Learning Objectives: Screen Printing Elements 丝网印刷原理 Solder Paste Printing Quality 锡膏印刷质量 Factors Affecting the Printing 影响印刷的因子 Screen Printing Parameter 印刷参数 Screen Printer 丝网印刷机 Post Printing Verification Methods 印刷后的检测方法 Stencils/钢网: Stencil Thickness/钢网厚度 Stencil Material/钢网材料 Stepped or uniformed thickness stencil均匀厚度或阶梯式的钢网 Stencil Material Coefficient of Friction钢网材料的摩擦系数 Stencil Surface Roughness 钢网表面粗糙度 Stencil Hardness/Tensile Strength钢网硬度/抗张强度 Framing Tension/框架张力 Mounting Material/铆合材料 Partial or Full/局部或全部 Aperture Size/开孔尺寸 Aperture Shape & Wall开孔形状和孔壁 Aperture Arrangement/开孔安排 Aperture Aspect Ratio/开孔比率 Area Ratio/面积比率 Aperture Tolerance/开孔的公差 Aperture Gasketing Aperture Location Tolerance/开孔位置公 差 Thickness Tolerance/厚度公差 Aperture Ratio/开孔比率: A - must be 1.5 times > T for chemical etch stencil 对于化学蚀刻钢网,网孔宽度必须大于厚度的1.5倍 A - must be 1.1 times > T for electroform stencil 对于电铸钢网,网孔宽度必须大于厚度的1.1倍 W - the web between aperture must be > T 网孔间隙必须大于钢网厚度 A - must be at least 4.5 times the solder particle diameter 网孔宽度必须大于锡球直径的4.5倍 Print Parameters/印刷参数: Print Speed/印刷速度 Squeegee Pressure/刮刀压力 Separation Speed/分离速度 Print Gap/印刷间隙 Under Screen Clean Rate/钢网底板清洗频率 Paste Dispense/锡膏分配 Environment/环境 相信本次的相遇只是我们彼此成就的开始 因为人生所有的修炼都只为在更高的地方遇见你 传播分享真知,赋能中国智造 |
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