BALANCEDDUAL-LINEEMIFILTER
SOLDERPROCESSRECOMMENDATIONS:
SOLDERREFLOW:
Recommendedtemperatureprofilesfor
reflowsolderingareshowninTable1
andFigure1fromJ-STD-020C
Preheatramp:1-3°C/sec.
Preheat:75-125°CT(max):210-260°C
SOLDERWAVE:Caution,NOT
recommendedforsizes>1206
PreheatTemp.:100-120°C
?TPre-Heat:150°Cmax.
SolderingPeakTemp.:
250-260°C,5SEC.max.
CoolDown:<2°C/SEC
SOLDERINGIRON:
NOTSUPPORTEDforuseinmassproduction
Notrecommendedforlabproto-typing,usesolderreflow,hot-airtool,orconductiveepoxytoavoid
thermaldamageandcompromisedtestresults.IfIronisused,followbelowprecautions:
?Preheatcircuitandcapacitorstowithin100°Cofsolderingtemperature
?Nocontactofirontipwithcomponent
?20wattironoutput(max)
?350°Ctiptemperature(max)
?1.0mmtipdiameter(max)
?Limitsolderingtimeto3sec.(max)
PACKAGINGSPECIFICATIONS
SpecificationEIAstandard481
PARTSIZE7”REELQTY
0603(1608)4,000
CONTACINFORMATION
SHENZHENTOP-FLIGHTTECHNOLOGYCO.,LTD
4thFloor,CBuilding,QuansenIndustrialPark,BulongRoad,LonghuaNewDistrict,Shenzhen
Tel:86-18664789275Fax:86-755-82908701Email:lxk@topleve.com
Website:http://www.topleve.com
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