IPC-SM-840C
QualificationandPerformance
ofPermanentSolderMask
Amendment1
ASSOCIATIONCONNECTING
ELECTRONICSINDUSTRIES
2215SandersRoad,Northbrook,IL60062-6135
Tel.847.509.9700Fax847.509.9798
www.ipc.org
IPC-SM-840C
AstandarddevelopedbyIPC
Amendment1
June2000
ThePrinciplesof
Standardization
InMay1995theIPC’sTechnicalActivitiesExecutiveCommitteeadoptedPrinciplesof
StandardizationasaguidingprincipleofIPC’sstandardizationefforts.
StandardsShould:
?ShowrelationshiptoDesignforManufacturability
(DFM)andDesignfortheEnvironment(DFE)
?Minimizetimetomarket
?Containsimple(simplified)language
?Justincludespecinformation
?Focusonendproductperformance
?Includeafeedbacksystemonuseand
problemsforfutureimprovement
StandardsShouldNot:
?Inhibitinnovation
?Increasetime-to-market
?Keeppeopleout
?Increasecycletime
?Tellyouhowtomakesomething
?Containanythingthatcannot
bedefendedwithdata
NoticeIPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminating
misunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityand
improvementofproducts,andassistingthepurchaserinselectingandobtainingwithminimum
delaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublications
shallnotinanyrespectprecludeanymemberornonmemberofIPCfrommanufacturingorsell-
ingproductsnotconformingtosuchStandardsandPublication,norshalltheexistenceofsuch
StandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanIPCmembers,
whetherthestandardistobeusedeitherdomesticallyorinternationally.
RecommendedStandardsandPublicationsareadoptedbyIPCwithoutregardtowhethertheir
adoptionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,IPCdoes
notassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhateverto
partiesadoptingtheRecommendedStandardorPublication.Usersarealsowhollyresponsible
forprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringement.
IPCPosition
Statementon
Specification
RevisionChange
ItisthepositionofIPC’sTechnicalActivitiesExecutiveCommittee(TAEC)thattheuseand
implementationofIPCpublicationsisvoluntaryandispartofarelationshipenteredintoby
customerandsupplier.WhenanIPCstandard/guidelineisupdatedandanewrevisionispub-
lished,itistheopinionoftheTAECthattheuseofthenewrevisionaspartofanexisting
relationshipisnotautomaticunlessrequiredbythecontract.TheTAECrecommendstheuse
ofthelastestrevision.AdoptedOctober6.1998
Whyisthere
achargefor
thisstandard?
Yourpurchaseofthisdocumentcontributestotheongoingdevelopmentofnewandupdated
industrystandards.Standardsallowmanufacturers,customers,andsupplierstounderstandone
anotherbetter.Standardsallowmanufacturersgreaterefficiencieswhentheycansetuptheir
processestomeetindustrystandards,allowingthemtooffertheircustomerslowercosts.
IPCspendshundredsofthousandsofdollarsannuallytosupportIPC’svolunteersinthe
standardsdevelopmentprocess.Therearemanyroundsofdraftssentoutforreviewand
thecommitteesspendhundredsofhoursinreviewanddevelopment.IPC’sstaffattendsand
participatesincommitteeactivities,typesetsandcirculatesdocumentdrafts,andfollowsall
necessaryprocedurestoqualifyforANSIapproval.
IPC’smembershipdueshavebeenkeptlowinordertoallowasmanycompaniesaspossible
toparticipate.Therefore,thestandardsrevenueisnecessarytocomplementduesrevenue.The
pricescheduleoffersa50%discounttoIPCmembers.IfyourcompanybuysIPCstandards,
whynottakeadvantageofthisandthemanyotherbenefitsofIPCmembershipaswell?For
moreinformationonmembershipinIPC,pleasevisitwww.ipc.orgorcall847/790-5372.
Thankyouforyourcontinuedsupport.
?Copyright2000.IPC,Northbrook,Illinois.AllrightsreservedunderbothinternationalandPan-Americancopyrightconventions.Any
copying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedand
constitutesinfringementundertheCopyrightLawoftheUnitedStates.
QualificationandPerformanceofPermanentSolderMask
1.2Purpose
Paragraph1:
Replace:
IPC-RB-276
With:
IPC-6011andIPC-6012
Addthefollowingparagraphattheendofsection:
TelcordiaTechnologies(formerlyBellcore)acceptanceof
IPC-SM-840Cisstatedin‘‘PhysicalDesignandManufac-
tureofTelecommunicationsProducts-QualificationTest
Procedures’’-GR-78-CORE-Issue1,September1997on
page13-10,paragraph13.2.1.
13.2.1General‘‘R13-11[813]Inlieuoftherequire-
mentsinthissectionforsoldermask,testingtoIPC-SM-
840C,January1996,Class‘‘T’’requirementsshallbe
acceptable.TherequirementscontainedintheIPCdocu-
mentaresimilarorequivalenttotheonescontained
herein.’’
1.3Classes
Addthefollowingparagraphattheendofsection:
Note:Soldermasktypeswerepreviouslydescribedas
TypeAforscreenimaged(liquid)orcoverlayforflex
(dry),andTypeBforalltypesofphotodefinedsolder
mask(liquidordryfilm).
3.4.1FormulationChange
4thbulletpoint
Replace:
?Changesintypeofdyeorpigment.
With:
?Changesintypeofdyeorpigment,excludingcoloring
dyeorpigmentwithinadefined,testedrangeoflowest
(none)andhighest(supplied)loadinglevelsofthespe-
cificcoloringmaterials.
6thbulletpoint
Replace:
?Addition,deletionorchangeincompositionof‘‘inert’’
materialsintheformulationsuchasmattingagent(s).
With
?Addition,deletionorchangeincompositionof‘‘inert’’
materialsintheformulationsuchasmattingagent(s),
excludingachangeinquantityofasingle‘‘inert’’mate-
rialalreadypresentintheformulawithinadefined,tested
rangeoflowest(none)andhighest(supplied)loadinglev-
elsofthatspecific‘‘inert’’material.Changetomorethan
onematerialisconsideredaformulationchange.
1.CurrentandrevisedIPCTestMethodsareavailablethroughIPC-TM-650subscriptionandontheIPCWebsite(www.ipc.org/html/testmethods.htm).
2.1IPC
1
Replacethefollowing:Withthefollowing:
IPC-RB-276QualificationandPerformanceofRigidPrinted
Boards
IPC-6011GenericPerformanceSpecificationforPrintedBoards
IPC-6012QualificationandPerformancespecificationforRigid
PrintedBoards
TM2.3.25DetectionofIonizableSurfaceContamination(Static
Method)
TM2.3.25DetectionandMeasurementofIonizableSurface
Contaminants
TM2.3.26DetectionofIonizableSurfaceContamination
(DynamicMethod)
TM2.3.26.1IonizableDetectionofSurfaceContamination
(StaticMethod)
TM2.3.25.1IonicCleanlinessTestingofBarePrintedWiring
Boards
TM2.3.38InspectionTestforOrganicContaminatesonPrinted
WiringBoardandAssemblySurfaces
TM2.3.38SurfaceOrganicContaminantDetectionTest
TM2.3.39IdentificationofResidualOrganicNon-IonicContami-
natesonPrintedWiringBoardsandAssemblySurfaces
TM2.3.39SurfaceOrganicContaminantIdentificationTest
(InfraredAnalyticalMethod)
TM2.4.28.1Adhesion,SolderMask(OverMeltingandNon-
MeltingMetals)
TM2.4.28.1Adhesion,SolderResist(Mask),TapeTestMethod
TM2.6.3.1MoistureandInsulationResistancePolymericSolder
MasksandConformalCoating
TM2.6.3.1MoistureandInsulationResistance–SolderMasks
TM2.6.7.1ThermalShock–PolymerSolderMaskCoatingsTM2.6.7.3ThermalShock–SolderMask
TM2.6.11HydrolyticStability–SolderMasksandConformal
Coating
TM2.6.11HydrolyticStability–SolderMask
June2000IPC-SM-840C-Amendment1
1
3.4.5Cure
AddsentenceattheendofNote:
Contactmanufacturerofsoldermasktodeterminemethod
totestcure.
3.4.10DimensionalRequirements
Replace:
Ifaspecificthicknessorbreakdownvoltageisrequiredit
shallbespecifiedbytheenduserontheprocurementdocu-
ment.
With:
Ifaspecificthicknessorbreakdownvoltageisrequiredor
alloweditshallbespecifiedbytheenduserontheprocure-
mentdocument.
Table1ThermalShockIPCTestMethod
Replace:
2.6.7.1
With:
2.6.7.3
Table4
Deleteandreplacewith:
Table4MoistureandInsulationResistance
ClassTestTemperatureTestHumidity
BiasVoltage
(VDC)
TestVoltage
(VDC)Duration
TestPattern
IPC-B-25A
Board
Requirements
(megohm)
T65°±2°C
[149°±3.6°F]
90±3%010024hoursEandF,C500
H25°to65°±2°C
[77°to149°±3.6F]
90,-5,+3%5010062/3daysD,C500
Table5
Deleteandreplacewith:
Table5ElectrochemicalMigration
ClassTestTemperatureTestHumidity
BiasVoltage
(VDC)
TestVoltage
(VDC)Duration
TestPattern
IPC-B-25A
BoardRequirements
T85°±2°C
[185°±3.6°F]
85%
minimum
1045-100500hoursD,C<1decade
dropin
resistance
H85°±2°C
[185°±3.6°F]
90%1010168hoursD,CResistance≥
2megohms
IPC-SM-840C-Amendment1June2000
2
3.9.3ThermalShock
Replace:
TM2.6.7.1
With:
TM2.6.7.3
ThermalShockTestMethod
Replace:
2.6.7.1
With:
2.6.7.3
4.6.1InspectionofProductforDelivery
Replace:
IPC-RB-276
With:
IPC-6011andIPC-6012
4.7.1PreparationPriortoCoating
Replace:
TM2.3.26,TM2.3.26.1
With:
TM2.3.25.1
Table7
Replacerow:
RequirementParagraphTestMethodDorNClassTClassH
MoistureandInsulation
Resistance(combpattern)
3.9.12.6.3.1D≥500megohms
(B-25AorB-25)
≥100megohms(B-25A)
≥500megohms(B-25)
With:
MoistureandInsulation
Resistance(combpattern)
3.9.12.6.3.1D≥500megohms
(IPC-B-25ABoard,
PatternEandF)
≥500megohms
(IPC-B-25ABoard,PatternD)
June2000IPC-SM-840C-Amendment1
3
ASSOCIATIONCONNECTING
ELECTRONICSINDUSTRIES
2215SandersRoad,Northbrook,IL60062-6135
Tel.847.509.9700Fax847.509.9798
www.ipc.org
ISBN#1-580982-55-7
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