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2_2_14_1 - solder powder size - measuring microscope
2014-12-02 | 阅:  转:  |  分享 
  
1.0ScopeThistestspecifiesastandardprocedureforesti-

matingtheparticlesizeandtheparticleshapeofsolderpow-

derinsolderpastesbymicroscopicmethods.

2.0ApplicableDocumentsNone

3.0TestSpecimen

1gramofsolderpaste

4.0Equipment/Apparatus

Thinner

Spatula

Beaker30ml

Microscope,magnification100times

Measuringocular,scaledivision10μm

Microscopeslides

Microscopeglasscoverslips

5.0Procedure

5.1Preparation

5.1.1Wait,ifnecessary,untilthesolderpasteisatroom

temperature.

5.2Test

5.2.1Homogenizethepastebystirringwiththespatula.

5.2.2Weighapproximately4gofthinner.

5.2.3Addapproximately1gofthesolderpaste.

5.2.4Stirwiththespatulauntilauniformmixturehasbeen

obtained.

5.2.5Applyasmalldroponthemicroscopeslide.

5.2.6Covertheslidewiththecoverslipandpressgentlyto

spreadoutthesmalldropbetweentheglasses.

5.2.7Measurewiththemicroscopethelengthandwidthof

theestimatedsmallestandlargestsolderpowderparticlesin

aviewingareaofapproximately50particles.(Photographs

maybeusedformeasuringand/orreferencepurposes).

5.2.8Estimatetheprincipleshapeoftheparticlesasspheri-

calornon-spherical.

5.3EvaluationExpressthemassesofthepowderabove,

within,andbelowthenominalsizerangeaspercentagesof

themassoftheoriginalsample.EnterdatainTable1.

Table1

Type1+150μm+75μm+20μm–20μm

Type2+75μm+45μm+20μm–20μm

Type3+45μm+25μm+20μm–20μm

Type4+38μm+20μm–20μm

Type5+30μm+15μm–15μm

Type6+15μm+5μm–5μm

TheInstituteforInterconnectingandPackagingElectronicCircuits

2215SandersRoad?Northbrook,IL60062

IPC-TM-650

TESTMETHODSMANUAL

Number

2.2.14.1

Subject

SolderPowderParticleSizeDistribution—

MeasuringMicroscopeMethod

Date

1/95

Revision

OriginatingTaskGroup

SolderPasteTaskGroup(5-24b)

MaterialinthisTestMethodsManualwasvoluntarilyestablishedbyTechnicalCommitteesoftheIPC.Thismaterialisadvisoryonly

anditsuseoradaptationisentirelyvoluntary.IPCdisclaimsallliabilityofanykindastotheuse,application,oradaptationofthis

material.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsorliabilitiesforpatentinfringement.

EquipmentreferencedisfortheconvenienceoftheuseranddoesnotimplyendorsementbytheIPC.

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