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代码
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相关对象
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说明
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单一字符代码
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L
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Line
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走线
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P
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Pin
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元件脚
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V
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Via
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贯穿孔
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K
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Keep in/out
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允许区域/禁止区域
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C
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Component
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元件层级
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E
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Electrical Constraint
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电气约束
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J
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T-Junction
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呈现T形的走线
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I
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Island Form
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被Pin或Via围成的负片孤铜
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错误代码前置码说明
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W
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Wire
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与走线相关的错误
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D
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Design
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与整个电路板相关的错误
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M
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Soldemask
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与防焊层相关的错误
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错误代码后置码说明
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S
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Shape/Stub
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与走线层的Shape或分支相关的错误
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N
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Not
Allowed
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与不允许的设置相关的错误
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W
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Width
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与宽度相关的错误
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双字符错误代码
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BB
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Bondpad to Bondpad
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Bondpad之间的错误
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BL
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Bondpad to Line
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Bondpad与Line之间的错误
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BS
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Bondpad to Shape
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Bondpad与Shape 之间的错误
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CC
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Package to Package
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Package之间的 Spacing 错误
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Symbol Soldermask to Symbol
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Soldermask零件防焊层之间的Spacing 错误
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DF
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Differential Pair Length Tolerance
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差分对走线的长度误差过长
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Differential Pair Primary Max Separation
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差分对走线的主要距离太大
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Differential Pair Secondary Max Separation
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差分对走线的次要距离太大
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Differential Pair Secondary Max Length
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差分对走线的次要距离长度过长
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DI
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Design Constraint Negative Plane Island
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负片孤铜的错误
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ED
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Propagation-Delay
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走线的长度错误
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Relative-Propagation-Delay
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走线的等长错误
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EL
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Max Exposed Length
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走线在外层（TOP&BOTTOM）的长度过长
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EP
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Max Net Parallelism Length-Distance Pair
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已超过Net之间的平行长度
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ES
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Max Stub Length
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走线的分支过长
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ET
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Electrical Topology
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走线连接方式的错误
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EV
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Max Via Count
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已超过走线使用的VIA的最大数目
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EX
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Max Crosstalk
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已超过Crosstalk值
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Max Peak Crosstalk
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已超过Peak Crosstalk值
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HH
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Hold to Hold Spacing
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钻孔之间的距离太近
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HW
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Diagonal Wire to Hold Spacing
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斜线与钻孔之间的距离太近
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Hold to Orthogonal Wire Spacing
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钻孔与垂直/水平线之间的距离太近
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IM
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Impedance Constraint
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走线的阻抗值错误
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JN
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T Junction Not Allowed
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走线呈T形的错误
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KB
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Route Keepin
to Bondpad
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Bondpad在Keepin之外
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Route keepout
to Bondpad
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Bondpad在keepout之内
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Via Keepout
to
Bondpad
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Bondpad在Via Keepout之内
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KC
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Package to Place Keepin Spacing
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元件在Place Keepin之外
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Package to Place Keepout Spacing
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元件在Place Keepout之内
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KL
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Line to Route Keepin Spacing
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走线在Route Keepin之外
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Line to Route Keepout Spacing
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走线在Route Keepout之内
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KS
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Shape to Route Keepin Spacing
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Shape在Route Keepin之外
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Shape to Route Keepout Spacing
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Shape在Route Keepout之内
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KV
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BBVia to Route Keepin Spacing
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BBVia在Route Keepin之外
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BBVia to Route Keepout Spacing
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BBVia在Route Keepout之内
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BBVia to Via Keepout Spacing
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BBVia在Via Keepout之内
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Test Via to Route Keepin Spacing
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Test Via在Route Keepin之外
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Test Via to Route Keepout Spacing
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Test Via在Route Keepout之内
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Test Via to Via Keepout Spacing
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Test Via在Via Keepout之内
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Through Via to Route Keepin Spacing
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Through Via在Route Keepin之外
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Through Via to Route Keepout Spacing
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Through Via在Route Keepout之内
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Through Via to Via Keepout Spacing
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Through Via在Via Keepout之内
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LB
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Min Self Crossing Loopback Length
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无
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LL
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Line to Line Spacing
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走线之间太近
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LS
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Line to Shape Spacing
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走线与Shape 太近
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LW
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Min Line Width
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走线的宽度太细
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Min Neck Width
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走线变细的宽度太细
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MA
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Soldermask Alignment Error Pad
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Soldermask Tolerance太小
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MC
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Pin/Via Soldermask to Symbol Soldermask
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Pad与Symbol Soldermask之间的错误
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MM
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Pin/Via Soldermask to Pin/Via Soldermask
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Pad
Soldermask之间的错误
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PB
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Pin to Bondpad
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Pin与Bondpad之间的错误
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PL
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Line to SMD Pin Spacing
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走线与SMD元件脚太近
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Line to Test Pin Spacing
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走线与Test元件脚太近
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Line to Through Pin Spacing
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走线与Through元件脚太近
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PP
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SMD Pin to SMD Pin Spacing
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SMD元件脚与SMD元件脚太近
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SMD Pin to Test Pin Spacing
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SMD元件脚与Test元件脚太近
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Test Pin to Test Pin Spacing
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Test元件脚与Test元件脚太近
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Test Pin to Through Pin Spacing
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Test元件脚与Through元件脚太近
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Through Pin to SMD Pin Spacing
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Through元件脚与SMD元件脚太近
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Through Pin to Through Pin Spacing
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Through元件脚与Through元件脚太近
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PS
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Shape to SMD Pin Spacing
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Shape与SMD元件脚太近
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Shape to Test Pin Spacing
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Shape与Test元件脚太近
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Through Pin to Shape Spacing
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Through元件脚与Shape太近
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PV
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BBVia to SMD Pin Spacing
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BBVia与SMD元件脚太近
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BBVia to Test Pin Spacing
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BBVia与Test元件脚太近
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BBVia to Through Pin Spacing
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BBVia 与Through元件脚太近
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SMD Pin to Test Via Spacing
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SMD Pin与Test Via太近
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SMD Pin to Through Via Spacing
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SMD Pin与Through Via太近
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Test Pin to Test Via Spacing
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Test Pin与Test Via太近
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Test Pin to Through Via Spacing
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Test Pin与Through Via太近
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Test Via to Through Pin Spacing
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Test Via与Through Pin太近
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Through Pin to Through Via Spacing
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Through Pin与Through Via太近
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RC
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Package to Hard Room
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元件在其他的Room之内
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RE
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Min Length Route End Segment at 135Degree
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无
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Min Length Route End Segment at 45/90Degree
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无
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SB
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135Degree Turn to Adjacent Crossing Distance
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无
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90Degree Turn to Adjacent Crossing Distance
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无
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SL
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Min Length Wire Segment
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无
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Min Length Single Segment Wire
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无
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SN
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Allow on Etch Subclass
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允许在走线层上
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SO
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Segment Orientaion
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无
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BB
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Bondpad to Bondpad
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Bondpad之间的错误
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SS
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Shape to Shape
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Shape之间的错误
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TA
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Max Turn Angle
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无
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VB
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Via to Bondpad
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Via 与Bondpad之间的错误
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VG
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Max BB Via Stagger Distance
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同一段线的BB Via之间的距离太长
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Min BB Via Gap
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BB Via之间太近
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Min BB Via Stagger Distance
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同一段线的BB Via之间的距离太近
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Pad/Pad Direct Connect
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Pad 在另一个Pad 之上
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VL
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BB Via to Line Spacing
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BB Via与走线太近
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Line to Through Via Spacing
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走线与Through Via太近
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Line to Test Via Spacing
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走线与Test Via太近
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VS
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BB Via to Shape Spacing
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BB Via与Shape太近
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Shape to Test Via Spacing
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Shape 与Test Via太近
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Shape to Through Via Spacing
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Shape与Through Via太近
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VV
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BB Via to BB Via
Spacing
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BB Via之间太近
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BB Via to Test Via Spacing
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BB Via与Test Via太近
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BB Via to Through Via Spacing
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BB Via与Through Via太近
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Test Via to Test Via Spacing
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Test Via之间太近
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Test Via to Through Via Spacing
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Test Via与Through Via太近
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Through Via to Through Via Spacing
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Through Via之间太近
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WA
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Min Bonding Wire Length
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Bonding Wire 长度太短
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WE
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Min End Segment Length
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无
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Min Length Wire End Segment at 135Degree
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无
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Min Length Wire End Segment at 45/90Degree
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无
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WI
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Max Bonding Wire Length
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Bonding Wire 长度太长
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WW
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Diagonal Wire to Diagonal Wire Spacing
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斜线之间太近
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Diagonal Wire to Orthogonal Wire Spacing
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斜线与垂直/水平线之间的距离太近
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Orthogonal Wire to Orthogonal Wire Spacing
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垂直/水平线之间的距离太近
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WX
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Max Number of Crossing
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无
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Min Distance between Crossing
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无
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XB
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135 Degree Turn to Adjacent Crossing Distance
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无
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90 Degree Turn to Adjacent Crossing Distance
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无
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XD
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Externally Determined Violation
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无
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XS
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Crossing to Adjacent Segment Distances
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无
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