SMT零件识别(SMT Components Distinguish)

 二 电容 (Capacitor):

    SMT 电容之外型尺寸与电阻相同, 常用之外型尺寸有以下数种规格:

    SMT capacitor dimension is same as resistor, the dimension of common using is as below:

项目 (Item)	尺 寸 (Dimension)
	公制(mm)	英制(inch)
1	1.6mmx0.8mm(1608)	0.06in.x0.03in.(0603)
2	2.0mmx1.25mm(2125)	0.08in.x0.05in.(0805)
3	3.2mmx1.6mm(3216)	0.12in.x0.06in.(1206)

    SMT 电容在外观上无法辨别其电容值, 需以电容表量测。

    Capacity value can’t show on the capacitor surface, it should be measured by meter.

    三 IC:

    (1) 名词解释(Definition):

    Pin: IC 脚 (又称lead)。

    Pin: IC lead.

    Pitch: Pin的中心点到相邻Pin的中心点之距离。

    Pitch: Distance between pin center to next pin center.

    (2) 外观分类(IC package type):

    2.1 SOP(Small Outline Package): IC脚位于本体两侧, 呈L型向外延伸。

     SOP(Small Outline Package): IC leads are L-shape and locate in 2 side of body.

    

    2.2 TSOP(Thin Small Outline Package): IC脚与SOP相同, 但本体厚度较SOP薄。

    TSOP(Thin Small Outline Package): The shape is similar to SOP, but it’s thinner than SOP.

    

    2.3 SOJ(Small Outline J-leaded Package): IC脚位于本体两侧, 呈J型向内弯曲。

    SOJ(Small Outline J-leaded Package): IC leads are J-shape and locate in 2 sides of body.

    

    2.4 BGA(Ball Grid Array): IC脚呈球状, 位于电路板(PCB)正下方。

    BGA(Ball Grid Array): IC leads are solder ball and in the bottom side of substrate PCB. No substrate PCB in

    

    2.5 μBGA(Micro Ball Grid Array): IC脚呈球状, 位于芯片(Chip)正下方, 无电路板(PCB)。

    μBGA(Micro Ball Grid Array): IC leads are solder ball and in the bottom side of chip, no PCB in μBGA.

    

    2.6 QFP(Quad Flat Package): IC脚位于本体四边, 呈L型向外延伸。

    QFP(Quad Flat Package): IC leads are L-shape and locate in 4 sides of b12/1/2008ody.

    

    2.7 PLCC(Plastic Leaded Chip Carrier): IC脚位于本体四边, 呈J型向内弯曲。

    PLCC(Plastic Leaded Chip Carrier): IC leads are L-shape and locate in 4 sides of body.