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2008-2009年全球及中国手机射频行业研究报告
发布日期:2009-03
手机射频系统有三个主要零组件，收发器（Transceivers）、功率放大器（Power Amplifier，下简称PA）和天线开关，有时PA包含在前端模块（Front-End-Module，简称FEM）。2G时代的射频系统只占大约1.5美元的成本，3G时代则占大约6-8美元的成本，4G时代则占大约8-10美元的成本，也是手机升级换代成本增加最多的部分。 PA是手机中最关键的元件，它决定了手机的通话质量、通话时间、待机时间、信号强度。PA从一开始就牢牢掌握在复合半导体厂家的手中，这些厂家最主要的产品就是PA。PA领域主要的厂家有RFMD，Skyworks，Triquint，Anadigics，Avago，Renesas（瑞萨）。瑞萨的PA全部继承自日立半导体时代的产品，瑞萨成立后在PA领域毫无建树，没有推出过新产品，也没有推出适合3G的PA。 RFMD一直是PA界的老大，不过Skyworks与RFMD的差距越来越小。RFMD过分依赖诺基亚和摩托罗拉，这两个厂家对RFMD PA领域的销售额贡献度超过75%。RFMD过分依赖大客户，缺乏议价能力，最近处于亏损中。实际诺基亚也过分依赖RFMD，90%以上的PA都来自RFMD。Skyworks主要客户是索爱、LG、三星和摩托罗拉，客户分散度高，风险低。其技术实力也非常优秀，全球第一片含有PA的4G FEM就来自Skyworks。 Triquint在技术和制造能力方面是最优秀的，它同时也是全球最大GaAs代工厂。Triquint擅长供应高集成度的PA，也擅长PA的封装，全球最小footprint的GSM PA，全球第一颗采用FC封装的PA都是Triquint创造的，其主要客户是三星、LG、RIM和苹果。Anadigics和高通是亲密合作伙伴，因此主要开发CDMA和WCDMA领域的PA。在CDMA市场占有率比较高。Anadigics自成立以来一直在扩张，也导致其财务状况不佳，近5年只有1年盈利。Avago脱胎自原惠普仪器及半导体部门的安捷伦。Avago领先其他厂家，最早开发WCDMA领域，虽然前期销售不佳，但是随着WCDMA的普及，其销售额快速提升。 3G时代RF系统变得更加复杂，有些智能手机使用多达5个PA，一个针对所有的GSM频带，另外3个针对三个3G频带，还有一个是WLAN的PA。未来PA的发展趋势肯定是集成度提高。Skyworks 和Triqunit在这方面最具潜力。4G时代对PA的要求更高，包括更线性的放大倍数，更高的峰谷比率，更高的效率。无论是2G还是3G时代，PA领域一直是复合半导体厂家的天下，传统的硅半导体厂家根本无法染指。2G时代的PA通常是GaAs HBT，在3G时代，有些厂家继续坚持GaAs HBT。有些厂家独辟蹊径，新进厂家则多采用InGaP HBT，须要指出Skyworks已经收购了飞思卡尔的PA部门。Skyworks在2009年推出了全球第一款针对LTE/EUTRAN的FEM，型号为SKY77445，其PADie采用InGaP BiFET工艺。Anadigics有两款针对LTE/EUTRAN的PA，都采用了InGaP 。 6款典型3G时代PA对比
Mobile phone RF system consists mainly of transceivers, power amplifier (abbreviated as PA thereafter) and antenna switch. PA might be set in the Front-End-Module or FEM. In 2G, the cost of RF system was only about US $1.5, while In 3G, the cost was increased to between US$6.0 and US$8.0, and the cost will further increased to about US$8.0 to US$10.0 in 4G, obviously, FR system had the highest cost growth during the upgrading of mobile phones. The receiver is a part of the mobile phone platform. Generally the mobile phone baseband vendors also providing the receivers, however, Nokia’s baseband was from Texas Instruments, but its receiver was from ST Microelectronics or Infineon. ST Microelectronics has further enhanced its baseband ability through the consolidation between NXP and Ericsson mobile platform. PA (Power Amplifier) is the most key component in a mobile phone, which decides the voice quality, connection time, standby time and signal strength. PA has been produced by compound semiconductor manufacturers all along, including RFMD, Skyworks, Triquint, Anadigics, Avago and Renesas. Renesas still relies on the previous products form Hitachi Semiconductor, launched none of any new products. RFMD has always the NO.1, but the gap between RFMD and Skyworks is shrinking gradually. RFMD relies much on Nokia and Motorola. 75% sales of RFMD are contributed by those two. In the other hand, above 90% PA of Nokia is from RFMD. Skyworks’s main clients are Sony Ericsson, Motorola, LG and Samsung. The world’s first 4G FEM contains PA was from Skyworks. As the world’s largest GaAs OEM, Triquint is good at high-integration PA, as well as the PA packaging. The GSM PA with the smallest footprint and the world’s first FC packaged PA were both produced by Triquint. The main clients of Triquint are Samsung, LG, RIM and Apple. Anadigics has a close relationship with Qualcomm, which focus on the PA development for CDMA and WCDMA. Especially has a high market share in CDMA market. Since its establishment, Anadigics has been expanding continuously, but during the past five years, only one year is profitable. Avago was previously the semiconductor department (Agilent) of HP. Avago was the first one engaged in the WCDMA development. Though its sales did not look good initially, with the increasing popularity of WCDMA, the sales turned to increase rapidly. In 3G era, RF system becomes more complex. Some smart mobile phones have as many as five PAs, one is for all GSM frequency bands, one is for WLAN and the other three are for three 3G frequency band separately. Considering the high integration is the further development focus for PA, Skyworks and Triqunit have the biggest potential. 4G has much higher requirements to PA such as higher T/PR and higher efficiency. No matter in 2G or 3G, PA sector is always monopolized by compound semiconductor manufacturers; the traditional silicon semiconductors have no chances. PA was usually GaAs HBT in 2G , in 3G, new entrants tend to InGaP HBT, Skyworks had already acquired the PA department of Freescale. In 2009, Skyworks launched the world’s first model FEM (SKY77445) focus on LTE/EUTRAN. Anadigics also has two models of PA for LTE/EUTRAN, both of them adopted InGaP. Six Typical PA Models in 3G
Antenna switch is also has high entry barriers. Although its price is rather lower than PA and receiver, usually requiring SiP packaing and LTCC underlay. Globally, antenna switches are mainly supplied by Japanese vendors such as MURATA, Renesas and New JRC etc. |
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