配色: 字号:
Following_willow_and_celled_bell
2013-09-27 | 阅:  转:  |  分享 
  
ApplicationReport

SPRA533

DigitalSignalProcessingSolutionsApril1999

TMS320C6000EMIFtoExternalSBSRAM

Interface

KyleCastilleDigitalSignalProcessingSolutions

Abstract

InterfacingexternalsynchronousburstSRAM(SBSRAM)totheTexasInstruments(TI?)

TMS320C6000seriesofdigitalsignalprocessors(DSPs)issimplecomparedtoprevious

generationsofTIDSPsthankstotheadvancedexternalmemoryinterface(EMIF).TheEMIF

providesagluelessinterfacetoavarietyofexternalmemorydevices.

Thisdocumentdescribes:

G72EMIFcontrolregistersandSBSRAMsignals

G72Interfaceschematicofx32/36andx18SBSRAMdevices

G72SBSRAMfunctionalityandperformanceconsiderations

G72Timinganalysisoftheinterfacebetweenvarious‘C6000DSPsandMicronSBSRAM

Contents

InterfaceofEMIFWithSBSRAM.....................................................................................................................2

OverviewofEMIF.............................................................................................................................................5

’C6201/’C6701SBSRAMInterface...........................................................................................................5

’C6202SBSRAMInterface.......................................................................................................................5

’C6211/’C6711SBSRAMInterface...........................................................................................................5

EMIFSignalDescriptions..........................................................................................................................6

EMIFRegisters.......................................................................................................................................12

SBSRAMOperations.....................................................................................................................................14

Non-Burst-ModeAccessesby’C6201,’C6701,and’C6202...................................................................14

Burst-ModeAccessesby’C6211and’C6711.........................................................................................15

OptimizingSBSRAMAccesses...............................................................................................................17

TimingConstraints.........................................................................................................................................17

TMS320C6000Outputs(ED,EA,CE,BE,SSADS,SSOE,SSWE).......................................................18

TimingComparisonsforThreeSBSRAMs..............................................................................................20

CompleteExampleUsing’C6201B................................................................................................................22

Assumptions...........................................................................................................................................22

RegisterConfiguration............................................................................................................................22

CodeSegment........................................................................................................................................23

References.....................................................................................................................................................24

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface2

Figures

Figure1.EMIF—Onex36SBSRAMInterface................................................................................................3

Figure2.EMIF—Twox18SBSRAMInterface................................................................................................4

Figure3.EMIF—Onex18SBSRAMInterface................................................................................................5

Figure4.’C6201/’C6701EMIFSBSRAMInterfaceBlockDiagram.................................................................6

Figure5.’C6202EMIFSBSRAMInterfaceBlockDiagram..............................................................................7

Figure6.’C6211/’C6711EMIFSBSRAMInterfaceBlockDiagram.................................................................8

Figure7.FullSpeedInterface—’C6201rev2.1vs.’C6201B/’C6701............................................................10

Figure8.HalfSpeedInterface—’C6201rev2.1vs.’C6201B/’C6701...........................................................11

Figure9.HalfSpeedInterface—’C6202.......................................................................................................11

Figure10.ExternalClockInterface—’C6211/’C6711....................................................................................11

Figure11.ByteLaneAlignmentvs.Endiannessonthe’C6211/’C6711.......................................................12

Figure12.EMIFGlobalControlRegisterDiagram........................................................................................13

Figure13.’C6201/’C6202/’C6701EMIFCESpaceControlRegisterDiagram.............................................13

Figure14.’C6211/’C6711EMIFCESpaceControlRegisterDiagram.........................................................14

Figure15.SBSRAMWrite—HalfSpeed.......................................................................................................15

Figure16.SBSRAMRead—HalfSpeed.......................................................................................................15

Figure17.SBSRAMWriteBurstbythe’C6211/’C6711................................................................................16

Figure18.SBSRAMReadBurstbythe’C6211/’C6711................................................................................17

Figure19.OutputsFrom’C6000(WriteData[ED],Control,andAddressSignals)......................................19

Figure20.OutputsFrom’C6000(WriteData[ED],Control,andAddressSignals)......................................19

Figure21.Inputto‘C6000(ReadData)........................................................................................................20

Figure22.EMIFGlobalControlRegisterDiagram........................................................................................22

Figure23.EMIFCE2SpaceControlRegisterDiagram................................................................................23

Tables

Table1.EMIFSBSRAMPins..........................................................................................................................9

Table2.EMIFMemory-MappedRegistersforSBSRAM..............................................................................12

Table3.EMIFGlobalControlRegisterBitFieldDescriptionforSBSRAM...................................................13

Table4.EMIFCESpaceControlRegisterBitFieldDescriptionforSBSRAM..............................................14

Table5.SBSRAMBurstCounter..................................................................................................................16

Table6.SDRAMRegisters...........................................................................................................................22

InterfaceofEMIFWithSBSRAM

AsshowninFigure1,theEMIFinterfacesdirectlyto32-bit-wideindustrystandard

SBSRAMs.SBSRAMsareavailableinbothflowthroughandpipeline;however,the

‘C6000DSPsinterfaceonlytostandardwritepipelineSBSRAM(eithersingle-ordouble-

cycledeselect),whichhasthecapabilitytooperateathigherfrequencieswithsustained

throughput.

TheSBSRAMinterfaceallowsahigh-speedmemoryinterfacewithoutsomeofthe

limitationsofSDRAM.Mostnotably,becauseSBSRAMsareSRAMdevices,

consecutivereadsorconsecutivewritestoalladdresseswithintheSBSRAMcanoccur

onanycycle.TheSBSRAMinterfacetypicallyrunsathalftheCPUclockrate.Oncertain

‘C6000devices,thisinterfacemayrunateithertheCPUclockspeedorhalfofthisrate,

basedonthesettingoftheSSCRTbitintheEMIFglobalcontrolregister.Other‘C6000

devicesallowthesynchronousmemoryinterfacestorunoffanexternalclockthathasno

relationtotheoperatingfrequencyoftheDSP.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface3

Figure1showstheconnectionsusedtointerfacetoa36-bit-wideSBSRAM.Forthis

interface,thefourparitybitsoftheSBSRAMshouldbetiedtogroundthrougharesistor

becausethe‘C6000databusisonly32bitswideandcannottakeadvantageoftheparity

bits.Thisinterfaceisalmostidenticaltotheinterfacetoa32-bit-wideSBSRAM,except

thata32-bit-wideSBSRAMhasNoConnectsinsteadofparitybits.

Figure1.EMIF—Onex36SBSRAMInterface

x36

SBSRAM

CLK

/ADSC

A[N:0]

DQ[31:0]

/BWE

/BW[4:1]

/CE

/OE

ExternalMemory

Interface(EMIF)

CLK



EA[N+2:2]

/SSADS

ED[31:0]

/SSWE

/BE[3:0]

/CEn

/SSOE

DQP[3:0]

VSS

CLK=SSCLKfor''C6201/''C6701;CLK=CLKOUT2for''C6202;CLK=ECLKOUTfor''C6211/C6711

Figure2showstheconnectionsusedtointerfacetotwo18-bit-wideSBSRAMs.Forthis

example,twoSBSRAMsareusedinparalleltointerfacetothe32-bit-widedatabusof

the‘C6000DSPs.TheadvantageofthisinterfaceisthatwithagivendensitySBSRAM,

theaddressablememoryspaceiseffectivelydoubledbyusingtwodevicesinparallel.

TheparitybitsoftheSBSRAMsaretiedtogroundthroughapull-downresister.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface4

Figure2.EMIF—Twox18SBSRAMInterface

VSS

x18

SBSRAM

CLK

/ADSC

A[N:0]

DQ[15:0]

/BWE

/BW[1:0]

/CE

/OE

DQP[1:0]

x18

SBSRAM

CLK

/ADSC

A[N:0]

DQ[15:0]

/BWE

/BW[1:0]

/CE

/OE

DQP[1:0]

ExternalMemory

Interface(EMIF)

CLK



EA[N+2:2]

/SSADS

ED[31:16]

/SSWE

/BE[3:2]

/CEn

/SSOE

/BE[1:0]

ED[15:0]

VSS

CLK=SSCLKfor''C6201/''C6701;CLK=CLKOUT2for''C6202;CLK=ECLKOUTfor''C6211/C6711

Figure3showsaninterfacetoasinglex18SBSRAM.Thisinterfacemaybeattractive

forlow-costapplicationswheredevicecountandboardspacearecritical.Thisinterface

isonlysupportedonthe‘C6211and‘C6711devices.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface5

Figure3.EMIF—Onex18SBSRAMInterface

VSS

x18

SBSRAM

CLK

/ADSC

A[N:0]

DQ[15:0]

/BWE

/BW[1:0]

/CE

/OE

DQP[1:0]

ExternalMemory

Interface(EMIF)

CLK

+

EA[N+2:2]

/SSADS

/SSWE

/BE[1:0]

/CEn

/SSOE

ED[15:0]

+CLK=ECLKOUTfor''C6211/C6711

OverviewofEMIF

’C6201/’C6701SBSRAMInterface

G72Canoperateateither1/2xtheCPUclockspeedor1xtheCPUclockspeed

G72SSCLKisusedastheSBSRAMclock.

G72HasdedicatedSBSRAMcontrolsignals.Anycombinationofsynchronousmemory

typesisallowed.

G72Onlysupports32-bit-wideSBSRAMinterface

’C6202SBSRAMInterface

G72Canoperateat1/2xtheCPUclockspeed

G72CLKOUT2isusedastheSBSRAMclock.

G72SBSRAMcontrolsignalsareMUXedwithSDRAMcontrolsignals.Onlyonetypeof

synchronousmemoryisallowedinthesystem.

G72Onlysupports32-bit-wideSBSRAMinterface

’C6211/’C6711SBSRAMInterface

G72ClockspeedisindependentofinternalCPUspeedandcanrunatamaximumof100

MHz.AnexternalclockcanbetiedtoECLKINformaximumflexibilityorCLKOUT2

canberoutedbacktoECLKINforsimplicity,resultinginamemoryclockspeedof

1/2xtheCPUclockspeed.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface6

G72ECLKOUTmustbeusedasthesynchronousmemoryclockandisamirrorimageof

ECLKIN.

G72SBSRAMcontrolsignalsareMUXedwithSDRAMandAsynccontrolsignals.Any

combinationofsynchronousmemorytypesisallowed.

G728-bit-wideand16-bit-wideinterfacesareallowed.Thedatabusbytelanesused

dependontheendiannessofthesystem.

EMIFSignalDescriptions

Figure4showsablockdiagramoftheEMIF,theinterfacebetweenexternalmemoryand

theotherinternalunitsofthe‘C6000.Onthe‘C6201,‘C6701,and‘C6202,theinterface

withtheprocessorisprovidedviatheDMA(directmemoryaccess)controller,program

memorycontroller,anddatamemorycontroller.Forthe‘C6211and‘C6711,the

interfacewiththeprocessorisprovidedviatheenhancedDMA.

Figure4throughFigure6showtheblockdiagramsofthe‘C6201/’C6701,‘C6202,and

‘C6211/’C6711respectively.Notethattheclocksandthecontrolsignalsareslightly

differentforeachofthethreedifferentstyleEMIFs.ThesignalslistedinTable1describe

theSBSRAMinterfaceandthesharedinterfacesignals.

Figure4.’C6201/’C6701EMIFSBSRAMInterfaceBlockDiagram

Sharedbyall

externalinterfaces

Internalperipheralbusinterface

DMAinterface

DataAccess

ProgramAccess

ED[31:0]

EA[21:2]

/CE[3:0]

/BE[3:0]

''C6201/

''C6701

EXTERNAL

MEMORY

INTERFACE

(EMIF)

CLKOUT1

CLKOUT2

SBSRAMInterface

BusHold

Interface

/SSADS

/SSOE

/SSWE

SSCLK

/HOLD

/HOLDA

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface7

Figure5.’C6202EMIFSBSRAMInterfaceBlockDiagram

Sharedbyall

externalinterfaces

Internalperipheralbusinterface

DMAinterface

DataAccess

ProgramAccess

ED[31:0]

EA[21:2]

/CE[3:0]

/BE[3:0]

''C6202

EXTERNAL

MEMORY

INTERFACE

(EMIF)

CLKOUT1

CLKOUT2

SBSRAMInterface

BusHold

Interface

#SDCAS/#SSADS

#SDRAS/#SSOE

#SDWE/#SSWE

/HOLD

/HOLDA

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface8

Figure6.’C6211/’C6711EMIFSBSRAMInterfaceBlockDiagram

#AWE/#SDWE/#SSWE

#ARE/#SDCAS/#SSADS

Sharedbyall

externalinterfaces

EnhancedDatamemorycontroller

ED[31:0]

EA[21:2]

/CE[3:0]

/BE[3:0]

''C6211/

''C6711

EXTERNAL

MEMORY

INTERFACE

(EMIF)

CLKOUT1

CLKOUT2

SBSRAMInterface

BusHold

Interface

#AOE/#SDRAS/#SSOE

/HOLD

/HOLDA

ECLKIN

ECLKOUT

BUSREQ

Internalperipheralbusinterface

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface9

Table1.EMIFSBSRAMPins

SBSRAM

Signal

‘C6201/

’C6701

Interface

‘C6202

Signal

Interface

‘C6211/

’C6711

Interface

SBSRAMFunction

/CE/CEx/CEx/CExChipEnable./CEmustbeactive(low)fora

commandtobeclockedintotheSBSRAM.

CLKSSCLKCLKOUT2ECLKOUTSBSRAMClock.Runsateither1xor1/2xthe

CPUrate.

/ADSC/SSADS#SDCAS/

#SSADS

#ARE/

#SDCAS/

#SSADS

SynchronousAddressStrobe:Causesanew

externaladdresstoberegistered.If/CEis

active,aREADorWRITEisperformed.

/OE/SSOE#SDRAS/

#SSOE

#AOE/

#SDRAS/

#SSOE

OutputEnable.EnablesthedataI/Odrivers.

/BWE/SSWE#SSWE/

#SSWE

#AWE/

#SSWE/

#SSWE

WriteEnable.Permitswriteoperations.

/BW[4:1]/BE[3:0]/BE[3:0]/BE[3:0]ByteWriteEnables.Allowindividualbytesto

bewrittenwhen/BWEisactive.AByteWrite

EnableisLOWforaWRITEandDON’T

CAREforaREADcycle./BW1controlsByte

1,/BW2controlsByte2,/BW3controlsByte

3,and/BW4controlsByte4.

A[N:0]EA[N+2:2]EA[N+2:2]EA[N+2:2]AddressInputs.Registeredonrisingedgeof

SSCLK..

DQ[32:1]ED[31:0]ED[31:0]ED[31:0]DataI/O.Byte1isDQ[8:1],Byte2is

DQ[16:9],Byte3isDQ[24:17],andByte4is

DQ[32:25].

/ADV3.3V3.3VGND‘C6201/’C6701/’C6202:/ADVistiedto3.3Vto

disabletheburstmodeoftheSBSRAM

becauseburstingisaccomplishedbyissuing

back-to-backreadsorwrites.

‘C6211/’C6711:/ADVistiedtoGNDtoenable

theburstmodeoftheSBSRAM.

/CE2GNDGNDGNDEnable/CE2atalltimes.

MODEGNDGNDGNDSelectlinearburst.

ZZGNDGNDGNDDisablesnoozemode.

VSSGNDGNDGNDGround

VCC3.3V3.3V3.3V3.3Vsupply

CE23.3V3.3V3.3VEnableCE2atalltimes.

/ADSP3.3V3.3V3.3VDisable/ADSPatalltimes.

/GW3.3V3.3V3.3VDisableglobalwriteatalltimes.

Parity

Data

1kG57to

GND

1kG57to

GND

1kG57to

GND

TerminateParitydatabecauseitisnotused

on‘C6000interfaces.

Note:Boldtextrepresentsadeparturefromthestyleofinterfaceusedforthe''6201.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface10

Clockingthe’C6211/’C6711EMIF

TheEMIFofthe‘C6211/’C6711requiresanexternalclocktobeprovidedviatheECLKIN

input.Forsimplicity,CLKOUT2canberoutedintotheECLKINpintoavoidtheextra

hardwarerequiredtocreateaclockexternally.Thismethodhastherestrictionofonly

allowingamemoryinterfaceat1/2xtheCPUclockspeed(or75MHzfora150-MHz

device).

Ifanexternalclockisprovided,theEMIFcanoperateupto100MHz.The‘C6211and

’C6711datasheetsspecifythattherise/falltimeoftheexternallyprovidedclockmustbe

nolongerthan3ns.Thiscanprovedifficultwithmostoff-the-shelfoscillators.Our

recommendedapproachistousetheICS501PLLMultiplierchip,whichcanproducea

widerangeoffrequencyoutputswithstandardcrystals.

Clock-to-OutputRelationshipon’C6000Devices

Tooptimizethesynchronousmemoryinterfacesofthevarious‘C6000devices,the

outputsignalsaretriggeredoffofdifferentinternalclocksofthe‘C6000DSP.Figure7

throughFigure10showtheclockrelationshipusedforthevarious‘C6000DSPs.

Becausethe‘C6211/’C6711SBSRAMinterfaceistimedinreferencetoanexternally

providedclock,the‘C6211and‘C6711datasheetsprovidetdmaxandtdminbutnot

TosuandTohparameters.ThefactthattheTosuandTohparametersuseafactorofP

intheequationsallowstheusertobeunconcernedabouttheoutputedgebeingused

internaltothe‘C6000.Inthisway,theTosuparametercanbecompareddirectlyagainst

theTisuparameterofthememoryatagivenoperatingspeed.(Formoredetails,seethe

TimingConstraintssection.)

Thetdmaxandtdminparametersreferencetheactualclockedgeofthe‘C6000from

whichdataisdrivenout.TheTosuandTohtermsarethenotationusedin‘C6000data

sheetsexceptthoseforthe‘C6211and‘C6711.TheTosutermshowsthesetuptimeto

therisingedgeoftheclock.TheTohtermshowstheholdtimefromtherisingedgeofthe

memoryclock.PreferstotheCPUclockperiod.

Noticethatthedatasheetnotationdirectlyimpliestheclockingrelationshipofthedevice.

Forexample,thedatasheetforthefullspeed‘C6201BSBSRAMinterfacestatesthat

Tosu=0.5P–1.3.ReferringtothediagraminFigure7,itcanbeseenthattdmaxis

relativetothefallingedgeofSDCLK,providingasetuptimeof0.5P–tdmax.Allother

‘C6000datasheetscanbeanalyzedinthesameway.

Figure7.FullSpeedInterface—’C6201rev2.1vs.’C6201B/’C6701

Toh=0.5P+Tdmin

tdmin

Tosu=0.5P-tdmax

tdmax

Toh=tdmin

tdmin

Tosu=P-tdmax

tdmax

PP

SSCLK(1x)

''C6201rev2.x

''C6201B/''C6701

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface11

Figure8.HalfSpeedInterface—’C6201rev2.1vs.’C6201B/’C6701

Toh=0.5P+Tdmin

tdmin

Tosu=1.5P-tdmax

tdmax

Toh=P+tdmin

tdmin

Tosu=P-tdmax

tdmax

PPP

1/2P

P

1/2P

SSCLK(1/2x)

''C6201rev2.1

''C6201B/''C6701

Figure9.HalfSpeedInterface—’C6202

Toh=tdmin

tdmin

Tosu=2P-tdmax

tdmax

PPPP

CLKOUT2

''C6202

Figure10showstheclockrelationshipusedforthe‘C6211/’C6711SBSRAMinterface.

Becausethisinterfaceistimedinreferencetoanexternallyprovidedclock,the‘C6211

and‘C6711datasheetsprovideTdmaxandTdminbutnotTosuandTohparameters.

Figure10.ExternalClockInterface—’C6211/’C6711

tdmintdmax

EE

ECLKOUT

''C6211/''C6711

ByteLaneAlignmentonthe’C6211/’C6711EMIF

The‘C6711EMIFoffersthecapabilitytointerfaceto32-bit,16-bit,and8-bitSBSRAM.

Dependingontheendiannessofthesystem,adifferentbytelaneisusedforthe

SBSRAMinterface.ThealignmentrequiredisshowninFigure11.

NotethatBE3alwayscorrespondstoED[31:24],BE2alwayscorrespondstoED[23:16],

BE1alwayscorrespondstoED[15:8],andBE0alwayscorrespondstoED[7:0],

regardlessofendianness.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface12

Figure11.ByteLaneAlignmentvs.Endiannessonthe’C6211/’C6711

''C6211/''C6711

ED[31:24]ED[23:16]ED[15:8]ED[7:0]

8BitDevice

BigEndian

8BitDevice

LittleEndian

16BitDevice

BigEndian

16BitDevice

LittleEndian

32BitDevice

EMIFRegisters

ControloftheEMIFandthememoryinterfacesitsupportsismaintainedthroughasetof

memory-mappedregisterswithintheEMIF.AwritetoanyEMIFregistershouldnotbe

donewhileEMIFaccessesareinprogress.Thememory-mappedregistersareshownin

Table2.

Table2.EMIFMemory-MappedRegistersforSBSRAM

ByteAddressName

0x01800000EMIFGlobalControl

0x01800004EMIFCE1SpaceControl

0x01800008EMIFCE0SpaceControl

0x0180000CReserved

0x01800010EMIFCE2SpaceControl

0x01800014EMIFCE3SpaceControl

EMIFGlobalControlRegister

Figure12showstheEMIFglobalcontrolregister,whichconfiguresparameterscommon

toalloftheCEspaces.Table3onlyliststhoseparametersthatarerelevantforusewith

SBSRAM.

1



1

ForadescriptionofalloftheparametersoftheEMIFglobalcontrolregister,seetheTMS320C6000

PeripheralsReferenceGuide.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface13

Figure12.EMIFGlobalControlRegisterDiagram

3114131211109876543210

reservedReservedBUS

REQ

2

ARDYHOLDHOLDANOHOLDSDCEN

3

SSCEN

3

CLK1ENCLK2EN

4

SSCRT

34

RBTR8

3

MAP

3

R,+0R,+1R,+0R,+xR,+xR,+0RW,+0RW,+1RW,+1RW,+1RW,+1RW,+0RW,+0R,+x

Table3.EMIFGlobalControlRegisterBitFieldDescriptionforSBSRAM

FieldDescription

SSCENSBSRAMclockenable(for‘C6201,‘C6701,and‘C6202)

‘C6201/’C6701:

SSCEN=0,SSCLKheldhigh

SSCEN=1,SSCLKenabledtoclock

‘C6201/’C6701:

SSCEN=0,CLKOUT2heldhighifMemType=SBSRAM

SSCEN=0,CLKOUT2enabledtoclockif

MemType=SBSRAM

SSCRTSBSRAMclockrateselect(‘C6201/’C6701only)

SSCRT=0,SSCLK?xCPUclockrate

SSCRT=1,SSCLK1xCPUclockrate

CESpaceControlRegisters

Figure13andFigure14showthefourCEspacecontrolregisters,whichcorrespondto

thefourCEspacessupportedbytheEMIF.TheMTYPEfieldidentifiesthememorytype

forthecorrespondingCEspace.IfMTYPEselectsSDRAMorSBSRAM,theremaining

fieldsintheregisterdonotapply.Ifanasynchronoustypeisselected(ROMor

Asynchronous),theremainingfieldsspecifytheshapingoftheaddressandcontrol

signalsforaccesstothatspace.TheonlyfieldofinterestforSBSRAMistheMTYPE

field.ModificationofaCEspacecontrolregistershouldnotbedoneuntilthatCEspace

isinactive.

Figure13.’C6201/’C6202/’C6701EMIFCESpaceControlRegisterDiagram

3128272221201916

WRITESETUPWRITESTROBEWRITEHOLDREADSETUP

RW,+1111RW,+111111RW,+11RW,+1111

15141387643210

TAREADSTROBERsvMTYPEReservedREADHOLD

RW,+11RW,+111111R,+0RW,+010R,+0RW,+11



2

FieldexistsonlyinTMS320C6211/TMS320C6711.

3

FieldsdonotexistinTMS320C6211/TMS320C6711.

4

FieldsdonotexistinTMS320C6202.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface14

Figure14.’C6211/’C6711EMIFCESpaceControlRegisterDiagram

3128272221201916

WRITESETUPWRITESTROBEWRITEHOLDREADSETUP

RW,+1111RW,+111111RW,+11RW,+1111

1514138743210

TAREADSTROBEMTYPEWriteHold

MSB

READHOLD

RW,+11RW,+111111RW,+010RW,+0RW,+011

Table4.EMIFCESpaceControlRegisterBitFieldDescriptionforSBSRAM

FieldDescription

MTypeMemoryType

Alldevices:

MTYPE=100b:32-bit-wideSBSRAM

‘C6211/’C6711only:

MTYPE=1010b:8-bit-wideSBSRAM

MTYPE=1011b:16-bit-wideSBSRAM

SSCRTSBSRAMclockrateselect

‘C6201/’C6701only:

SSCRT=0,SSCLK?xCPUclockrate

SSCRT=1,SSCLK1xCPUclockrate

SBSRAMOperations

ThestyleofSBSRAMoperationsdependsonwhetherornotburstingisdonebydefault.

Onthe‘C6201,‘C6701,and‘C6202,theburstmodeoftheSBSRAMisnotused(/ADVis

disabledbytyingithigh).Instead,burstingisaccomplishedbyissuinganewcommand

oneveryclockcycle.

Onthe‘C6211and‘C6711,theburstmodeoftheSBSRAMisused.Whenacommandis

issued,asequentialburstoffourwordsisperformedto/fromtheSBSRAM(/ADVis

enabledbytyinglow).

Non-Burst-ModeAccessesby’C6201,’C6701,and’C6202

Forthe‘C6201,‘C6202,and‘C6701interfacetoSBSRAM,theburstmodeofthe

SBSRAMmustbedisabled.Thereisnoassociatedperformancedegradationbecause

burstscanstillbedone.Burstsareaccomplishedbyissuingcommandsonconsecutive

cyclesandcanachieveapeakthroughputequaltotheclockspeedoftheinterface.

Figure15showsafour-wordwritetoSBSRAM.Everyaccessstrobesanewaddress

intotheSBSRAM.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface15

Figure15.SBSRAMWrite—HalfSpeed

BE1BE2BE3BE4

A1A2A3A4

D1D2D3D4

Write/D4Latched

Write/D3Latched

Write/D2Latched

Write/D1Latched

CLK

/CEx

/BE[3:0]

EA[21:2]

ED[31:0]

/SSADS

/SSOE

/SSWE

Figure16showsafour-wordreadofanSBSRAM.Everyaccessstrobesanewaddress

intotheSBSRAM,indicatedbythe/SSADSstrobelow.Thefirstaccessrequiresan

initialreadlatencyof2cycles;thereafter,allaccesseshavesinglecyclethroughput.

Figure16.SBSRAMRead—HalfSpeed

BE1BE2BE3BE4

A1A2A3A4

Q1Q2Q3Q4

Q4Latched

Q3Latched

Read/Q2Latched

Read/Q1LatchedReadRead

CLK

/CEx

/BE[3:0]

EA[21:2]

ED[31:0]

/SSADS

/SSOE

/SSWE

Burst-ModeAccessesby’C6211and’C6711

The‘C6211and‘C6711takeadvantageoftheinternalburstcounterofSBSRAMswhen

performingaccesses(/ADVisalwaysactive,tiedlow).Althoughaperformance

advantageisnotrealizedbecauseburstscantakeplacebyissuingconsecutive

commands,thisinterfacedoesoffertheadvantageofissuingfewercommandstothe

SBSRAM.Thisresultsinslightlylowerpowerconsumptioncomparedtotheother

‘C6000devices.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface16

TheinternalburstcounterofSBSRAMisafour-wordcounter,whichcanbeprogrammed

toincrementlinearlyorinaninterleavedfashion.Table5showstheaddressingofthe

SBSRAMinlinearmode,whichmustbeusedforthe‘C6211/’C6711interface.AsTable

5shows,the2-bitcounterautomaticallyrollsoverto00from11.Forexample,ifaddress

0111bwereissuedtotheSBSRAMinburstmode,thesubsequentaccesswouldbeto

0100b,iftheSBSRAMwereallowedtocontinuetheburst.Accessesdonebythe

‘C6211/’C6711preventthisbyissuinganewcommandtotheSBSRAMbeforetheburst

counterrollsover.So,ifanaccessto0111bisbegun,onthesubsequentcyclethe

‘C6211/’C6711willissueaddress1000btocontinuethelinearburst.

Randomordecrementingaccessescanstillbeperformedbythe‘C6211and‘C6711.

Thisisdoneinthesamemannerasthe‘C6201styleinterface.Thatis,ifrandom

accessesareperformed,anewcommandwillbeissuedoneverycycletointerruptthe

burstmodeoftheSBSRAM.

Table5.SBSRAMBurstCounter

Case1Case2Case3Case4

SBSRAMAddressA[1:0]A[1:0]A[1:0]A[1:0]

EMIFAddressEA[3:2]EA[3:2]EA[3:2]EA[3:2]

Firstaddress00011011

01101100

10110001

FourthAddress11000110

Figure17showsasix-wordwriteburstthatbeginsataddress0100b.Sincethetwo

LSBs(least-significantbits)are00,the‘C6211/’C6711allowstheinternalburstcounterto

incrementupto0111b.Onthefifthcycle,anewcommandisissuedtoaddress1000bto

continuetheburst.

Figure17.SBSRAMWriteBurstbythe’C6211/’C6711

BE1BE2BE3BE4

EA[5:2]=0100EA[5:2]=1000

D1D2D3D4D5D6

Deselect

D6Latched

Write/D5Latched

D4Latched

D3Latched

D2Latched

Write/D1Latched

ECLKOUT

/CEx

/BE[3:0]

EA[21:2]

ED[31:0]

/SSADS

/SSOE

/SSWE

Figure18showsasix-wordreadburstthatbeginsataddress010b.Becausethetwo

LSBsare10b,the‘C6211/’C6711allowstheinternalburstcountertoincrementupto

011b.Onthethirdcycle,anewcommandisissuedtoaddress100btocontinuethe

linearburst.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface17

Figure18.SBSRAMReadBurstbythe’C6211/’C6711

BE1BE2BE3BE4BE5BE6

EA[4:2]=010bEA[4:2]=100

Q1Q2Q3Q4Q5Q6

Deselect/Q6La

Q5Latched

Q4Latched

Q3Latched

Q2Latched

Read/Q1Latched

Read

ECLKOUT

/CEx

/BE[3:0]

EA[21:2]

ED[31:0]

/SSADS

/SSOE

/SSWE

OptimizingSBSRAMAccesses

SBSRAMsarelatentbytheirarchitecture,meaningthatreaddatafollowsaddressand

controlinformation.Consequently,theEMIFinsertscyclesbetweenreadandwrite

commandstoensurethatnoconflictexistsontheED[31:0]bus.TheEMIFkeepsthis

turnaroundpenaltytoaminimum.Theinitial3-cyclepenaltyispresentwhenchanging

directionsonthebus.

Ingeneral,theruleisthatthefirstaccessofaburstsequencewillincuratleasta3-cycle

startuppenalty.Therefore,tomaximizethroughput,attempttominimizedirection

changesonthedatabuswhenaccessingSBSRAM.

TimingConstraints

ThissectiondiscussesthetimingconstraintsusedtodetermineifanSBSRAMcan

operatewiththe‘C6000atagivenclockfrequency.

Forthefollowingconstraintcalculations,atimet

margin

iscalculatedrepresentingthe

margininthesystemaftertakingintoaccounttheworst-casenumbersfromthememory

andthe‘C6000datasheets.

Aftercalculatingthetimet

margin

,itisasystem-levelissuetodetermineiftheproper

amountofmarginhasbeenmet.Therequiredtimingmarginisextremelysystem

dependent,dependingprimarilyontracelengthandloading,butotherfactorscancome

intoplay.Therefore,thisparametershouldbedeterminedfortheparticularsystemin

question.

Ingeneral,thetimingmarginrequiredisnotthesameforthedifferentparametersofthe

read/writecycles.Foroutputsignals,therequiredtimingmarginisminimalbecausethe

outputclockandoutputcontrol/datasignalsbothpropagatefromthe‘C6000DSPtothe

SBSRAM.Therefore,thetimingmarginmustaccountforthepossibleskewbetweenthe

twosignals(clockversuscontrol/data)causedbyloadingeffectsordifferencesinroute

length.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface18

Forexample,signalsonaboardmanufacturedwith0.5-ouncecoppertracesinFR4

exhibitapropagationdelaytimeof~0.17nsperinch.Iftheskewbetweenclockand

outputsignalsis±3inches,therequiredboardmarginis~0.5nsforbothoutputsetup

andhold.Thisdoesnotconsidersettlingtimeeffectsorotherloadingissuesthatshould

beconsideredwhendeterminingtheamountofmarginrequired.

Thetimingmarginrequiredforreadsismorecomplicated.Theissuewithreadsisthat

thememoryisoutputtingdatarelativetoaclockthathasundergoneapropagationdelay

whentravelingfromthe‘C6000DSPtotheSBSRAM.Thememoryoutputsthedataa

timet

acc

fromthisdelayedclock.Theoutputdatafromthememoryundergoesadelay

itselfbeforearrivingatthe‘C6000DSP.Therefore,thetimingmarginforreadsetupmust

accountforthesetwopropagationdelays.Thereadholdtimeisimprovedbecauseof

thisandthemarginrequiredcanbeconsiderednegligible.

Usingthesameboardcharacteristicspreviouslyused,thisimpliesthatifboththeclock

anddatapathsareapproximately3incheslong,theroundtrippropagationdelayfor

clocktoSBSRAMandfordatabacktothe‘C6000isapproximately1ns(6inchesGB4170

ps/inch).Therefore,themarginrequiredforreadsinthisexampleisatleast1nsonthe

inputsetuptimeand<0nsontheinputholdtime.Thisdoesnotconsidersettlingtime

effectsorotherloadingissuesthatshouldbeconsideredwhendeterminingtheamountof

marginrequired.

Thesenumbersareguidelines.Theactualmarginrequiredforanysystemmightbe

different.

Inthefollowingdiscussion,misusedtodenotethememoryspecifications.Noadditional

designatorsareusedtodenotethe‘C6000DSPtimingspecifications.

TMS320C6000Outputs(ED,EA,CE,BE,SSADS,SSOE,SSWE)

’C6201/’C6701/’C6202OutputComparison

Forsimplicity,the‘C6201,‘C6701,and‘C6202datasheetsspecifytheoutputsasasetup

time(tosu)tothenextrisingedgeandaholdtime(toh)fromthepreviousrisingedge.

Thus,thecomparisonbetween‘C6000specificationsandmemoryspecificationsis

extremelystraightforward.Thisalsoallowstheusertobeunconcernedwithwhichclock

edgetriggersoutputdata.

Thefollowingequations,derivedfromFigure19,shouldbeusedtocalculatethetiming

marginbetweenthe‘C6000andthedesiredSBSRAM.

G72Setuptime:Outputsetuptime(t

osu

)frominactivetoactivemustprovideanample

setuptime(t

isu(m)

)fortheinput.Therefore,themarginavailableis:

t

margin

=t

osu

–t

isu(m)

G72Holdtime:Outputholdtime(t

oh

)fromactivetoinactivemustbegreaterthanthehold

timerequiredbytheinput(t

ih(m)

).Themarginisthen:

t

margin

=t

oh

–t

ih(m)

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface19

Figure19.OutputsFrom’C6000(WriteData[ED],Control,andAddressSignals)

SBSRAMLatchesSignal

toh

tih(m)tisu(m)

tosu

TcycTcyc

EMIFClock

''C6000Output

’C6211/’C6711OutputComparison

The‘C6211and‘C6711datasheetsspecifytheoutputsasaminimumdelayanda

maximumdelayfromtherisingedgeofECLKOUT.Whencomparingtheseparameters

againstthespecificationforaparticularSBSRAM,themaximumdelay(t

dmax

)isusedto

verifythattheinputsetuptime(t

is(m)

)ofthememoryismet.Theminimumdelay(t

dmin

)is

usedtoverifythattheinputholdtime(t

ih(m)

)ofthememoryismet.

Thefollowingequations,derivedfromFigure20,shouldbeusedtocalculatethetiming

marginbetweenthe‘C6211/’C6711andthedesiredSBSRAM.

G72Setuptime:Themaximumdelay(t

dmax

)fromclocktooutputsignalvalidmustprovide

anamplesetuptime(t

isu(m)

)fortheinput.Therefore,themarginavailableis:

t

margin

=t

cyc

–(t

dmax

+t

isu(m)

)

G72Holdtime:Theminimumdelay(t

dmin

)fromclocktooutputsignalinvalidmustbe

greaterthantheholdtimerequiredbytheinput(t

ih(m)

).Themarginisthen:

t

margin

=t

oh

–t

ih(m)

Figure20.OutputsFrom’C6000(WriteData[ED],Control,andAddressSignals)

SBSRAMLatchesData

tdmin

tih(m)

tisu(m)

tdmax

TcycTcyc

EMIFClock

''C6000Outputs

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface20

’C6000Inputs(OutputDataFromtheSBSRAM,ReadED)

Figure21showstheoutputdatafromtheSBSRAMasitoccursduringareadcycle.The

situationissimilartotheoutputsfromthe‘C6000exceptthattheSBSRAMmustprovide

anamplesetupandinputholdtothe‘C6000.

Theconstraintscanbeexpressedasfollows:

G72Setuptimes:Theaccesstime(t

acc(m)

)oftheSBSRAMmustprovidealargeenough

inputsetuptime(t

su

)fortheinputtothe‘C6000.

t

margin

=t

cyc

–(t

acc(m)

+t

su

)

G72Holdtimes:theoutputholdtime(t

oh(m)

)fordataoutputfromtheSBSRAM,must

provideaholdtimegreaterthantheholdtimerequiredbytheinput(t

ih

)ofthe‘C6000.

t

margin

=t

oh(m)

–t

ih

Figure21.Inputto‘C6000(ReadData)

''C6xLatchesData

toh(m)

tihtsu

tacc(m)

TcycTcyc

EMIFClock

ReadData

TimingComparisonsforThreeSBSRAMs

ThissectionsummarizesthecomparisonslistedaboveforthreedifferentSBSRAMswith

threedifferent‘C6000devices.Althoughnotevery‘C6000deviceisshowninthe

followingexamples,theapproachisthesameforallofthecurrent‘C6000devices.

Forthefollowingexamples,noticethatmoremarginisachievedwithafastermemory.

Forexample,ifa100-MHzinterfaceisdesired,a133-MHzSBSRAMwillprovidemore

marginthana100-MHzSBSRAM.Althoughthe‘C6000DSPsaredesignedtooperate

withSBSRAMsattheratedspeeds,sometimestheextramarginmaybeworththeextra

costoffastermemories.SeveralvendorshaveSBSRAMdevicesavailableat100MHz

orfaster.Thenewestdatasheetsandshouldbecomparedtothe‘C6000datasheetto

guaranteeoperationwiththedesiredmargins.

’C6201Bvs.Micron’sMT58L128L32P-7.5at100MHz

TheMT58L128L32Pdeviceisa128Kx32device,whichresultsinanaddressablespace

of512KB.

Thisexampleusesthe‘C6201B-200runningatitsmaximumclockspeedof200MHz(P

=5).Forthisexample,weassumethatSSCLKissettooperateat1/2xtheCPUspeed,

resultinginTcyc=10ns.

ThetimingparametersoftheMT58L128L32P-7.5andthe‘C6201B-200canbe

summarizedasfollows:

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface21

‘C6201B-200@P=5nsMT58L128L32P-7.5Tmargin

Tosu=1.5P–3=4.5nsTisu(m)=1.5nsTosu–Tisu(m)=3nsG61

Outputs

Toh=0.5P–1.5=1ns

Inputs

Tih(m)=0.5nsToh–Tih(m)=0.5nsG61

Tisu=2.5Tacc(m)=4.2nsTcyc–Tacc(m)–tisu=3.3nsG61

Inputs

Tih=1.5

Outputs

Toh(m)=1.5nsToh–Tih(m)=0nsG61

’C6202vs.Micron’sMT58L512L18D-7.5at125MHz

TheMT58L512L18Disa512Kx18device.Forthe‘C6202interface,twoofthese

devicesareusedinparallel,resultinginanaddressablespaceof2MB.

Thisexampleusesthe‘C6202-250runningatitsmaximumclockspeedof250MHz(P=

4ns).Becausethe‘C6202EMIFusesCLKOUT2(whichis1/2xtheCPUspeed)for

synchronousmemoryinterfaces,Tcyc=8ns.

ThetimingparametersoftheMT58L512L18D-7.5andthe‘C6202-250canbe

summarizedasfollows:

‘C6202-250@P=4nsMT58L512L18P-7.5Tmargin

Tosu=2P–3.8=4.2nsTisu(m)=1.5nsTosu–Tisu(m)=2.7nsG61

Outputs

Toh=1ns

Inputs

Tih(m)=0.5nsToh–Tih(m)=0.5nsG61

Tisu=2Tacc(m)=4.0nsTcyc–Tacc(m)–tisu=2nsG61

Inputs

Tih=1.5

Outputs

Toh(m)=1.5nsToh–Tih(m)=0nsG61

’C6711vs.Micron’sMT58LC64K32D9-10at100MHz

TheMT58LC64K32D9isa64Kx32device,whichresultsinanaddressablespaceof

256KB.

Thisexampleusesthe‘C6711-150runningatitsmaximumclockspeedof150MHz

(P=6.67ns).BecausetheCPUspeedisindependentoftheEMIFclockspeed,weuse

anexternallyprovidedclockof100MHzforthesynchronousmemoryinterface,resulting

inTcyc=10ns.

ThetimingparametersoftheMT58LC64K32D9-10andthe‘C6711-150canbe

summarizedasfollows:

‘C6711-150MT58LC64K32D9-10Tmargin

Tdmax=6.0nsTisu(m)=2.2nsTcyc–Tdmax–Tisu(m)=1.8nsG61

Outputs

Tdmin=1.5ns

Inputs

Tih(m)=0.5nsToh–Tih(m)=1.0nsG61

Tisu=1.5Tacc(m)=5.0nsTcyc–Tacc(m)–tisu=3.5nsG61

Inputs

Tih=1.0

Outputs

Toh(m)=1.5nsToh–Tih(m)=0.5nsG61

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface22

CompleteExampleUsing’C6201B

Thissectionwalksthroughtheregisterconfigurationforinterfacingthe‘C6201Bwith

SBSRAMathalfspeed.BecausenoSBSRAMparametersdirectlytietheEMIFsettings

toaspecificSBSRAM,thissoftwareexampleisgenerictoanySBSRAMdevice.

Ifasingle32-or36-bit-wideSBSRAMisused,theblockdiagramfortheinterface

schematicisidenticaltothatshowninFigure1.Iftwo18-bit-widedevicesareusedin

parallel,theschematicisidenticaltoFigure2.

Assumptions

G72CLKOUT1frequencyof200MHz

G72100-MHzSBSRAMclockfrequency

(SSCLK=?xCLKOUT1frequency)

G72SBSRAMtobelocatedatCE2(logicaladdress0x02000000)

G72CLKOUT1isnotusedinthesystem.

G72SDCLK,CLKOUT2isusedinthesystems.

RegisterConfiguration

Table6.SDRAMRegisters

RegisterNameFieldsRequired

EMIFGlobalControlSDCEN,SSCEN,CLK1EN,CLK2EN,

SSCRT

EMIFCE2SpaceControlMTYPE

EMIFGlobalControlRegisters

BecausetheSBSRAMisdrivenbySSCLK,wemustsetthefollowing:

Figure22.EMIFGlobalControlRegisterDiagram

311413121109876543210

ReservedReservedRsv/ARDY/HOLD/HOLDANOHOLDSDCENSSCENCLK1ENCLK2ENSSCRTRBTR8MAP

011001101101001

SDCEN=1indicatesthatSDCLKisenabledtoclock,assumingitisinusebythe

system

SSCEN=1IndicatesthatSSCLKisenabledbecauseitdrivestheSBSRAMinterface

CLK1EN=0IndicatesthatCLKOUT1isdisabled,assumingitisNOTinusebythe

system

CLK2EN=1IndicatesthatCLKOUT2isenabled,assumingitisinusebythesystem

SSCRT=0Specifiesahalf-rateSBSRAMInterface

Thus,avalidsettingfortheEMIFglobalcontrolregisteris0x00003369.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface23

Foradditionalinformationontheremainderofthefields,seetheTITMS320C6000

PeripheralsReferenceGuide.

EMIFCE2SpaceControlRegister

Figure23.EMIFCE2SpaceControlRegisterDiagram

3128272221201916

WRITESETUPWRITESTROBEWRITEHOLDREADSETUP

1111111111111111

15141387643210

RsvREADSTROBERsvMTYPEReservedREADHOLD

1111111101000011

MTYPE=100indicatesthat32-bit-wideSBSRAMislocatedintheCE2addressspace.

TheotherfieldsareirrelevantbecausetheyrefertoasynchronousmemoryandSBSRAM

isconfiguredforthisspace.

AvalidsettingforEMIFCE2SpaceControlis0xFFFFFF43.

CodeSegment

ThefollowingcodesegmentsetsuptheEMIFasdescribedaboveusingthe

TMS320C6000PeripheralRuntimeSupportControlLibrary.

#include

.

./OTHERUSERCODE/

.

/GetdefaultvaluesforallEMIFregisters/

unsignedintg_ctrl=GET_REG(EMIF_GCTRL);

unsignedintce0_ctrl=GET_REG(EMIF_CE0_CTRL);

unsignedintce1_ctrl=GET_REG(EMIF_CE1_CTRL);

unsignedintce2_ctrl=GET_REG(EMIF_CE2_CTRL);

unsignedintce3_ctrl=GET_REG(EMIF_CE3_CTRL);

unsignedintsdram_ctrl=GET_REG(EMIF_SDRAM_CTRL);

unsignedintsdram_ref=GET_REG(EMIF_SDRAM_REF);

/SetGlobalControl-EnableCLKOUT2,SDCLK,andSSCLK/

/-DisableCLKOUT1/

/-Setfor?xSBSRAMinterface/

RESET_BIT(&g_ctrl,SSCRT);

SET_BIT(&g_ctrl,CLK2EN);

RESET_BIT(&g_ctrl,CLK1EN);

SET_BIT(&g_ctrl,SSCEN);

SET_BIT(&g_ctrl,SDCEN);

/ConfigureCE2asSBSRAM/

LOAD_FIELD(&ce2_ctrl,MTYPE_32SBSRAM,MTYPE,MTYPE_SZ);

/StoreEMIFControlRegisters/

emif_init(g_ctrl,ce0_ctrl,ce1_ctrl,ce2_ctrl,ce3_ctrl,

sdram_ctrl,sdram_ref);

.

./OTHERUSERCODE/

.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface24

References

TMS320C6201/6201BDigitalSignalProcessorsDataSheet,LiteratureNumber

SPRS051,TexasInstruments.

TMS320C6202Fixed-PointDigitalSignalProcessorDataSheet,LiteratureNumber

SPRS072,TexasInstruments.

TMS320C6211Fixed-PointDigitalSignalProcessorDataSheet,LiteratureNumber

SPRS073,TexasInstruments.

TMS320C6701Floating-PointDigitalSignalProcessorDataSheet,LiteratureNumber

SPRS067,TexasInstruments.

TMS320C6711Floating-PointDigitalSignalProcessorDataSheet,LiteratureNumber

SPRS088,TexasInstruments.

TMS320C6000PeripheralsReferenceGuide,LiteraturenumberSPRU190,Texas

Instruments.

TMS320C6000PeripheralSupportLibraryProgrammersReference,Literaturenumber

SPRU273,TexasInstruments.

MT58L128L32PDataSheet,MicronTechnology,Inc.

MT58L512L18DDataSheet,MicronTechnology,Inc.

MT58LC64K32D9DataSheet,MicronTechnology,Inc.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface25

TIContactNumbers

INTERNET

TISemiconductorHomePage

www.ti.com/sc

TIDistributors

www.ti.com/sc/docs/distmenu.htm

PRODUCTINFORMATIONCENTERS

Americas

Phone+1(972)644-5580

Fax+1(972)480-7800

Emailsc-infomaster@ti.com

Europe,MiddleEast,andAfrica

Phone

Deutsch+49-(0)8161803311

English+44-(0)1604663399

Espa?ol+34-(0)902354028

Francais+33-(0)1-30701164

Italiano+33-(0)1-30701167

Fax+44-(0)1604663334

Emailepic@ti.com

Japan

Phone

International+81-3-3457-0972

Domestic0120-81-0026

Fax

International+81-3-3457-1259

Domestic0120-81-0036

Emailpic-japan@ti.com

Asia

Phone

International+886-2-23786800

Domestic

Australia1-800-881-011

TINumber-800-800-1450

China10810

TINumber-800-800-1450

HongKong800-96-1111

TINumber-800-800-1450

India000-117

TINumber-800-800-1450

Indonesia001-801-10

TINumber-800-800-1450

Korea080-551-2804

Malaysia1-800-800-011

TINumber-800-800-1450

NewZealand000-911

TINumber-800-800-1450

Philippines105-11

TINumber-800-800-1450

Singapore800-0111-111

TINumber-800-800-1450

Taiwan080-006800

Thailand0019-991-1111

TINumber-800-800-1450

Fax886-2-2378-6808

Emailtiasia@ti.com

TIisatrademarkofTexasInstrumentsIncorporated.

Otherbrandsandnamesarethepropertyoftheirrespectiveowners.

ApplicationReport

SPRA533

TMS320C6000EMIFtoExternalSBSRAMInterface26

IMPORTANTNOTICE

TexasInstrumentsanditssubsidiaries(TI)reservetherighttomakechangestotheir

productsortodiscontinueanyproductorservicewithoutnotice,andadvisecustomersto

obtainthelatestversionofrelevantinformationtoverify,beforeplacingorders,that

informationbeingreliedoniscurrentandcomplete.Allproductsaresoldsubjecttothe

termsandconditionsofsalesuppliedatthetimeoforderacknowledgement,including

thosepertainingtowarranty,patentinfringement,andlimitationofliability.

TIwarrantsperformanceofitssemiconductorproductstothespecificationsapplicableat

thetimeofsaleinaccordancewithTI''sstandardwarranty.Testingandotherquality

controltechniquesareutilizedtotheextentTIdeemsnecessarytosupportthiswarranty.

Specifictestingofallparametersofeachdeviceisnotnecessarilyperformed,except

thosemandatedbygovernmentrequirements.

CERTAINAPPLICATIONSUSINGSEMICONDUCTORPRODUCTSMAYINVOLVE

POTENTIALRISKSOFDEATH,PERSONALINJURY,ORSEVEREPROPERTYOR

ENVIRONMENTALDAMAGE(“CRITICALAPPLICATIONS").TISEMICONDUCTOR

PRODUCTSARENOTDESIGNED,AUTHORIZED,ORWARRANTEDTOBE

SUITABLEFORUSEINLIFE-SUPPORTDEVICESORSYSTEMSOROTHER

CRITICALAPPLICATIONS.INCLUSIONOFTIPRODUCTSINSUCHAPPLICATIONS

ISUNDERSTOODTOBEFULLYATTHECUSTOMER''SRISK.

Inordertominimizerisksassociatedwiththecustomer''sapplications,adequatedesign

andoperatingsafeguardsmustbeprovidedbythecustomertominimizeinherentor

proceduralhazards.

TIassumesnoliabilityforapplicationsassistanceorcustomerproductdesign.TIdoes

notwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderany

patentright,copyright,maskworkright,orotherintellectualpropertyrightofTIcovering

orrelatingtoanycombination,machine,orprocessinwhichsuchsemiconductor

productsorservicesmightbeorareused.TI''spublicationofinformationregardingany

thirdparty''sproductsorservicesdoesnotconstituteTI''sapproval,warranty,or

endorsementthereof.

CopyrightGD31999TexasInstrumentsIncorporated

献花(0)
+1
(本文系文理绿纱首藏)