclass.
Novoidareasorsurfaceimperfections.
Leadandcircuitryarewellwetted.
Solderbridgingacrossconductors.
Solderhasbridgedtoadjacentnoncom-
monconductor.
References:
A-610D:5.2.6.2
J-STD-001D:4.14.3
Cavities,Voids,Pinholes,Blowholes,etc.SolderBridging
DefectClass1,2,3
Target/ComparisonClass1,2,3
ProcessIndicatorClass2,3
DefectClass1,2,3
AcceptableClass1
Through-HoleSolderJointEvaluationTrainingandReferenceGuide17Through-HoleSolderJointEvaluationTrainingandReferenceGuide18
Solder(secondary)sideexhibits360°of
goodwetting,andcoatingisnotvisible
withintheconnectiononsolder(second-
ary)side.
References:
A-610D:7.5.5.7
J-STD-001D:6.1.6
Componentcoatingisintotheplated-
throughhole.Allothersolderingrequire-
mentshavebeenmet(seephotobelow).
Coatedorsealedcomponents:Thereisa
1.2mmorgreaterseparationbetweenthe
edgeofthecomponentcoating(meniscus)
andthesolderfillet.
References:
A-610D:5.1
J-STD-001D:4.14,4.14.3
Coldsolderjoint:lumpyandpoorlywetted
tolandandlead.
Solderjointissmooth,shinytosatinlus-
ter,wellwettedonentirelandandlead.
CoatingMeniscusinSolderJointColdSolderJoint
Target/ComparisonClass1,2,3
DefectClass1,2,3AcceptableClass1
Target/ComparisonClass1,2,3
ProcessIndicatorClass2
DefectClass3
Through-HoleSolderJointEvaluationTrainingandReferenceGuide19Through-HoleSolderJointEvaluationTrainingandReferenceGuide20
Coloredresiduesorrustyappearance
onmetallicsurfacesorhardware,or
otherevidenceofcorrosion.
Slightdullingofcleanmetallic
surfaces.
Shinytosatinlusterandcleanmetallic
surfaces.
References:
A-610D:10.4.5
J-STD-001D:8.3
References:
A-610D:5.2.7
J-STD-001D:4.14,4.14.3
Disturbedsolderjoint:hasstresslines
frommovementintheconnectionwhile
solidifying.
Solderjointissmooth,shinytosatinlus-
ter,wellwettedonentirelandandlead.
DisturbedSolderJointCorrosion/SurfaceAppearance
AcceptableClass1,2,3
Target/ComparisonClass1,2,3
DefectClass1,2,3
Target/ComparisonClass1,2,3
DefectClass1,2,3
Surfaceofleadfreesolderjointsmaybe
grainyordull.
Pb
Pb
Through-HoleSolderJointEvaluationTrainingandReferenceGuide21Through-HoleSolderJointEvaluationTrainingandReferenceGuide22
Notes:
Appliestoprintedboardassemblies
wherethesecondarysidehashadleads
trimmedaftersoldering.Whenleadcut-
tingisperformedaftersoldering,the
solderterminationsneedtoeitherbe
reflowedorvisuallyinspectedat10xto
ensurethatthesolderconnectionhas
notbeendamagedordeformed.
Fracturedsolderconnection.
References:
A-610D:5.2.1,Figs.5-26,5-28
J-STD-001D:4.14.1
Exposedcopperonverticalconductor
edges.
Exposedbasismetalatcutendsofcom-
ponentleadsorwires.
Notes:
Exposedbasismetaloncomponentleads,
conductorsorlandsfromnicks,scratch-
es,dents,etc.,are:
Acceptable-Class1,
ProcessIndicator-Class2,3
Providedconditionmeetsrequirements
forlead,conductorandland.
Certainboardandconductorfinishesmay
exhibitsolderwettingonlytospecific
areas.Exposedbasismetalisaccept-
ableinthesecircumstances,ifallother
requirementsaremet.
Nofracturesbetweenleadandsolder.
LeadCutting/FracturedSolderJoints
ExposedBasisMetal
AcceptableClass1,2,3AcceptableClass1,2,3
DefectClass1,2,3
References:
A-610D:7.5.5.8
J-STD-001D:4.14,4.14.3,6.1.4
C
maxL
minL
Through-HoleSolderJointEvaluationTrainingandReferenceGuide23Through-HoleSolderJointEvaluationTrainingandReferenceGuide24
Theleadendisvisibleinthesolderjoint
(minimum)andthereisnodangerofvio-
latingelectricalspacingorcausingshorts
(maximum).
Theleadendisvisibleinthesolderjoint
(minimum)andextendsnomorethan2.5
mm(Class2),orextendsnomorethan
1.5mm(Class3)fromthetopoftheland
(maximum)providedthereisnodangerof
violatingelectricalclearance,orexceeding
maximumdesignheightrequirements.
Theprotrusionofleadsbeyondthecon-
ductivesurfaceiswithinthespecifiedmin-
imumandmaximumofdimension“L.”Lead
protrusionshouldnotallowthepossibility
ofviolatingminimumelectricalspacing,
damagetosolderconnectionsdueto
landdeflection,orpenetrationofstatic
protectivepackagingduringsubsequent
handling.
Maximum
1.5mmto2.5mm
MaximumbyClass
Minimum
Minimum
References:
A-610D:7.5.3,Table7-5,Figs.7-96,7-97
J-STD-001D:6.1.3,Table6-3
Theleadisclinchedtowardanelectrically
uncommonconductor,violatingthemini-
mumelectricalclearance.
References:
IPC-610D:7.5.4,Figs.7-98,
7-99,7-100,7-101
J-STD-001D:6.1.3,Table6-3
Theclinchedleadextendsmorethanthe
maximumheightallowedforstraight-
throughleadsforitsclass.(Partially
clinchedleadsforpartretentionshallbe
consideredasunclinchedleads,andneed
tomeetprotrusionrequirements.)
Theclinchedleaddoesnotviolatethe
minimumelectricalclearance(C)between
non-commonconductors,andisnot
greaterthanthesimilarlengthallowedfor
straight-throughleads.
Leadendisparalleltotheboardanddirec-
tionoftheclinchisalongtheconnecting
conductor.
2.5mmormax.
heightallowed
LeadProtrusion/ClinchedLeadProtrusion
Minimum
Electrical
Clearance
AcceptableClass1
Target/ComparisonClass1,2,3
AcceptableClass2,3
AcceptableClass1,2,3
Target/ComparisonClass1,2,3
DefectClass1,2,3
Through-HoleSolderJointEvaluationTrainingandReferenceGuide25Through-HoleSolderJointEvaluationTrainingandReferenceGuide26
References:
A-610D:5.2.4
J-STD-001D:4.14
Moltensolderhasnotadheredorformed
anacceptablemetallicbondbetweenlead,
barrelandland.
Thesolderfilletappearsgenerallysmooth
andexhibitsgoodwettingofthesolderto
thepartsbeingjoined.Theoutlineofthe
partsiseasilydetermined.Afeathered
edgeiscreatedbythesolderatthepart
beingjoined.
Thesolderconnectionmustindicateevi-
denceofwettingandasmoothblendof
soldertothesurfaceformingacontact
angleof90°orless.
(Alsoseepage12,SolderSide-Contact
Angle)
NonwettingofSolder
AcceptableClass1,2,3
Target/ComparisonClass1,2,3
DefectClass1,2,3
Non-wettingresultsinthesolderforming
aballorbeadingonthesurface.Thefillet
isconvex;nofeatherededgeisapparent.
References:
A-610D:10.4.2
J-STD-001D:8.3.1
Dirtandparticulatematteronassembly.
Assembliesshouldbefreeofdirt,lint,
dross,andotherparticulatematter.
Clean.
ParticulateMatter
Target/ComparisonClass1,2,3
DefectClass1,2,3
Pb
Pb
C
Through-HoleSolderJointEvaluationTrainingandReferenceGuide27Through-HoleSolderJointEvaluationTrainingandReferenceGuide28
Solderprojectionsthatviolatespacing
orheightrequirementsoftheassembly
design(assemblycouldshortouttoadja-
centboardorframewhenplacedinfinal
systemposition).
SolderprojectionsthatviolateMinimum
ElectricalClearance(C).
Solderprojectionsthatposeasafetyhaz-
ard(someonecouldinjurethemselveson
theprojection).
References:
A-610D:5.2.9
J-STD-001D:6.1.3,Table6-3,4.14.3
Maximum
Height
Allowed
Projections
DefectClass1,2,3Target/ComparisonClass1,2,3
Novisibleresidue.
Fluxresiduesfrom“no-clean”processes
maybeallowed.
Visibleresiduefrom“cleanable”fluxes,or
anyactivefluxresiduesonelectricalcon-
tactsurfaces.
Class1maybeacceptableafter
qualificationtesting.Checkalsoforflux
entrapmentinandundercomponents.
Processesdesignated“noclean”need
tocomplywithendproductcleanliness
requirements.
DefectClass1,2,3
Minimum
Electrical
Clearance
Residue
References:
A-610D:10.4.1
J-STD-001D:8.3.2
Through-HoleSolderJointEvaluationTrainingandReferenceGuide29Through-HoleSolderJointEvaluationTrainingandReferenceGuide30
Soldersplashes.
SplashesofSolder/Webbing
DefectClass1,2,3
Solderwebbing.
Residue—Continued
Metallicareasexhibitcrystallinewhite
deposits.WhiteresidueonPWBsurface,
onoraroundsolderedtermination.
Whiteresiduesresultingfromno-cleanor
otherprocessesareacceptableprovided
theresiduesfromchemistriesusedhave
beenqualifiedasharmless.
Allassemblysurfacesareclean,novisible
residue.
References:
A-610D:10.4.3
J-STD-001D:8.3.2
Target/ComparisonClass1,2,3
DefectClass1,2,3
References:
A-610D:5.2.6.3
J-STD-001D:8.3.1
Thisreferenceguidedoesnottakeprecedenceover,orreplacetherequirements
fromanyIPCStandardorSpecification.Whileeveryefforthasbeenmadetorepre-
sentapplicableportionsoftheIPCJSTD-001DandIPC-A-610Ddocuments,this
guidemaynotcoverallrelatedrequirementsandisnotintendedforuseasanindus-
tryconsensusstandard.IPCdisclaimsanywarrantiesorguarantees,expressedor
implied,andshallnotbeheldliablefordamagesofanykindinconnectionwiththe
informationsetforthinIPC-DRM-PTH-D.
Ifyouhavecommentsorsuggestionsregardingthis
TrainingandReferenceGuide,pleasecontact:
IPCTraining
P.O.Box389
RanchosdeTaos,NM87557
505.758.7937(tel.)
505.758.7938(fax)
service@ipcvideo.org
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