1.0ScopeThisproceduredeterminesthepercentmetal
contentforsolderpaste.
2.0ApplicableDocumentsNone
3.0TestSpecimen50gramsofsolderpaste
4.0Equipment/Apparatus
Balance
CrucibleorBeaker
HeatSource
FluxSolvent
5.0Procedure
5.1Preparation
5.1.1Weigh10to50grams(tothenearest0.01gram)of
solderpasteintoataredvesselsuitableformeltingthesolder
paste.
5.2Test
5.2.1Meltthesolderatapproximately25°Caboveliquidus
ofthealloy,removefromheatandallowsoldertosolidify.
5.2.2Extractmeltfromresidualfluxwithasuitablesolvent,
dryandweighmetaltowithin0.01gramstodetermine%
metalcontent.
5.3Evaluation
Weightofextractedmetal
Weightoforiginalsample
x100=%Metal
EntertheresultsinTable1‘‘TestReportonSolderPaste.’’
TheInstituteforInterconnectingandPackagingElectronicCircuits
2215SandersRoad?Northbrook,IL60062
IPC-TM-650
TESTMETHODSMANUAL
Number
2.2.20
Subject
SolderPasteMetalContentbyWeight
Date
1/95
Revision
OriginatingTaskGroup
SolderPasteTaskGroup(5-24b)
MaterialinthisTestMethodsManualwasvoluntarilyestablishedbyTechnicalCommitteesoftheIPC.Thismaterialisadvisoryonly
anditsuseoradaptationisentirelyvoluntary.IPCdisclaimsallliabilityofanykindastotheuse,application,oradaptationofthis
material.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsorliabilitiesforpatentinfringement.
EquipmentreferencedisfortheconvenienceoftheuseranddoesnotimplyendorsementbytheIPC.
Page1of2
Table1TestReportonSolderPaste
Enterappropriateinformationintopportionofreportandcompletereportbyenteringthetestresultsorcheckmarksintheappropriatespaces.
InspectionPurpose:QPLI.D.Number:
__QualificationManufacturer’sIdentification:
__QualityConformanceAManufacturer’sBatchNumber:
__QualityConformanceBDateofManufacture:
__Shelf-LifeExtensionOriginalUse-ByDate:
__PerformanceRevisedUse-ByDate:
DateInspectionCompleted:OverallResults:__Pass__Fail
InspectionPerformedby:Witnessedby:
Inspections
User’sActual
RequirementTestResultP/F()Testedby&Date
Material
Visual
MetalContent
Viscosity
SolderBall
Slump
Alloy
Flux
PowderSize
%InTopScreen
%InNextScreen
%InBottomScreen
%InReceiverBottom
Max.PowderSize
PowderShape
Tack
Wetting
P/F=PASS/FAIL;enterPiftestresultsarewithintoleranceofactualrequirement;otherwise,enterF
IPC-TM-650
Number
2.2.20
Subject
SolderPasteMetalContentbyWeight
Date
1/95
Revision
Page2of2
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