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9 RECEIPT, INSPECTION & CONTROL OF INCOMING MATERIAL 9.1.P Are there procedures that define: a.P - Traceability and configuration control in accordance with customer requirements? YES/NO b.P - Storage and handling of assemblies, components, PB, and materials in accordance with ESD requirements (see section 8.0) and Moisture Sensitivity Level (MSL) requirements? YES/NO c.P - Age sensitive material control? YES/NO d.P - Method of PB coupon retention including any customer requirements? YES/NO e.P - Control of storage with environment control limits for temperature and humidity and prevention of contamination? YES/NO 9.2.P If required by customer, is there a procedure for PB inspection, including mechanical dimension control? YES/NO/N/A RECEIPT, INSPECTION & CONTROL OF INCOMING MATERIAL COMPLIANCE 9.1.C Is the control of traceability and configuration control in accordance with the procedure, including any requirements for serialization and date codes, etc.? YES/NO 9.2.C If required by customer, are PB's inspected for compliance, including mechanical dimensions? YES/NO/N/A 9.3.C Is the storage and handling of assemblies, components, PB's and materials in accordance with the procedure, including ESD protection, MSL management, temperature and humidity control, and age sensitive material control? YES/NO 9.4.C Are PB coupons being retained as per the procedure and customer requirements? YES/NO 9.5.C Is there evidence that all personnel working within receipt-inspection have been trained in accordance with the procedure and the requirements for ESD management? YES/NO 9.6.C Are moisture sensitive parts being handled in accordance with the procedure? YES/NO 10 STORAGE & HANDLING OF IN PROCESS MATERIALS 10.1.P Are there procedures that define: a.P - Control of storage with environment control limits for temperature and humidity and prevention of contamination? YES/NO b.P - Containers and their usages? YES/NO c.P - Age sensitive material control? YES/NO 10.2.P Is there a control plan for the storage of components and materials, to include the calibration of refrigerators and freezers, timers, and flow meters? YES/NO 10.3.P Is there a procedure for the purge process? YES/NO 10.4.P Are there procedures for the Moisture Control Plan for the Packing, Handling & Storage of components and materials, which meet the requirements of IPC/JEDEC J-STD-033, of components and of materials manufacturers and/or of customers? YES/NO 10.5.P If baking is used as part of Moisture Control Plan, are there procedures for the baking parameters? YES/NO/N/A STORAGE & HANDLING OF IN PROCESS MATERIALS COMPLIANCE 10.1.C Is there control of containers and their usages? YES/NO 10.2.C Is the procedure for the control of storage environments to prevent contamination and control environment limits for temperature and humidity being followed? YES/NO 10.3.C Is there identification and segregation of components according to procedure? YES/NO 10.4.C Is there traceability of components per customer requirements? YES/NO 10.5.C Are the requirements for the control of shelf life being followed? YES/NO 10.6.C Is the moisture control plan being followed? YES/NO 10.7.C If baking is used as part of moisture control plan, are there baking parameters established, and is there evidence that they are being followed? YES/NO/N/A 10.8.C Is the control plan for storage of components and materials being followed? YES/NO 10.9.C Is there evidence that the purge process is being followed? YES/NO 10.10.C Are all materials (including PB with different finishes) handled according to the procedure? YES/NO 10.11.C Are components packaged according to the procedure? YES/NO 10.12.C Are Circuit Card Assemblies packaged according to the procedure? YES/NO |
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