Technologicalandcostevolutionofconsumer
inertialcombosensors
RomainFraux
SystemPlusConsulting
Outline
?ComboSensorsASPEvolution/PackageFootprintEvolution
?STMicroelectronicsComboSensorsEvolution
?BoschSensortecComboSensorsEvolution
?InvenSenseComboSensorsEvolution
?9-AxisIMUManufacturingCostanalysis
6-axise-compassASP
6-axisIMUASP9-axisIMUASP
ComboSensorsASPisDecliningQuickly!
?IMUsarealreadypricedbelow$1
?Forveryhigh-volumecustomers
?Roadmapistobebelow50centsin2018!
?Pricefor6-axise-compassisalso
droppingfast
?Explosionofvolumes
?Optimizationofmanufacturingprocesses
?Pricesfor9-axisarestill?relaxed?but
pressurewillbemuchhigherwhen
volumesstart
?Average9-axistargetpriceshouldbe62
centsin2018!
Mainpathtocostreduction:componentsizeshrinking!
6-Axise-CompassPackageFootprintevolution
6-AxisIMUPackageFootprintevolution
9-AxisIMUPackageFootprintevolution
STMicroelectronics
ComboSensorsEvolution
ST6-AxisIMUEvolution–PackageFootprint
?Diesshrinking
?SensingArea
?WaferBonding
?TSV
?Packageoptimization:
?Diesstacking
?ChipScalePackagingLSM330DL(2011)33mm2
LSM330(2012)
10.5mm2
68%shrinking
ST6-AxisIMUEvolution–MEMSDieSizeShrink
C5L23A–2009
(LSM330DL)
C5L28A–2011
(LSM330DLC,LSM330D,LSM330)
C5L26A–2011
(LSM303D)
GK10A–2009
(LSM330DL)
GK12B–2010
(LSM330DLC,LSM330)
GK14A–2011
(LSM330D)
Acce
ler
ometer
Gy
roscope
ST6-AxisIMUEvolution–WaferBonding
?Glass-FritBonding
?+low-cost
?-Sealingframearearelativelylarge?Sensingarea/dieratiolow
Glass-FritSealingCrosssection(fromL3GD20HReverseCostingReport)
300μm
PbGlass-frit
MEMSCap
MEMSSensor
ST6-AxisIMUEvolution–WaferBonding
Au-AuSealingCrosssection(fromL3G4ISReverseCostingReport)
?Au-AuThermocompressionBonding
?+Sensingarea/dieratiohigh
?+Hermetic
?-moreexpensive
70μm
Gold
MEMSCap
MEMSSensor
ST6-AxisIMUEvolution–TSV
?LSM330DLC(4x5mm,2011)
?2.59mm2diearea
?0.85mm2sensingarea
AccelerometerdieOverview
(fromSTLSM330DLCReverseCostingReport)
ST6-AxisIMUEvolution–TSV
?LSM303D(3x3mm,2012)
?2.14mm2diearea
?0.85mm2sensingarea
?AreareservedforI/O
padsremoveddownto
thebacksideofthe
MEMS
17%shrinking
AccelerometerdieOverview
(fromSTLSM303DReverseCostingReport)
ST6-AxisIMUEvolution–MEMSSingleChip
?LSM9DS0(4x4mm,2013)
?Accelerometer/Gyroscope
SingleChip
?Glass-FritBonding
?30%shrinkingcomparedto
discretesolution.
3-Axis
Gyro
3-Axis
Accelero
GlassFritSeal
Accelerometer/GyroscopedieOverview
(fromSTLSM9DS0ReverseCostingReport)
ST6-AxisIMUEvolution–MEMSSingleChip
?LSM333D(4x4mm,2012)
?Accelerometer/Gyroscope
SingleChip
?Gold-Gold
Thermocompression
Bonding
3-Axis
Accelero
3-Axis
Gyro
GoldSeal
Accelerometer/GyroscopedieOverview
(fromSTLSM333DReverseCostingReport)
BoschSensortec
ComboSensorsEvolution
Bosch6-Axise-CompassEvolution
BMC050:2011
?Packagetype:16-pinLGA
?Dimensions:3mmx3mmx0.95mm
?Footprint:9mm2
BMC150:2013
?Packagetype:14-pinLGA
?Dimensions:2.2mmx2.2mmx0.95mm
?Footprint:4.8mm2
47%Shrinking
Bosch6-Axise-CompassEvolution–SensoroverCMOS
?BMC050(3x3mm,2011)
?3diesfor3-Axismagnetometer
?3.42mm2siliconarea
MagnetometerdiesOverview
(fromBoschBMC050ReverseCostingReport)
X-AxisFluxgateSensor
Y-
Ax
isFluxgat
eSenso
r
Bosch6-Axise-CompassEvolution–SensoroverCMOS
?BMC150(2.2x2.2mm,2013)
?Singlediefor3-Axismagnetometer
?SensorlayersoverCMOS
?2.34mm2siliconarea
?32%shrinking
MagnetometerdieOverview
(fromBoschBMC150ReverseCostingReport)
X-AxisFluxgateSensor
Y-
Ax
isFluxgat
eSenso
r
Bosch6-Axise-CompassEvolution–SensingArea
?BMC050(3x3mm,2011)
?3sensingstructuresfor3-Axisaccelerometer
?1.96mm2diearea
AccelerometerdieOverview
(fromBoschBMC050ReverseCostingReport)
Glass-FritSeal
X-Axis
Accelero
Z-Axis
Accelero
Y-Axis
Accelero
Bosch6-Axise-CompassEvolution–SensingArea
?BMC150(2.2x2.2mm,2013)
?Singlesensingstructuresfor3-Axisaccelerometer
?1.41mm2diearea
?28%shrinking
AccelerometerdieOverview
(fromBoschBMC150ReverseCostingReport)
28%
shrinki
ng
Glass-FritSeal
X/Y/Z-Axis
Accelero
BoschComboSensorEvolution–WaferBonding
?Glass-FritBonding
?+low-cost
?-Sealingframearearelativelylarge?Sensingarea/dieratiolow
Glass-FritSealingCrosssection
(fromBMC150ReverseCostingReport)
200μm
PbGlass-frit
MEMSCap
MEMSSensor
BoschComboSensorEvolution–WaferBonding
AlGeSealingCrosssection
(fromBMA355ReverseCostingReport)
?AluminumGermaniumEutecticBonding
?+Sensingarea/dieratiohigh
?+Hermetic
?-moreexpensive
70μm
AlGe
MEMSCap
MEMSSensor
InvenSense
ComboSensorsEvolution
InvenSense9-AxisIMUEvolution
MPU-9150:2012
?Packagetype:24-pinQFN
?Dimensions:4mmx4mmx0.9mm
?Footprint:16mm2
MPU-9250:2013
?Packagetype:24-pinQFN
?Dimensions:3mmx3mmx0.9mm
?Footprint:9mm2
44%Shrinking
InvenSense6-AxisIMUEvolution
?MPU-6000(4x4mm,2010)
?Gyroscope:
?3structuresvibratory
?Accelerometer:
?3sensingstructures
?5.9mm2
Accelerometer/GyroscopeMEMSdieOverview
(fromInvenSenseMPU-6000ReverseCostingReport)
Y-Axis
Accelero
Z-Axis
Accelero
X-AxisGyroY-AxisGyroZ-AxisGyro
X-Axis
Accelero
InvenSense6-AxisIMUEvolution
?MPU-6500(3x3mm,2012)
?Gyroscope:
?Singlestructurevibratory
?Accelerometer:
?3sensingstructures
?4.35mm2
?26%shrinking
Accelerometer/GyroscopeMEMSdieOverview
(fromInvenSenseMPU-6500ReverseCostingReport)
26%Shrinking
X-Axis
Accelero
Z-Axis
AcceleroX/Y/Z-AxisGyro
Y-Axis
Accelero
9-AxisIMUManufacturing
CostAnalysis
9-AxisIMUSupplyChainComparison
EverspinTechnologies(USA)
Source:YoleDevelopment.
StatusoftheMEMSIndustry2014
9-AxisIMUStructure&CostComparison
DiesCost
68%
DiesCost
70%DiesCost
74%
PackagingCost
17%
PackagingCost
13%
PackagingCost
12%
FinalTestandYieldLosses
15%
FinalTestandYieldLosses
17%
FinalTestandYieldLosses
14%
LSM9DS0BMX055MPU-9250
9-AXISIMUCOSTSTRUCTURECOMPARISON
LSM9DS0(4x4mm)
5dies
BMX055(3x4.5mm)
5dies
MPU-9250(3x3mm)
2dies
9-AxisIMUDesignWins
Googleglass(2013)
SamsungGearLive(2014)
MPU-9150
4x4mm
MPU-9250
3x3mm
STMicroelectronics&BoschSensortec:noknowndesignwins
6-axise-compassASP
6-axisIMUASP
9-axisIMUASP
InvenSense9-AxisManufacturingCost&ASP
$1.77
$1.31
MPU-9150
?Totalsiliconarea:11.2mm2
?Componentcost:$1.04
?YoleEstimatedASP2013:$1.77
?InvenSenseGrossmargin:41%
MPU-9250
?Totalsiliconarea:7.9mm2
?Componentcost:$0.74
?YoleEstimatedASP2014:$1.31
?InvenSenseGrossmargin:43%
BoschSensortec9-AxisCostShared
BMX055
9-AxisIMU
BMG160
3-AxisGyro
BMC150
6-Axise-Compass
BMA280
3-AxisAccelero
BMM150
3-AxisMagneto
BMI055
6-AxisIMU
6inertialsensorswitha
combinationof17dies
(MEMS+ASIC)butonly5
differentdesign!
Conclusion
?6-axiscostreductionhasbeenobtainedby:
?Shrinkofsensingstructure&singledieforAccelero/Gyrofunction
?MEMSwaferbondingprocess(fromPbglass-frittometal)
?Interconnection(diestacking,CSP,TSV)
?9-axiscostreductionwillbeobtainedvia:
?Moreofintegration(lessdies)
?CEA-LETI’sM&NEMS
Thankyou!
Customer
SpecificCatalog
CostingToolsTraining
ReverseCosting
Teardown+CostAnalysis
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