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充电桩电源模块功率器件解决方案_20250424_Rev.1.1
2025-04-30 | 阅:  转:  |  分享 
  

Rev.1.1
&
132 6666 3313
Rev.1.3
&
&
&
13266663313 &
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
13266663313
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PAGE 2
T2
T3
T1
T4
T --
T
IGBT+SiC MOSEFT
E2B
1200V/200A
T --IGBT
EconoPACK4
1200V/400A
T IGBT
TO-247Plus-3
IGBT 650V/150A
IGBT 1200V/150A
IGBT

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PAGE 3
I --IGBT
E2B
1200V/5.5mΩ
SiC MOSFET
TO-247-4
1200V/30mΩ
1200V/20mΩ
SiC MOSFET
I IGBT
E2B
650V/200A
-- SiC MOSFET

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IGBT
780x220x485mm
SiC MOSFET
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680x220x520mm
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PAGE 6



Vdc(V)

Vac(V)

(kW)
fsw
(kHz)

(um)

(W/mK)

( )
BMF240R12E2G3

900
400
125/137.5/150
32/36/40
100
3
65/70/80

BMF240R12E2G3 125kW

65 /70 /80 PCS E2B


1 (125kW)MOS

1.1 (137.5kW)MOS

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
1.2 (150kW)MOS
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Copyright 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
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U V W MOSFET MOSFET
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PAGE 8

65 /70 /80 PCS E2B 1 (125kW)MOSFET


MOSFET

BASiC BMF240R12E2G3

fsw(kHz) ( ) (W)
(W)
(W)
(%)

( )
BMF240R12E2G3
32
65
99.4
100.4
199.9
99.04
106.9
36
100.3
112.7
213.1
98.98
109.7
40
101.1
124.9
226
98.91
112.5
32
70
101.2
99.6
200.8
99.03
112.1
36
102
111.8
213.8
98.97
114.8
40
102.8
123.9
226.7
98.91
117.5
32
80
112.7
84
196.7
99.05
122.3
36
105.4
110
215.5
98.96
125
40
106.2
121.9
228.1
98.90
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127.7
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: 32kHz~40kHz, 80
32kHz
36kHz
40kHz

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PAGE 11

fsw(kHz)
( )
(W)
(W)
(W)
( )
BMF240R12E2G3
32
65
121.8
109.5
231.4
113.3
36
123
122.9
245.9
116.3
40
124
136.1
260.1
119.3
32
70
123.9
108.6
232.5
118.4
36
125
121.8
246.9
121.4
40
126
134.9
261
124.4
32
80
128.1
106.8
234.9
128.8
36
129.1
119.8
248.9
131.7
40
130.1
132.6
262.8
134.6

65 /70 /80 PCS E2B 1.1 (137.5kW)MOS


MOSFET

Copyright 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
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BASiC BMF240R12E2G3
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PAGE 12

fsw(kHz)
( )
(W)
(W)
(W)
( )
BMF240R12E2G3
32
65
147
118.6
265.6
120.1
36
148.4
132.9
281.4
123.4
40
149.8
147.1
296.9
126.7
32
70
149.5
117.5
267.1
125.3
36
150.9
131.7
282.7
128.6
40
152.1
145.7
297.9
131.8
32
80
154.3
115.4
269.8
135.7
36
155.7
129.3
285.1
138.9
40
157
143.1
300.2
142.1



Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
65 /70 /80 PCS E2B 1.2 (150kW)MOS
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PAGE 13


fsw(kHz) ( ) (W)
(W)
(W)
(%)

( )
BMF240R12E2G3
32
65
106.1
100
206.1
99.01
111
36
106.8
112.2
219
98.94
113.8
40
107.5
124.4
231.9
98.88
116.6
32
70
107.6
99.2
206.8
99.00
116.1
36
108.2
111.3
219.5
98.94
118.9
40
109
123.4
232.4
98.88
121.6
32
80
110.5
97.6
208.1
99.00
126.4
36
111.1
109.6
220.8
98.94
129.1
40
112.1
124.2
236.4
98.86
131.8



Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
65 /70 /80 PCS E2B 1 (125kW)MOS
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PAGE 14


fsw(kHz)
( )
(W)
(W)
(W)
( )
BMF240R12E2G3
32
65
131
108.9
240
118.5
36
131.9
122.2
254.2
121.5
40
132.9
135.3
268.3
124.5
32
70
132.8
108
240.8
123.6
36
133.7
121.2
254.9
126.6
40
134.6
134.1
268.8
129.6
32
80
136.3
106.2
242.6
133.9
36
137.2
119.1
256.4
136.9
40
138.1
131.9
270.1
139.8



Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
65 /70 /80 PCS E2B 1.1 (137.5kW)MOS
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PAGE 15


fsw(kHz)
( )
(W)
(W)
(W)
( )
BMF240R12E2G3
32
65
159.5
117.7
277.3
126.6
36
160.7
131.9
292.6
129.9
40
162
145.9
308
133.2
32
70
161.6
116.7
278.4
131.8
36
162.8
130.8
293.6
135.1
40
164.1
144.7
308.8
138.4
32
80
165.9
114.6
280.5
142.2
36
167
128.4
295.4
145.4
40
168.2
142.1
310.4
148.6



Copyright 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
?
65 /70 /80 PCS E2B 1.2 (150kW)MOS
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PAGE 16

SiC MOSFET
SiC MOSFET




B2M030120Z48
/
/
/
/
B3M013C120Z
/
/
BMF240R12E2G34

/
/
BTD5350MCWR8
BTD25350MMCWR4
BTP1521F4
BTP1521P4
TR-P15DS23-EE134

B2M600170H
/
/
BTP284xDR
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/
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PAGE 18
SiC
MOSFET
SiC MOSFET
HSOP8
Pcore?2
(E1B)
Pcore?2
(E2B)
Pcore?2
(34mm)
TM
Pcore 2
(62mm)
TM
Pcore 2
(ED3)
Pcore?12
(EP2)



DBC












3 4
Si N






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PAGE 19



(V)
(A)
DS(on)
R (mΩ
HSOP8
B2M065120T

1200
29
65
B2M040120T
45
40
Pcore?4 E1B
BMH027MR07E1G3
H
650
40
27
Pcore?2 E1B
BMF011MR12E1G3

1200
120
11
Pcore?2 E2B
BMF008MR12E2G3
160
8
BMF240R12E2G3
240
5.5
34mm
BMF80R12RA3
80
15
BMF160R12RA3
160
7.5
62mm
BMF300R12KA3
300
4.0
BMF450R12KA3
450
3.0
ED3
BMF300R12MA3
300
4.0
BMF450R12MA3
450
3.0
Pcore?12
BMS065MR12EP2CA2 PFC+
25
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PAGE 20




150A APF

125kW PCS


DCDC




Dss
V (V)
DS(on)
R (mΩ)
Dnom
I (A)
GS(op)
V (V)
GS(th) .typ
V (V)
SD
V (V)
G
Q (nC)
BMF240R12E2G3
Pcore?2 E2B

1200
5.5
240
+18/-4
4.0
1.35
492
BMF008MR12E2G3
Pcore?2 E2B

1200
8
160
+18/-4
4.0
1.35
328


DS(on)
R

SiC SBD,





3 4
Si N AMB

Press-Fit Soldering

NTC

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
Pcore?2 E2B
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PAGE 21

2 3
Al O
AlN
3 4
Si N


24
170
90
W/mk

6.8
4.7
2.5
ppm/K

450
350
700
N/mm2

4.2
3.4
6.0
Mpa/ m

4
10
N/mm

20
kV/mm

2 3
AI O --- DCB

AlN--- 630um

3 4
Si N --- AlN AlN 360um
2 3 3 4
10 AI O /AlN Si N
1000
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Si N SiC MOSFET
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PAGE 22

DSS
V (V)
DS(ON)
R (mΩ
D,nom
I (A)
GS(op)
V (V)
GS(th)
V (V)
SD
V (V)
Qg(nC)
BMF240R12E2G3
1200
5.5
240
-4/+18
4.0
1.35
492

SiC MOSFET SiC SBD SiC MOSFET

MOSFET SiC SBD MOSFET SiC MOSFET
Eon
SiC MOSFET
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
SiC SBD
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PAGE 23



SiC MOSFET 1000 Ron 42%

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
SiC SBD SBD 1000 Ron 3%
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PAGE 24

SD SD
MOSFET V SiC MOSFET V

--- SBD

PCS SiC MOSFET
PCS
SD
PCS I PCS
MOSFET
SD
BMF240R12E2G3 SD V SiC MOSFET

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
SD
I
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PAGE 25
Eon
Eoff
2
Eon


SiC MOSFET Eon Eoff Eon Etotal 60%
~80%

FF6MR12W2M1H_B70 (I) CAB006M12GM3 (W) Eon Eon

BMF240R12E2G3 Eon Eon Eon
PCS

5
Eon
9
Eon
BMF240R12E2G3 (BASiC)
CAB006M12GM3 (W)
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
FF6MR12W2M1H_B70 (I)
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PAGE 26


BMF240R12E2G3(BASiC)
CAB006M12GM3 (W) FF6MR12W2M1H_B70 (I)

BOT
TOP
BOT
TOP
BOT
TOP
DSS
BV
GS
V =0V,
D
I =100μA
j
T=25
1627
1621
1531
1436
1404
1419
V
j
T=125
1650
1648
1560
1466
1447
1457
j
T=150
1653
1650
1567
1472
1456
1467
DSS
I
DS GS
V V =1200V, =0V,
j
T=25
6.041
5.965
0.138
0.296
0.223
0.175
uA
j
T=125
26.033
28.323
0.768
1.215
1.067
0.917
j
T=150
39.726
40.196
1.116
1.628
1.873
1.278

GS(th) SD rss Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC BMF240R12E2G3 BVDSS V V C
W I
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PAGE 27


BMF240R12E2G3(BASiC)
CAB006M12GM3 (W) FF6MR12W2M1H_B70 (I)

BOT
TOP
BOT
TOP
BOT
TOP
GSS
I +
GS
V =25V,
DS
V =0V
j
T=25
0.476
0.176
0.387
0.049
0.362
0.092
nA
j
T=125
1.193
1.423
1.116
0.974
0.296
0.525
j
T=150
2.463
1.420
1.307
1.214
0.401
0.464
GSS
I
GS
V =-10V,
DS
V =0V
j
T=25
-0.069
-0.151
-0.218
-0.227
-0.261
-0.292
nA
j
T=125
-0.119
-0.114
-0.343
-0.418
-0.611
-0.345
j
T=150
-0.702
-0.128
-0.998
-0.702
-0.709
-0.789
GS(th)
V
GS DS
V =V ,
D
I =78mA
j
T=25
4.311
4.282
3.008
3.020
4.050
4.056
V
j
T=125
3.592
3.517
2.329
2.349
3.287
3.376
j
T=150
3.433
3.403
2.237
2.254
3.179
3.191

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
GSS GS(th)
I V
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PAGE 28

DS(ON)
R


BMF240R12E2G3(BASiC)
CAB006M12GM3 (W) FF6MR12W2M1H_B70 (I)

BOT
TOP
BOT
TOP
BOT
TOP
DS(ON)_
R 1
GS
V =18V,
D
I =150A
j
T=25
5.625
5.701
4.036
3.892
4.412
4.513

j
T=125
7.239
7.770
6.758
6.553
7.259
7.382
j
T=150
8.251
8.508
7.671
7.346
8.254
8.125
DS(ON)_
R 2
GS
V =18V,
D
I =200A
j
T=25
5.713
5.781
4.080
3.931
4.465
4.565

j
T=125
7.325
7.864
6.832
6.618
7.342
7.474
j
T=150
8.342
8.611
7.755
7.432
8.374
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
8.243
BASiC Semiconductor
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PAGE 29


BMF240R12E2G3(BASiC)
CAB006M12GM3 (W) FF6MR12W2M1H_B70 (I)

BOT
TOP
BOT
TOP
BOT
TOP
SD
V
GS
V =-4V,
SD
I =200A
j
T=25°C
1.911
1.930
5.452
5.363
4.861
4.917
V
j
T=125°C
2.534
2.668
4.984
4.875
4.514
4.666
j
T=150°C
2.810
2.873
4.902
4.800
4.454
4.550
G(int)
R
f =1MHz,
VAC=25mV
j
T=25
0.700
0.710
1.408
1.402
2.228
2.301
Ω
j
T=125
1.089
0.634
0.943
1.328
2.131
2.011
j
T=150
0.534
0.689
1.638
1.377
1.959
1.838

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
SD G(int
V (Forward Voltage of Body-Diode) R
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PAGE 30


BMF240R12E2G3 (BASiC)
CAB006M12GM3 (W) FF6MR12W2M1H_B70 (I)

BOT
TOP
BOT
TOP
BOT
TOP
Ciss
GS
V =0V,
DS
V =800V
f =100kHz,
AC
V =25mV,
j
T=25
17.384
17.426
21.342
21.442
12.713
12.744
nF
j
T=125
17.432
17.493
21.477
21.581
12.788
12.823
j
T=150
17.421
17.514
21.519
21.635
12.807
12.821
Coss
j
T=25
0.961
0.966
0.808
0.816
0.700
0.705
nF
j
T=125
0.969
0.980
0.812
0.815
0.703
0.704
j
T=150
0.962
0.978
0.813
0.829
0.705
0.720
Crss
j
T=25
36.900
21.951
52.919
41.486
59.584
45.864
pF
j
T=125
26.017
18.873
56.484
41.216
60.927
48.154
j
T=150
30.830
19.012
51.435
41.500
58.197
43.294

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PAGE 31
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PAGE 32
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
Test object: Bottom Side
GS(op) DC Load j
Test conditions: V =-3V/+18V, Bottom Side, V =800V, ID=150/200/400A, Lσ=10.7nH, L =50/100uH, Rgon=Rgoff=3.3Ω, T=25

BMF24012E2G3(BASiC
CAB006M12GM3 (W)
FF6MR12W2M1H_B70 I)

150A
200A
400A
150A
200A
400A
150A
200A
400A
SiC MOSFET
ON-di/dt
3109
3862
6466
4580
5274
7434
5942
6783
8683
A/us
ON-dv/dt
14539
13628
10796
14946
13956
9742
12112
11065
8149
V/us
Eon
6.55
8.56
18.48
5.94
7.72
15.55
5.49
7.33
15.39
mJ
OFF-di/dt
3863
5948
13948
2971
4517
12056
3376
5424
13399
A/us
OFF-dv/dt
20622
20656
21322
14264
15059
15960
17822
18574
19829
V/us
DS_peak
V
903
928
983
892
906
944
914
935
981
V
Eoff
1.78
2.66
6.76
3.21
4.57
10.87
2.61
3.75
8.85
mJ
Etotal
8.33
11.22
25.24
9.15
12.29
26.42
8.1
11.08
24.24
mJ
Test object: Bottom Side
GS(op) DC Load j
Test conditions: V =-3V/+18V, Bottom Side, V =800V, ID=150/200/400A, Lσ=10.7nH, L =50/100uH, Rgon=Rgoff=3.3Ω, T=125
SiC MOSFET
ON-di/dt
4167
4649
6747
6745
6194
8282
6516
7292
9332
A/us
ON-dv/dt
20346
20346
13646
18779
14849
10582
14968
13897
10287
V/us
Eon
5.89
7.54
14.66
5.12
7.68
15.9
6.00
8.13
17.87
mJ
OFF-di/dt
3685
5633
13827
3057
4548
10669
3247
5150
12135
A/us
OFF-dv/dt
23606
24427
23364
16010
15747
16783
17182
18026
19617
V/us
DS_peak
V
894
919
991
874
898
933
884
890
919
V
Eoff
1.66
2.37
6.16
3.01
4.55
11.31
2.8
3.95
9.22
mJ
Etotal
7.55
9.91
20.82
8.13
12.23
27.21
8.8
12.08
27.09
mJ

BASiC BMF240R12E2G3 Eoff Etotal W I

j j
BASiC Semiconductor
BASiC BMF240R12E2G3 (T=125 ) Eon (T=25 ) Eon BMF240R12E2G3
www.basicsemi.com
PAGE 33
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
Test object: Bottom Side
GS(op) DC Load j
Test conditions: V =-3V/+18V,Bottom Side, V =800V, ID=150/200/400A, Lσ=10.7nH, L =50/100uH, Rgon=Rgoff=3.3Ω, T=25

BMF24012E2G3(BASiC
CAB006M12GM3 (W)
FF6MR12W2M1H_B70 I)

150A
200A
400A
150A
200A
400A
150A
200A
400A
Body-Diode
RRM
I
-60.9
-65.4
-66.7
-72.8
-81.6
-108.2
-59.4
-58.3
59.1
A
DS_peak
V
834
834
828
837
835
828
844
838
820
V
Qrr
0.63
0.63
0.59
0.83
0.97
1.24
0.53
0.51
0.55
uC
Err
0.07
0.08
0.08
0.1
0.12
0.2
0.07
0.07
0.08
mJ
Recovery-di/dt
6678
8142
9824
6771
7683
10472
7406
8262
7598
A/us
Recovery-dv/dt
15275
14816
13561
15879
15538
14960
14909
14616
13866
V/us
GS(TOP)
V _min
1.19
1.61
1.96
2.09
2.25
3.66
2.3
2.55
3.16
V
GS(TOP)
V _max
-6.76
-6.82
-6.95
-5.43
-5.55
-5.76
-6.6
-6.63
-6.85
V
Test object: Bottom Side
GS(op) DC Load j
Test conditions: V =-3V/+18V, Bottom Side, V =800V, ID=150/200/400A, Lσ=10.7nH, L =50/100uH, Rgon=Rgoff=3.3Ω, T=125
Body-Diode
RRM
I
-56.3
-66.4
-87.2
-87.8
-91.5
-135.1
-85.3
-94.6
-132.6
A
DS_peak
V
831
838
868
860
816
861
858
857
836
V
Qrr
0.62
0.65
0.74
1.74
1.61
2.69
1.67
2.01
3.39
uC
Err
0.07
0.09
0.13
0.4
0.34
0.66
0.41
0.49
0.86
mJ
Recovery-di/dt
5765
6942
12010
8219
8774
10625
8303
8532
9366
A/us
Recovery-dv/dt
24394
25022
24332
23398
21119
17858
18804
18525
17194
V/us
GS(TOP)
V _min
0.37
0.79
2.41
0.81
0.86
1.93
1.34
1.5
1.5
V
GS(TOP)
V _max
-6.07
-6.24
-6.25
-5.32
-5.48
-5.45
-5.52
-5.71
-5.74
V

Qrr Err W

j j BASiC Semiconductor
BASiC BMF240R12E2G3 di/dt T=125 T=25
www.basicsemi.com
PAGE 34
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
GS
CH1:V -BOT
D
CH2:I -BOT
DS
CH3:V -BOT
GS
CH6:V -TOP(Optical
GS
CH1:V -BOT
D
CH2:I -BOT
DS
CH3:V -BOT
GS
CH6:V -TOP(Optical
GS
CH1:V -BOT
CH2:Irr
DS
CH5:V -TOP
GS
CH6:V -TOP(Optical

DC D j
: V =800V; I =400A; Rgon=Rgoff=3.3Ω,Vgs(op)=-3V/+18V; T=125
Fig1
Fig2
BASiC Semiconductor
Fig3
www.basicsemi.com
PAGE 35
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
GS
CH1:V -BOT
D
CH2:I -BOT
DS
CH3:V -BOT
GS
CH6:V -TOP(Optical
GS
CH1:V -BOT
D
CH2:I -BOT
DS
CH3:V -BOT
GS
CH6:V -TOP(Optical
GS
CH1:V -BOT
CH2:Irr
DS
CH5:V -TOP
GS
CH6:V -TOP(Optical

DC D j
: V =800V; I =400A; Rgon=Rgoff=3.3Ω,Vgs(op)=-3V/+18V; T=125
Fig4
Fig5
BASiC Semiconductor
Fig6
www.basicsemi.com
PAGE 36
Copyright 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
?

DC D j
: V =800V; I =400A; Rgon=Rgoff=3.3Ω,Vgs(op)=-3V/+18V; T=125
GS
CH1:V -BOT
D
CH2:I -BOT
DS
CH3:V -BOT
GS
CH6:V -TOP(Optical
GS
CH1:V -BOT
D
CH2:I -BOT
DS
CH3:V -BOT
GS
CH6:V -TOP(Optical
GS
CH1:V -BOT
CH2:Irr
DS
CH5:V -TOP
GS
CH6:V -TOP(Optical
Fig7
Fig8
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
Fig9
BASiC Semiconductor
www.basicsemi.com
PAGE 37

(B3M) MOSFET 6

DS(ON) G
FOM = R Q

B3M
TO-247PLUS-4
TO-247-4
TO-247-3
TO-263-7
TOLL
TOLT
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
QDPAK
BASiC Semiconductor
www.basicsemi.com
PAGE 38

DS(on)
R
TO-247-3
TO-247-4
TO-247PLUS-4
TO-263-7
TOLL
TOLT
SOT-227
TO-247PLUS
-4-2000
650V
40mΩ
B3M040065H
B3M040065Z
B3M040065L B3M040065B
750V
8mΩ
B2M008075HK
1200V
160mΩ
B2M160120H
B2M160120Z
B2M160120R
80mΩ
B2M080120H
B2M080120Z
B2M080120R
AB2M080120H
AB2M080120Z
AB2M080120R
65mΩ
B2M065120H
B2M065120Z
B2M065120R
40mΩ
B2M040120H
B3M040120H
B2M040120Z
B3M040120Z
B2M040120R
B3M040120R
AB2M040120Z
AB2M040120R
30mΩ
B2M030120H
B2M030120Z
B2M030120R
B2M030120N
11mΩ
B2M011120HK
B2M012120N
13.5mΩ
B3M013C120H
B3M013C120Z
6mΩ
B2M006120Y
1400V
42mΩ
B3M042140Z
1700V
600mΩ
B2M600170H
B2M600170Z
B2M600170R
2000V
24mΩ
B3M024C200J



BASiC SemiconductorCopyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
SiC MOSFET 6
BASiC Semiconductor
www.basicsemi.com
PAGE 40
SiC MOSFET 2CD0210T12x0

2W 10A
15V 16-30V
1200V SiC MOSFET











: BTP1521F
: DFN33-8
: 6W
: BTD5350MCWR
: SOW-8 ( )

DCDC
: TR-P15DS23-EE13
EE13
: 2W( )






SVG

APF


DC/DC

2CD0210T12A0
15V
+18V/-4V
2CD0210T12C0
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
16-30V
BASiC Semiconductor
www.basicsemi.com
PAGE 41



Expo
sed
pad

6W



H

1.5ms

1.3MHz

VCC 24V

VCC 4.7V

-40~125

150 , 120


BTP1521F
DFN33-8
BTP1521P
SOP-8
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 42
BTP1521 6W
BTP1521 6W

6W
DC1 DC2 MOSFET

DC1 DC2
H 6W,
SiC MOSFET
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 43

TR-P15DS23-EE13

EE13

4W 2W
N1
145
μH
N2
326
N3
326
N1
10

N2 N3
15
N1
0.2
mm
N2
0.2
N3
0.2
TR-P15DS23-EE13

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 44

2W 4W

15V VISO-COM=23V

4.7V VISO-VS=18V COM-VS
=-4V

BTP1521F OSC R5=42.2kΩ F=477kHz

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
RF-set RF-set(kΩ) F(kHz)
BASiC Semiconductor
www.basicsemi.com
PAGE 45

VCC1 5V

BTD5350xx IN PCB
PWM R11=10kΩ PWM
IN
IN C25=100pF

VISO2 +18V COM2 -4V G2

Clamp SiC MOSFET

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
R3=22Ω , R3
BASiC Semiconductor
www.basicsemi.com
PAGE 46

BMF240R12E2G3



SiC MOSFET
OUT Rg G

BMF240R12E2G3 2
G2,S2 G1,S1
BASiC SemiconductorCopyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
G2
BASiC Semiconductor
www.basicsemi.com
PAGE 48




IGBT Si MOSFET SiC MOSFET

Q2 Q1
dv/dt Q1 dv/dt
gd gd gd gd
Q2 C I I =C dv/dt dv/dt
gd
I

gd gd goff
I C R T4


gs gd goff
V =I R + Vgs
gsth Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
V Q1
BASiC Semiconductor
www.basicsemi.com
PAGE 49



gsth
V

goff goff
R R




Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 50

IGBT
SiC MOSFET


GS-
V
-25
-8
V
1: IGBT SiC MOSFET
2: SiC MOSFET -2~-4V
3: IGBT -8~-15V SiC MOSFET
GS (th)
V
5.5
1.8~2.7
V
1: SiC MOSFET
GS (th)
2: SiC MOSFET V TJ

100
200
%
Igd=Cgd dv/dt dv/dt Igd



Clamp SiC MOSFET
Igd Cgd T5


2V SiC
MOSFET 2V
MOSFET (T5) ,
SiC MOSFET

IGBT

SiC MOSFET
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 51

(T) PWM (DUT)


(T) (DUT)

(DUT)

T
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 52
GS
Low side V
D
High side I
GS
High side V
DS
High side V
7.3V
GS
Low side V
D
High side I
GS
High side V
DS
High side V
2V
GS GS DS D load
: V =0V/+18V, V =0V V =800V I =40A Rg=8.2Ω L
=200uH Ta=25




dv/dt
14.51
14.76
kV/us
di/dt
2.24
2.24
kA/us
GS
V
7.3
2
V
4V

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 53
GS
Low side V
D
High side I
GS
High side V
DS
High side V
2.8V
GS
Low side V
D
High side I
GS
High side V
DS
High side V
0V




dv/dt
14.51
14.76
kV/us
di/dt
2.24
2.24
kA/us
GS
V
2.8
0
V
GS GS DS D load
: V =-4V/+18V, V =-4V V =800V I =40A Rg=8.2Ω
L =20uH Ta=25

Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 54
UVLO
: BTD5350E



SiC MOSFET

clamp BTD5350M

10A

33V
: BTD5350M

: BTD5350S
















8V
SOW-18( )
SOP-8( )
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
11V
BASiC Semiconductor
www.basicsemi.com
PAGE 55



SiC MOSFET

DIS DT

clamp

10A

33V

8.5mm 5000Vrms

3mm



LLC SiC MOSFET

BUCK-BOOST SiC MOSFET

APF SiC MOSFET

SiC MOSFET

SiC MOSFET

PFC GaN SiC


8V
SOW-18( )
11V
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BASiC Semiconductor
www.basicsemi.com
PAGE 56

SiC MOSFET
OUT G



Clamp SiC MOSFET G D3
D4

BASiC SemiconductorCopyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
D3 D4
BASiC Semiconductor
www.basicsemi.com
PAGE 58









T
O
S
U
BTP2842DR
10V
16V
100%
-40 ~105
1A
500kHz
SOP-8
UCx842
UCx842
UCx842
UCx842
BTP2843DR
7.6V
8.4V
UCx843
UCx843
UCx843
UCx843
BTP2844DR
10V
16V
50%
UCx844
UCx844
UCx844
UCx844
BTP2845DR
7.6V
8.4V
UCx845
UCx845
UCx845
UCx845
BTP2842DR, BTP2843DR
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
BTP2844DR, BTP2845DR
BASiC Semiconductor
www.basicsemi.com
PAGE 59


600V~1000V

50W

BTP284xx
SiC MOSFET , 1700V/600mR
BASiC SemiconductorCopyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
B2M600170R TO-263B-7 B2M600170H TO-247-3
BASiC Semiconductor
www.basicsemi.com
PAGE 61
F3L400R12PT4
IGBT
4QP0115T-3L-I

4QP0115T-3L-I
T IGBT (EconoPACK4 )

ASIC

4 DC-DC

15V +15V/-10V

1W ±15A







SO

PWM
Copyright 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
?
3.3V 15V
BASiC Semiconductor
www.basicsemi.com
PAGE 62

2QD0225T12-Q 1200V
I IGBT



IGBT

ASIC

DC-DC

20kHz

15V +15V/-10V

2W ±25A



5V/15V




Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
2QD0225T12-Q
BASiC Semiconductor
www.basicsemi.com
PAGE 63

G2 G2
V V

G1 G2
V V

G1 G1
V V
G2
V




G2 G1 G1
V V V
G2
V
G1 G1
V V
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved.
IN2
BASiC Semiconductor
www.basicsemi.com
PAGE 64

ON
) Q IGBT


REF_SSD GH REF_SSD
V V V


Driver VGH

GH REF_SSD OFF
VGH V V Driver Q


REF_SSD
V
2us 0V


BASiC Vision For A Leading
Innovative SiC Company维也纳+Si超结MOSFET的LLC
电路位置 充电桩模块功率 SiC SBD 维也纳横管专用IGBT SiC MOSFET分立器件 驱动芯片 电源控制芯片
B4D30120H BG75N65HRA1
30kW /
B3D30120H (反并工频二极管)
维也纳整流 BTL27524R /
B3D40120H2
40kW /
B4D40120H
30kW / /
B3M040065H BTP1521F
LLC BTL27524R
B3M040065Z BTP1521P
40kW / /
辅助电源 / / / B2M600170R / BTP284xDR
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 2
BASiC Semiconductor维也纳+SiC MOSFET的H桥
电路位置 充电桩模块功率 SiC SBD 维也纳横管专用IGBT SiC MOSFET分立器件 SiC MOSFET模块 驱动芯片 电源控制芯片
B3D40120H2 BG75N65HRA1
40kW / /
B4D40120H (反并工频二极管)
维也纳整流 BTL27524R /
B3D50120H2
60kW / /
B3D60120H2
B4D60120H2
B2M040120Z
40kW / / B2M040120T
B3M040120Z
LLC或移相全桥 / /
60kW / / B2M030120Z /
BTD5350MCWR BTP1521P
门极驱动 / / / / /
BTD25350MMCWR BTP1521F
辅助电源 / / / B2M600170R / / BTP284xDR
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 3
BASiC SemiconductorSPWM整流+SiC MOSFET的三相LLC
+同步整流,双向拓扑
电路位置 充电桩模块功率 SiC MOSFET分立器件 SiC MOSFET模块 驱动芯片 电源控制芯片
三相PFC整流 60kW / BMF240R12E2G3 / /
LLC原边 60kW / BMF240R12E2G3 / /
LLC副边 60kW / BMF240R12E2G3 / /
BTD5350MCWR BTP1521P
门极驱动 / / /
BTD25350MMCWR BTP1521F
辅助电源 / B2M600170R / / BTP284xDR
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 4
BASiC SemiconductorBASiC Semiconductor测试仪器和设备
测试平台 充电桩电源模块实物 充电桩电源模块拓扑(DC-DC)
我司采购某知名客户的40kW充电桩电源模块进行测试,原机使用的器件为C3M0040120K,我司将B2M040120Z装入该机型上,
测试该器件的实际效率表现。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 6
BASiC Semiconductor效率测试
效率测试数据 (驱动 电压-3V/+15V )
型号 B2M040120Z C3M0040120K
输出电压(V) 输出电流(A) 输入功率(kW) 输出功 率(kW ) 效率(%)
10.00 1.76 1.496 84.81 84.87
150V
59.98 9.62 8.997 93.57 93.48
3.01 1.83 1.503 82.21 82.97
500V 40.01 20.77 19.996 96.28 96.32
60.00 31.17 29.971 96.15 96.17
2.02 1.68 1.511 87.45 87.77
750V 26.70 20.70 20.014 96.70 96.67
39.93 31.11 29.927 96.19 96.17
平均效率 91.67 91.80
结论:充电桩电源模块重载下,B2M040120Z与C3M0040120K应用在40kW充电桩电源模块
上展现的整机效率相当。如果提高到+18V的门极电压,相信效率指标会更优。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 7
BASiC Semiconductor温升测试
温升测试数据 (驱动 电压-3V/+15V )
型号 B2M040120Z C3M0040120K
输出电压(V) 输出功率(kW) 环境温度( ℃ ) 散热器温度( ℃ )
1.5 55 53.8
150V
9 39.6 40.8
1.5 46.3 46.8
500V 20 65 64.9
23.8
40 65.1 62
1.5 35.5 34.8
750V 20 47 48.3
40 60.1 63.5
两组温度测试数据的测试点为同一个位置。
结论:B2M040120Z与C3M0040120K应用在40kW充电桩电源模块上的器件温升接近。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 8
BASiC Semiconductor驱动电压
驱动电压测试数据( 驱动 电压-3V/+15V )
型号 B2M040120Z C3M0040120K B2M040120Z C3M0040120K
输出电压(V) 输出功率(kW) 负电压最大值(V ) 正电压最大值(V )
1.5 -2.909 -2.998 15.57 15.48
150V
9 -4.792 -5.051 15.61 15.51
1.5 -5.395 -5.564 16.17 15.83
500V 20 -5.392 -5.841 15.68 15.72
30 -5.015 -5.441 16.22 15.85
1.5 -3.720 -4.320 15.64 15.82
750V 20 -3.660 -4.113 15.57 15.73
30 -3.757 -4.369 15.62 15.74
结论:B2M040120Z的驱动负电压的尖刺比C3M0040120K要浅。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 9
BASiC SemiconductorB2M040120Z C3M0040120K
驱动电压尖峰最小值Vgs=-3.757V,最大值15.62V 驱动电压尖峰最小值Vgs=-4.369V,最大值15.74V
测试条件:输出电压750V,输出功率30kW
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 10
BASiC SemiconductorB2M040120Z C3M0040120K
DS电压尖峰Vds=841.1V DS电压尖峰Vds=836.2V
测试条件:输出电压750V,输出功率30kW启动
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 11
BASiC SemiconductorB2M040120Z C3M0040120K
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 12
BASiC SemiconductorB2M040120Z C3M0040120K
DS电压尖峰最大值Vds=881V DS电压尖峰最大值Vds=885V
测试条件:输出电压750V,带载10kW→空载
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 13
BASiC SemiconductorBASiC Semiconductor? 某充电桩电源模块客户采用单级变换的拓扑(矩阵变换器),实测B2M040120Z与某进口品牌40mR同封装产品,对比效率
? B2M040120Z的效率表现比该进口品牌出色
? 原因是B2M040120Z的Eoff优于对手,在软开关拓扑中,Eon被软掉了,Eoff优势就表现出来了。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 15
BASiC Semiconductor? 测试结果由客户提供,为了确认结果可信,客户反复确认各种设置,于两个时间点重复同一测试,确认测试结果一致。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 16
BASiC SemiconductorBASiC Semiconductor? 基本半导体第三代(B3M)碳化硅MOSFET系列基于6英寸晶圆平台进行开发;
? 品质系数因子(FOM = R Q )、开关损耗以及可靠性等方面表现更出色;
DS(ON) G
? B3M系列产品的封装类型更丰富,满足客户多样化的设计需求。
TO-247-3 TO-247-4 TO-247PLUS-4 TO-263-7 TOLL TOLT QDPAK
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 18
BASiC Semiconductor? SiC MOSFET产品基于6英寸晶圆平台开发。
TO-247PLUS
电压 R TO-247-3 TO-247-4 TO-247PLUS-4 TO-263-7 TOLL TOLT SOT-227
DS(on)
-4-2000
650V 40mΩ B3M040065H B3M040065Z B3M040065L B3M040065B
750V 8mΩ B2M008075HK
160mΩ B2M160120H B2M160120Z B2M160120R
B2M080120H B2M080120Z B2M080120R
80mΩ
AB2M080120H AB2M080120Z AB2M080120R
65mΩ B2M065120H B2M065120Z B2M065120R
B2M040120H B2M040120Z B2M040120R
B3M040120H B3M040120Z B3M040120R
1200V 40mΩ
AB2M040120Z AB2M040120R
30mΩ B2M030120H B2M030120Z B2M030120R B2M030120N
11mΩ B2M011120HK B2M012120N
13.5mΩ B3M013C120H B3M013C120Z
6mΩ B2M006120Y
1400V
42mΩ B3M042140Z
1700V 600mΩ B2M600170H B2M600170Z B2M600170R
2000V 24mΩ B3M024C200J
:汽车级 :即将发布
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 19
BASiC Semiconductor????????????
=
???? ????
? 表征器件的通态损耗参数:R
DS(ON)
? R 越小,器件的导通损耗越低;
DS(ON)
? B2M SiC MOSFET的R 参数在开通18V下标定,开通20V下参数更低。
DS(ON)
? 表征器件的器件的开关损耗参数:Q
G
? Q 越小,器件的开关速度越快,适合高频应用。
G
? 同时表征器件的通态损耗和开关损耗的归一化参数:FOM。在FOM中, R 和Q 一对跷跷板,需取Trade off
DS(ON) G
? R 越小,芯片面积越大(成本上升),器件额定电流越大,但Q 越大,开关损耗上升,不适合在高频下使用;
DS(ON) G
? Q 越小,芯片面积减小,开关损耗减小,适合高频,但器件额定电流较小,无法应用在大功率场合,或带来并联数量过多。
G
? 功率开关器件的追求:FOM值更优,器件综合损耗更低
? 同样的R ,Q 更小,FOM减小;
DS(ON) G
? 同样的Q ,R 更小,FOM减小。
G DS(ON)
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 20
BASiC Semiconductor品牌 BASiC BASiC C I O S R
单位
型号 B3M040120Z B2M040120Z C3M0040120K IMZA120R040M1H NTH4L040N120M3S SCT040W120G3-4 SCT3040KR
工艺技术 平面栅 平面栅 平面栅 沟槽栅 平面栅 平面栅 沟槽栅 /
Generation G3 G2 G3 M1H M3S G3 G4 /
V 18 18 15 18 18 18 18 V
GS(ON)
Tj=25℃ 40 40 40 39 40 40 40
R

DS(ON)
Tj=175℃ 75 70 68 77 80 70 78
Tj=25℃ 2.7 2.7 2.7 4.2 2.9 3.1 4
V V
GS(th)
Tj=175℃ 1.9 1.9 2.2 3.6 / 2.2 3.3
R 0.48 0.49 0.46 0.51 0.65 0.56 0.44 ℃/W
th(j-c)
Tc=25℃ 64 69 66 55 43 40 55
I
A
D
Tc=100℃ 45 48 48 39 31 40 39
I 124 123 100 117 134 179 137 A
D,pulse
Ciss 1870 2100 2900 1620 1700 1329 1337 pF
Coss 82 115 103 75 80 78 76 pF
Crss 6 6 5 11 7 10 27 pF
Q 85 90 99 39 75 56 107 nC
G
FOM Tj=25℃ 3400 3600 3960 1521 3000 2240 4280 mΩnC
Rgint 1.3 1.6 3.5 2.5 3.8 1.4 7 Ω
Tj=25℃ 5 4.6 5.5 3.8 4.5 2.6 3.2
V V
SD
Tj=175℃ 4.3 4 4.9 3.6 4.1 / /
Tjmax 175 175 175 175 175 200 175 ℃
Package TO-247-4 /
? 平面栅工艺:B3M040120Z的产品水平与C第三代和O公司的M3S系列水平接近,比第二代B2M040120Z更出色。B2M040120Z
? 沟槽栅工艺:因沟槽工艺优势,FOM值更低,但沟槽栅相同R 水平下,其额定电流较小。并且在高温下,沟槽栅的R 相对于常温上升得很快,接近2倍左右。
DS(ON) DS(ON)
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 21
BASiC Semiconductor? 根据静态特性,BASiC 1200V 40mR的实际BV 的接近1600V,BV 余量高于 C3M0040120K(W)和 IMZA120R040M1H(I)。
DSS DSS
B2M040120Z B3M040120Z C3M0040120K IMZA120R040M1H
项目 测试条件 样本 单位
(BASiC ) (BASiC ) (W) (I)
1#
1669.88 1596.57 1534.08 1509.98
2#
Tj=25℃
1672.11 1593.74 1504.92 1511.65
3#
1678.74 1590.44 1570.53 1511.71
V =0V,
GS
BV V
DSS
I =100μA
D
1#
1712.14 1634.82 1560.94 1541.25
2#
Tj=125℃ 1716.43 1546.73
1632.44 1529.83
3#
1722.41 1627.16 1597.39 1546.96
1#
0.05 0.07 0.08
0.01
2#
Tj=25℃
0.05 0.05 0.02 0.01
3#
0.13 0.05 0.01 0.01
V =1200V,
DS
I uA
DSS
V =0V
GS
1#
0.11 0.24 0.03 0.25
2#
Tj=125℃
0.18 0.11 0.02 0.05
3#
0.29 0.18 0.05 0.05
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 22
BASiC Semiconductor? 根据静态特性,BASiC 1200V 40mR在 IGSS+, IGSS-相接近于 C3M0040120K(W)和 IMZA120R040M1H(I)。
B2M040120Z B3M040120Z C3M0040120K IMZA120R040M1H
项目 测试条件 样本 单位
(BASiC ) (BASiC ) (W) (I)
1#
47.75 46.60 56.86 43.95
2#
Tj=25℃
44.50 46.07 65.03 47.31
3#
40.46 45.15 59.48 58.58
V =+18V,
GS
IGSS+ pA
V =0V
DS
1#
243.20 278.40 399.50 92.70
2#
Tj=125℃
248.70 111.00 352.20 176.50
3#
187.10 271.80 327.00 116.50
1#
-21.39 -18.35 -17.80 -25.43
2#
Tj=25℃ -16.18 -16.06 -14.78 -23.52
3#
-20.54 -16.71 -18.83 -17.97
V =-4V,
GS
IGSS- pA
V =0V
DS
1#
-75.70 -38.80 -87.30 -28.40
2#
Tj=125℃
-96.60 -78.60 -19.90 -71.40
3#
-61.90 -55.40 -11.00 -42.20
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 23
BASiC Semiconductor? BASiC 1200V 40mR 高温的Rdson是常温的1.3倍左右,跟C3M0040120K(W)的Rdson高温变化倍率相接近。
? 由于IMZA120R040M1H(I)是沟槽栅工艺,高温的Rdson是常温的1.6倍左右。
B2M040120Z B3M040120Z C3M0040120K IMZA120R040M1H
项目 测试条件 样本 单位
(BASiC ) (BASiC ) (W) (I)
1#
43.72 45.10 35.43 47.22
2#
Tj=25℃ 43.61 45.29 34.71 46.94
3#
43.74 45.08 36.51 46.74
V =+15V,
GS

Rdson1
I =20A
DS
1#
50.20 58.03 51.51 75.88
2#
Tj=125℃
50.17 59.05 49.20 75.29
3#
50.41 58.17 53.78 75.12
1#
35.78 38.35 32.03 44.66
2#
Tj=25℃ 35.68 38.79 31.21 44.34
3#
35.80 38.49 33.20 44.10
V =+18V,
GS
Rdson2 mΩ
I =40A
DS
1#
46.83 78.13
55.54 50.47
2#
Tj=125℃
46.80 56.68 47.98 77.45
3#
47.10 77.25
55.66 53.08
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 24
BASiC Semiconductor? 根据静态特性,BASiC 1200V 40mR在 V ,V 相接近于 C3M0040120K(W)和 IMZA120R040M1H(I)。
GS(th) SD
B2M040120Z B3M040120Z C3M0040120K IMZA120R040M1H
项目 测试条件 样本 单位
(BASiC ) (BASiC ) (W) (I)
1#
2.70 2.74 2.70 4.42
2#
Tj=25℃
2.70 2.71 2.69 4.44
3#
2.71 2.73 2.67 4.44
V =V ,
GS DS
V
V
GS(th)
I =8.3mA
DS
1#
2.14 2.13 2.36 3.85
2#
Tj=125℃
2.13 2.15 2.35 3.87
3#
2.12 2.10 2.34 3.87
1#
4.63 5.07 4.98 4.54
2#
Tj=25℃ 4.62 5.09 4.90 4.55
3#
4.60 5.08 5.08 4.54
V =-4V,
GS
V V
SD
I =20A
SD
1#
4.08 4.50 4.55 4.26
2#
Tj=125℃
4.07 4.52 4.48 4.26
3#
4.05 4.52 4.64 4.26
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 25
BASiC SemiconductorB2M040120Z B3M040120Z C3M0040120K IMZA120R040M1H
项目 测试条件 样本 单位
(BASiC ) (BASiC ) (W) (I)
1#
2090 1860 2830 1650
2#
Tj=25℃
2070 1860 2820 1650
V =0V,
GS
3#
2080 1860 2850 1640
Ciss
V =800V,
DS
1#
2110 1870 2850 1660
f=100kHz
2#
Tj=125℃ 2080 1880 2830 1650
3#
2100 1870 2870 1650
1#
6.80 7.33 7.30 8.52
2#
Tj=25℃
6.95 6.75 7.42 8.44
V =0V,
GS 3#
6.87 7.06 7.12 8.45
Crss pF
V =800V,
DS
1#
6.64 7.04 7.04 8.48
f=100kHz
2#
Tj=125℃ 6.64 8.19
6.45 7.15
3#
6.85 6.84 6.89 8.13
1#
117.33 82.60 107.48 78.72
2#
Tj=25℃
117.09 82.34 108.34 78.58
V =0V,
GS 3#
116.72 82.40 106.55 78.51
Coss
V =800V,
DS
1#
117.96 82.53 106.80 78.66
f=100kHz
2#
Tj=125℃
117.09 82.25 108.35 78.19
3#
117.03 81.91 106.73 78.74
1#
87.93 86.94 109.17 59.72
V =0V,
GS
Qg 2# nC
V =800V, Tj=25℃
87.87 84.39 109.22 59.34
DS
f=100kHz
3#
87.72 85.82 109.11 59.24
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 26
BASiC Semiconductor测试条件:V =-4V/+18V, Rgon=Rgoff=8.2Ω, 驱动IC-BTD5350MCWR, V =800V, I =40A,L =53nH, L =200uH
GS DC D σ Load
B2M040120Z B3M040120Z C3M0040120K IMZA120R040M1
项目 测试条件 单位
(BASiC ) (BASiC ) (W) H (I)
kA/us
di/dt ,ON 2.44 2.69 2.56 3.03
kV/us
dv/dt,ON 18.01 21.36 23.42 23.61
uJ
Eon 810 664 630 600
kA/us
di/dt,OFF 1.96 2.22 1.76 2.21
SiC MOSFET
Tj=25℃
kV/us
dv/dt, OFF 51.66 59.38 47.93 63.05
L
load
V
V ,peak 1092 1141 1068 1118
DS
V
DC
uJ
Eoff 170 162 231 170
uJ
Etotal 980 826 861 770
kA/us
di/dt ,ON 2.65 2.86 2.72 3.06
kV/us
dv/dt,ON 19.72 22.10 22.96 21.86
DUT
uJ
Eon 910 767 820
765
kA/us
di/dt,OFF 2.02 2.28 1.68 2.09
SiC MOSFET Tj=125℃
kV/us
dv/dt, OFF 55.80 63.10 49.17 60.87
V
V ,peak 1078 1125 1062 1101
DS
uJ
Eoff 160 151 231 180
uJ
Etotal 1070 918 996 1000
结论:在相同的测试条件下,B3M040120Z关断损耗比B2M040120Z,降低了4.7%。开通损耗比B2M040120Z,降低18%。
B3M040120Z关断损耗比C3M0040120K ,少了30%。且B3M040120Z的总损耗比C3M0040120K少了4%。
在高温条件,B3M040120Z的总损耗优于C3M0040120K和IMZA120R040M1H。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 27
BASiC Semiconductor驱动开通电压为+18V,SiC MOSFET体二极管做续流时的动态参数对比。
测试条件:V =-4V/+18V, Rgon=Rgoff=8.2Ω, 驱动IC-BTD5350MCW, V =800V, I =40A,L =53nH, L =200uH
GS DC D σ Load
B2M040120Z B3M040120Z C3M0040120K IMZA120R040M1
项目 测试条件 单位
(BASiC ) (BASiC ) (W) H (I)
A
I -18.70 -18.96 -18.70 -17.61
RRpeak
L
load
V
V ,peak 844 888 918 879
DS
V
DC
Body Diode nC
Qrr 0.25
Tj=25℃ 0.29 0.28 0.25
kA/us
di/dt 3.14 3.40 3.33 3.56
kV/us
dv/dt 33.02 39.64 41.94 42.04
A
I -38.63 -37.50 -38.85 -46.35
RRpeak
DUT
V
V ,peak 1012 1103 1149 1151
DS
Body Diode nC
Qrr Tj=125℃ 0.62 0.54 0.50 0.57
kA/us
3.92
di/dt 3.80 4.04 4.20
kV/us
dv/dt 45.05 50.63 59.86 52.94
结论:在高温和低温,B3M040120Z的体二极管的反向恢复电荷Qrr数值相当于C3M0040120K和IMZA120R040M1H。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 28
BASiC Semiconductor测试条件: V =-4V/+18V, Rgon=Rgoff=8.2Ω, V =800V, I =40A,Lσ=53nH, L =200uH, Tj=25℃
GS DC D Load
B3M040120Z C3M0040120K IMZA120R040M1H
结论: B3M040120Z和C3M0040120K,IMZA120R040M1H在开通时,栅极V 波形良好,没有明显的震荡和跌落,V 和I 波形正常。
GS DS D
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 29
BASiC Semiconductor测试条件: V =-4V/+18V, Rgon=Rgoff=8.2Ω, V =800V, I =40A, Lσ=53nH, L =200uH, Tj=25℃
GS DC D Load
B3M040120Z C3M0040120K IMZA120R040M1H
结论: B3M040120Z和C3M0040120K,IMZA120R040M1H在关断时,栅极V 波形良好,没有明显的震荡和跌落,V 和I 波形因关断速度过快
GS DS D
会有些轻微震荡。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 30
BASiC Semiconductor测试条件: V =-4V/+18V, Rgon=Rgoff=8.2Ω, V =800V, I =40A, Lσ=53nH, L =200uH, Tj=25℃
GS DC D Load
B3M040120Z C3M0040120K IMZA120R040M1H
结论: B3M040120Z和C3M0040120K,IMZA120R040M1H的体二极管在反向恢复时相比,行为比较接近,没有明显的震荡和跌落,VDS呈现
几个波头的振荡,I 波形良好,B3M040120Z的体二极管的dv/dt比C3M0040120K较缓和一些。
RR
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 31
BASiC SemiconductorSiC半桥顶部散热
SiC半桥MOSFET模块
MOSFET 模块
TM TM
Pcore?2 Pcore?2 Pcore?2 Pcore 2 Pcore 2 Pcore?12
HSOP8
(E1B) (E2B) (34mm) (62mm) (ED3) (EP2)
优势特点
? 低导通电阻 ? 高晶圆可靠性 ? 低导通电阻,低导通损耗
? 采用DBC陶瓷基板,实 ? 优异抗噪特性 ? 低开关损耗,适合高频应用
现内绝缘 ? 高热性能及高封装可靠性 ? 高可靠性
? 更优散热性能 ? 使用Si N 陶瓷基板,提高功率循 ? 结温可达175℃
3 4
? 低寄生电感,低热阻 环能力
? 安装方便,更具性价比
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 32
BASiC Semiconductor封装 型号 拓扑 电压(V) 电流(A) R ( mΩ )
DS(on)
B2M065120T 29 65
HSOP8 半桥 1200
B2M040120T 45 40
Pcore?4 E1B BMH027MR07E1G3 H桥(全桥) 650 40 27
Pcore?2 E1B BMF011MR12E1G3 120 11
BMF008MR12E2G3 160 8
Pcore?2 E2B
BMF240R12E2G3 240 5.5
BMF80R12RA3 80 15
34mm
BMF160R12RA3 半桥 160 7.5
1200
BMF300R12KA3 300 4.0
62mm
BMF450R12KA3 450 3.0
BMF300R12MA3 300 4.0
ED3
BMF450R12MA3 450 3.0
Pcore?12 BMS065MR12EP2CA2 三相PFC+三相逆变 25 65
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 33
BASiC Semiconductor? 特征
? 低导通电阻,低通态损耗
? 低开关损耗,适合高频应用
? 具有高导热系数的ZTA陶瓷覆铜板
? 隔离电压可达3.4kVrms
? 应用
封装尺寸: 32.7mm25mm5.5mm
? 快速充电桩模块
? UPS 数据中心
? 高精度机器人逆变焊机
产品型号 电压(V) R (mΩ) 拓扑结构
DS(ON)
? 光伏逆变器
B2M065120T 1200
65 半桥
? 高速电机驱动
1200 半桥
B2M040120T 40
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 34
BASiC Semiconductor? 电气特征
? 低导通电阻,低通态损耗
? 低开关损耗,适合高频应用
? 高门槛电压,有效抑制误开通: V .typ=4.0V
GS(th)
? 芯片内嵌SiC SBD,没有反向恢复行为
? 二极管低正向压降
? 机械特征
? 具有出色功率循环能力的 Si N 陶瓷基板
3 4 封装尺寸: 62.8mm42.5mm16.4mm
? 压接针技术
? 内置 NTC 温度采样电阻
产品型号 V (V) R (mΩ ) I (A) V (V) V (V) V (V) Qg(nC)
DSS DS(ON) D,nom GS(op) GS(th) SD
BMF240R12E2G3 1200 5.5 240 -4/+18 4.0 1.35 492
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 35
BASiC SemiconductorBASiC Semiconductor(创新 产 品)
? IGBT反并联超低压降V 的工频二极管
F
? 工频二极管的V 为负温度系数,浪涌能力强
F
? IGBT兼顾低Vce(sat)和高开关速度
? 该器件特别适用于维也纳拓扑的横管,因为该拓扑的二极管位置没有反向恢复工
况,采用工频二极管比普通FRD(V =1.45V)可以显著提升拓扑效率
F
产品型号 Vce(V) Ic(A ) @100℃ Vce(sat) (V ) V (V) V (V) Qg(nC)
GE(th) F
BG75N65HRA1 650V 75 1.6 5.0 0.92 444
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 37
BASiC SemiconductorTO-220-2 TO-220F-2 TO-220-isolated TO-247-3 TO-247-2 TO-252 TO-263 SOT-227
Voltage Current
B3D04065K B3D04065KF B3D04065KS B3D04065E
4A
B3D06065K B3D06065KF B3D06065KS B3D06065E
6A
B3D08065K B3D08065KS B3D08065E
8A
B3D10065K B3D10065KF B3D10065KS B3D10065E B3D10065F
10A
650V B3D20065K B3D20065HC B3D20065H B3D20065F
20A
B3D30065H
30A
B3D40065HC B3D40065H
40A
B3D80065HC B3D80065H2
80A
B2DM060065N1
60A2
B2D02120K1 B2D02120E1
2A
B3D03120E
3A
B3D05120K B3D05120E
5A
B3D20120HC B3D20120H B3D20120F
20A
B3D30120HC B3D30120H
30A
B3D40120HC B3D40120H
1200V 40A
B3D50120H
50A
B3D60120HC B3D60120H2
60A
B3DM060120N
60A2
B3D80120HC B3D80120H2
80A
B2DM100120N1
100A2
B3D40200H
2000V 40A
即将发布
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 38
BASiC Semiconductor PAGE 38? 脉冲变压器驱动方案:用一颗双通道低边驱动
芯片BTL27524R的两个通道输出OUT1和OUT2
分别连接到变压器的原边绕组两端,副边绕组
BTL27524
直接驱动IGBT
? BLT27524可以接受3.3V的逻辑电平,可以直
IGBT
接与MCU接口;输出可以直接驱动一个通道的
脉冲变压器
? 比常见使用分立MOSFET的方案集成度更高
采用SOP-8封装,输入信号逻辑电平低,更适合3.3V
或5V供电的MCU直接给输入信号。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 39
BASiC Semiconductor产品型号 使能 拉灌电流 逻辑选项组合 输入抗负压能力 封装
双路反向
BTL27523R

双路同向
BTL27524R
5A -5V SOP-8
双路反向
BTL27523BR

双路同向
BTL27524BR
? 特征性能
? 输入脚可耐受负压达-5V
? 电源电压最大24V
? 直接与MCU接口
? 两个通道延迟差异4ns
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 40
BASiC SemiconductorBASiC Semiconductor? SiC MOSFET 驱动核产品2CD0210T12x0 ( 青 铜剑品 牌)
? 可单独提供的三款零件
? 单通道功率2W,峰值电流10A
? 所应用到的三款零件为基本半导
体自主研发产品,用户可单独使
? 15V定压输入和16-30V宽压输入可选
用以下零件进行整体方案的设计。
? 适用1200V的SiC MOSFET功率器件
? 集成米勒钳位功能
单通道隔离驱动芯片
? 集成原副边欠压保护功能
型号: BTD5350MCWR
封装: SOW-8 (宽体)
? 典型应用
? 中大功率全碳化硅
开关电源
双通道隔离变压器
? 全碳化硅SVG
型号: TR-P15DS23-EE13
封装:EE13
? 全碳化硅APF
输出功率: 2W(每通道)
? 全碳化硅电机驱动
正激DCDC电源芯片
产品型号 DC/DC 输入供电电源 门极电压
型号: BTP1521F
2CD0210T12A0 15V定压输入
封装: DFN33-8
+18V/-4V
输出功率: 6W
2CD0210T12C0 16-30V宽压输入
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 42
BASiC Semiconductor? SiC MOSFET 驱动板参考设计
? 可单独提供的三款零件
? 即插即用驱动板型号为4QP0110T12-ES02
? 所应用到的三款零件为基本半导
体自主研发产品,用户可单独使
? 4通道输出
用以下零件进行整体方案的设计。
? 单通道输出功率2W
? 输出峰值拉灌电流10A
? 可支持驱动1200V的功率器件(SiC MOSFET) 单通道隔离驱动芯片
? 整板尺寸:126mm x 47mm x 15mm
型号: BTD5350MCWR
封装: SOW-8 (宽体)
双通道隔离变压器
型号: TR-P15DS23
输出功率: 2W(每通道)
正激DCDC电源芯片
型号: BTP1521F
封装: DFN33-8
输出功率: 6W
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 43
BASiC Semiconductor? SiC MOSFET 驱动板参考设计 ? 可单独提供的三款零件
? 即插即用驱动板型号为BSRD-2427-ES01 ? 所应用到的三款零件为基本半导
体自主研发产品,用户可单独使
? 2通道输出,单通道输出功率2W
用以下零件进行整体方案的设计。
? 驱动芯片直接输出峰值拉灌电流10A,无须外置推动级
? 可支持驱动1200V的功率器件(SiC MOSFET)
单通道隔离驱动芯片
型号: BTD5350MCWR
封装: SOW-8 (宽体)
双通道隔离变压器
型号: TR-P15DS23-EE13
封装:EE13
输出功率: 2W(每通道)
正激DCDC电源芯片
型号: BTP1521P
封装: SOP-8
输出功率: 6W
BSRD-2427-ES01顶视图 BSRD-2427-ES01俯视图
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 44
BASiC Semiconductor? 输出功率可达6W
底部裸露散热片,
加强封装散热能力
? 适用于给隔离驱动芯片副边电源供电
? 正激电路(H桥逆变或推挽逆变)
Expo
sed
? 软启动时间1.5ms
pad
? 工作频率可编程,最高工作频率可达1.3MHz
型号:BTP1521F
? VCC供电电压可达24V
管脚示意顶视图
封装:DFN33-8
? VCC欠压保护点4.7V
? 工作环境-40~125℃
? 芯片过温保护点150℃, 过温恢复点120℃
? 超小体积封装
型号:BTP1521P
原理框图
封装:SOP-8
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 45
BASiC Semiconductor? DC1和DC2接变压器原边线圈,副边二极管桥式整流,组成 ? 当副边需求功率大于 6W 时, 可以使用推挽逆变拓扑,通
开环的全桥拓扑(H桥逆变),输出功率可达6W, 输出经过 过DC1和DC2 端控制外接的 MOSFET 来增加输出功率。
电阻和稳压管分压后构成正负压,供SiC MOSFET使用,非
常适用于给隔离驱动芯片副边电源供电。
BTP1521推荐电路(功率6W情况下) BTP1521推荐电路(功率大于6W情况下)
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 46
BASiC Semiconductor? TR-P15DS23-EE13是驱动器专用的隔离电源变压器
? 采用EE13骨架(磁芯材质铁氧体)
? 可实现驱动器隔离供电,传输功率可达4W (每通道2W)
原边线圈 副边线圈
145
N1线圈电感量
N2线圈电感量 326 μH
N3线圈电感量 326
10
N1线圈匝数

15
N2和N3线圈匝数
0.2
N1线圈内径
0.2
N2线圈内径 mm
0.2
N3线圈内径
TR-P15DS23-EE13原理框图
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 47
BASiC Semiconductor? 全桥式拓扑,副边两路输出,单路输出功率可达2W,总输出功率4W
? 输入电压15V ,副边全桥整流输出全电压(VISO-COM=23V)
? 输出全电压通过4.7V的稳压管,将全电压拆分成正电压(VISO-VS=18V),负电压(COM-VS=-4V)
? BTP1521F的OSC管脚通过电阻R5=42.2kΩ接地,设置工作频率为F=477kHz
? 工作频率可以通过RF-set电阻设置,本公式提供了RF-set(kΩ)和F(kHz)之间的关系(典型值):
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 48
BASiC Semiconductor? 原方VCC1供电电压5V
? BTD5350xx是电压型输入的容隔驱动,输入IN是高阻抗,如果输入信号PCB布线不合理,容易导致输入信号受到干扰,驱动芯片会误动作,
建议在PWM输入接电阻R11=10kΩ到地(甚至更低的电阻),目的是使得PWM信号的线路上能产生足够的电流,可以避免芯片输入IN脚
受到干扰,同时靠近芯片IN脚接滤波电容C25=100pF到地
? 副方电源VISO2接+18V,COM2接-4V,G2连接到主功率板上的门极电阻
? 驱动芯片米勒钳位Clamp连接到主功率板上SiC MOSFET门极
? 当R3=22Ω,上下两通道可以实现互锁模式,当去掉R3,上下通道独立控制,无互锁功能
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 49
BASiC SemiconductorBASiC Semiconductor? 在桥式电路中,功率器件会发生米勒现象,它是指当一个开关管在开通
瞬间,使对管的门极电压出现顶起来的趋势
? 该现象广泛存在于功率器件中,包括IGBT,Si MOSFET,SiC MOSFET;
? 原理分析:当下管Q2保持关闭,在上管Q1开通瞬间,桥臂中点电压快
速上升,桥臂中点dv/dt的水平,取决于上管Q1的开通速度。该dv/dt,
会驱动下管Q2的栅漏间的寄生电容C 流过米勒电流I ;I =C
gd gd gd gd
(dv/dt),dv/dt越大,米勒电流I 越大
gd
? 米勒电流I (红色线)的路径:C →R →T4 →负电源轨,产生左负
gd gd goff
右正的电压
? V =I R +负电源轨,这个电压叠加在功率器件门极,Vgs会被抬高,
gs gd goff
当门极电压超过V ,将会使Q1出现误开通,从而造成直通现象
gsth
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 51
BASiC Semiconductor? 使用门极电压的负压进行负偏置,使负压足够“负”
? 提高器件的门极的门槛电压(设计选型时选高Vgsth的器件)
? R 数值减小(R 是米勒现象影响程度的主要贡献者之一,数值
goff goff
越大,米勒现象越糟糕)
? 减慢功率器件的开通速度,即增大R
gon
? 使用米勒钳位功能
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 52
BASiC Semiconductor参数和性能 IGBT SiC MOSFET 单位 说明
1: IGBT门极对驱动负压的忍耐能力明显优于SiC MOSFET
门极负压极限值V -25 -8 V 2: SiC MOSFET的实战的驱动负压通常在-2~-4V的水平
GS-
3: IGBT的驱动负压通常在-8~-15V,腾挪空间明显多于SiC MOSFET
1: SiC MOSFET开启电压低,容易误开通
开启电压Vgs(th) 5.5 1.8~2.7 V
2: SiC MOSFET的Vgs(th)随着TJ温度上升而下降,在高温时,更容易误开通
开关速度 100 200 % 米勒电流Igd=Cgd(dv/dt),dv/dt越大,Igd越大,越容易误开通
? 驱动方案
驱动IGBT 驱动SiC MOSFET
通常不需要使用米勒钳位功能 建议使用米勒钳位功能
? 驱动芯片的米勒钳位脚(Clamp)直接连接到SiC
MOSFET的门极,米勒电流Igd(红色线)会流经Cgd→T5
到负电源轨,形成了一条阻抗更低的门极电荷泄放回路。
? 驱动芯片内部比较器的翻转电压阈值2V(相对芯片地),
在SiC MOSFET关断期间,当门极电压低于2V时,比较器
输出从低电平翻转到高电平,MOSFET (T5)被打开, 使得
门极以更低阻抗拉到负电源轨,从而保证SiC MOSFET负
电压被更有效关断,达到抑制误开通的效果。
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 53
BASiC SemiconductorT
米勒钳位功能原理图
双脉冲原理图
? 上管(T)作为开关管接收脉冲PWM信号,下管(DUT)处于关断状态,
体二管续流
? 由于米勒现象,在上管(T)开通时,下管(DUT)门极电压会产生波动
? 因此通过观察下管(DUT)门极电压来判断米勒钳位功能的作用
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 54
BASiC Semiconductor测试条件: 上管V =0V/+18V, 下管V =0V;V =800V;I =40A;Rg=8.2Ω;L =200uH;Ta=25℃
GS GS DS D load
High side V
High side V
DS
DS
High side V
High side V
GS
GS
4V
2V
7.3V
High side I
High side I
D
D
Low side V
Low side V
GS
GS
无米勒钳位 有米勒钳位
无米勒钳位 有米勒钳位 单位
dv/dt 14.51 14.76 kV/us
结论
di/dt 2.24 2.24 kA/us
下管V 7.3 2 V
GS
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 55
BASiC Semiconductor测试条件: 上管V =-4V/+18V, 下管V =-4V;V =800V;I =40A;Rg=8.2Ω;L =20uH;Ta=25℃
GS GS DS D load
High side V
High side V
DS
DS
High side I
D
High side I
D
2.8V
0V
High side V
High side V
GS
GS
Low side V
Low side V
GS GS
无米勒钳位 有米勒钳位
无米勒钳位 有米勒钳位 单位
dv/dt 14.51 14.76 kV/us
结论
di/dt 2.24 2.24 kA/us
下管V 2.8 0 V
GS
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 56
BASiC Semiconductor? 产品特性
? 专为SiC MOSFET驱动的门极驱动芯片
? 副方驱动器带米勒钳位功能脚clamp BTD5350M
? 驱动器输出峰值电流可达10A
? 驱动器电源全电压高达33V
? 典型应用
型号: BTD5350M
? 工业电源
? 锂电池化成设备
? 商业空调
? 通信电源
? 光伏储能一体机
? 焊机电源
副方驱动器电源欠压 保护 点 封装
8V
SOW-18(宽体)
拓展型号: BTD5350S 开通和关断分开 拓展型号: BTD5350E 副边正电压UVLO
SOP-8(窄体)
11V
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 57
BASiC Semiconductor(创新产品)
? 产品特性
? 专门给SiC MOSFET驱动的门极驱动芯片
? 原方带使能禁用脚DIS,死区时间设置脚DT
? 副方驱动器带米勒钳位功能脚clamp
? 驱动器输出峰值电压可达10A
? 驱动器电源全电压高达33V
? 原副方封装爬电间距大于8.5mm,绝缘电压可达5000Vrms
? 副方两驱动器爬电间距大于3mm
? 应用方向
? 充电桩中后级LLC用SiC MOSFET 方案
? 光伏储能BUCK-BOOST中SiC MOSFET方案
? 高频APF,用两电平的三相全桥SiC MOSFET方案
副方驱动器电源欠压 保护 点 封装
? 空调压缩机三相全桥SiC MOSFET方案
8V
? 焊机电源全桥拓扑SiC MOSFET方案
SOW-18(宽体)
11V
? 服务器交流侧图腾柱PFC高频臂GaN或者SiC方案
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 58
BASiC SemiconductorBASiC Semiconductor兼容型号
产品型号 欠压保护值 欠压恢复值 占空比 工作温度 驱动峰值电流 最大工作频率 封装
T O S U
BTP2842DR 10V 16V UCx842 UCx842 UCx842 UCx842
100%
BTP2843DR 7.6V 8.4V UCx843 UCx843 UCx843 UCx843
-40℃~105℃ 1A 500kHz SOP-8
BTP2844DR 10V 16V UCx844 UCx844 UCx844 UCx844
50%
BTP2845DR 7.6V 8.4V UCx845 UCx845 UCx845 UCx845
BTP2844DR, BTP2845DR
BTP2842DR, BTP2843DR
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 60
BASiC Semiconductor? 采用单端反激拓扑
? 副边多路输出
? 输出总功率可达150W
原边开关管采用SiC MOSFET ,规格1700V/600mR;
型号B2M600170R(TO-263B-7)或B2M600170H(TO-247-3)
电源芯片采用BTP284xx
Copyright ? 2025 BASiC Semiconductor Co., Ltd. All rights reserved. www.basicsemi.com PAGE 61
BASiC SemiconductorBASiC – Vision For A Leading
Innovative SiC Company
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