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2_2_16 - artwork master evaluation by use of driller panel
2014-12-02 | 阅:  转:  |  分享 
  
1ScopeThistestmethodisusedtoevaluate1:1artwork

mastersforadequacyinmeetingendproductannularring

requirementsfortheexistenceofextra,missing,ormislocated

pads,andforthecorrectnessofconductorplacementrelative

totheholes.

2ApplicableDocumentsNone

3TestSpecimens

3.11:1artworkmastersforeachprintedcircuitlayer

3.2Drilleddummypanel

4Apparatus

4.1Lighttable

4.2Magnifier

5Procedure

5.1.Preparation/DrillDummy

5.1.1PrepareadrilltapetobeusedfortheproductionPCB

correspondingtotheartworkmastersbeingevaluated.

5.1.2Drillapieceofcoppercladcircuitboardmaterialwith

thedrilltape,butmodifytheholesizescalledoutonthemas-

terdrawingasexplainedin5.1.2.1through5.1.2.3.

5.1.2.1ForallofthePTHs,drill18to24milslargerthanthe

maximumafterplatingholesizecalledoutonthemaster

drawingforthathole.

Note:Theexactnumbertobeselectedfromthisrange(18to

24mils)willvaryfromshoptoshop,dependingonsuchvari-

ablesasequipment,tooling,andpanelsize.Asageneralrule,

lowernumbersmeanthatsmallerpanels,betterregistration

tooling,andmoresophisticatedproductionequipmentmust

beused.

5.1.2.2Forallnon-plated-throughholes,drilltheholesto

themaximumsizeindicatedonthemasterdrawing.

5.1.2.3Cleananddeburrthedrilleddummypanel.

5.1.3ArtworkMastersA1:1artworkmastermustbepre-

paredforevaluationforeachprintedcircuitlayer.Thefollow-

ingoptionsapply:

a.Negativesforeachlayer

b.Bleachedpositivesforeachlayer

c.Diazofilmforeachlayer

d.Combinationsoftheabove

5.2Test

5.2.1Tapethedrilleddummypaneltothelighttable.

5.2.2Alignthefirstpieceoffilmtothedummypanel,aver-

agingtherelativepositionsofthedrilledholestothepadson

theartworkmastertomaximizeannularringswithoutbreak-

out.

5.2.3Evaluatetheresultundermagnification,thenremove

thefilm.

5.2.4Alignthenextpieceoffilmandevaluateinthesame

manner.Continuethisprocessuntilalllayershavebeenevalu-

ated.

5.3Evaluation

5.3.1Examineeachlayerwhenalignedtothedrilledpanel

undermagnificationforthefollowingdeficiencies:

a.Breakoutofholetopad

b.Missingpads

c.Mislocatedpads

d.Extrapads

e.Insufficientclearancebetweenconductorsandholes

f.Holesrunningthroughconductors

TheInstituteforInterconnectingandPackagingElectronicCircuits

2215SandersRoad?Northbrook,IL60062

IPC-TM-650

TESTMETHODSMANUAL

Number

2.2.16

Subject

ArtworkMasterEvaluationbyUseofaDrilled

Panel

Date

12/87

Revision

OriginatingTaskGroup

N/A

MaterialinthisTestMethodsManualwasvoluntarilyestablishedbyTechnicalCommitteesoftheIPC.Thismaterialisadvisoryonly

anditsuseoradaptationisentirelyvoluntary.IPCdisclaimsallliabilityofanykindastotheuse,application,oradaptationofthis

material.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsorliabilitiesforpatentinfringement.

EquipmentreferencedisfortheconvenienceoftheuseranddoesnotimplyendorsementbytheIPC.

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