2_2_7 - hole size measurement - plated

1.0ScopeTomeasuretheinsidediameterofplated

throughholesinprintedwiringboards.

2.0ApplicabledocumentsNone.

3.0TestSpecimenProductionboardortestpattern,

numberanddesignofholesshallbedeterminedbyagree-

mentbetweenvendorandcustomerorapplicabledrawings.

4.0Apparatus

4.1StereoscopicmicroscopeWith20xmagnification

micrometerscaleeyepieceandilluminator.

5.0Procedure

5.1MeasurementSetthemicroscopeon20xmagnifica-

tionandmeasuretheinsidediameteroftheholefromone

sidetotheothersideatthelargestpoint.

5.2EvaluationoftestRecordmeasurementsandnoteif

voidsandnoduleswerepresent.

TheInstituteforInterconnectingandPackagingElectronicCircuits

2215SandersRoad?Northbrook,IL60062

IPC-TM-650

TESTMETHODSMANUAL

Number

2.2.7

Subject

HoleSizeMeasurement,Plated

Date

5/86

Revision

A

OriginatingTaskGroup

PrintedBoardTestMethodsTaskGroup(7-11d)

MaterialinthisTestMethodsManualwasvoluntarilyestablishedbyTechnicalCommitteesoftheIPC.Thismaterialisadvisoryonly

anditsuseoradaptationisentirelyvoluntary.IPCdisclaimsallliabilityofanykindastotheuse,application,oradaptationofthis

material.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsorliabilitiesforpatentinfringement.

EquipmentreferencedisfortheconvenienceoftheuseranddoesnotimplyendorsementbytheIPC.

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