PCBTN.COM-专业技术-基于无铅焊料下的01005元件PCB设计与组装过程研究3

基于无铅焊料下的01005元件PCB设计与组装过程研究

更新日期： 2007-6-28 17:14:30

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剪切测试：剪切测试所使用的样品是首次实验中的01005电阻。使用SnPb焊膏与ENIG（无电镀镍浸金）涂层的PCB板。剪切速率为500 µm/sec。剪切高度为50 µm。所有的最小失效模型见（表3）。包括陶瓷体破裂，焊点与焊盘的最终分离以及焊点断裂。

结论：

在设计和制造中使用01005元件是可能的。整个过程与0201元件类似。在全部工艺过程优化后，选择C型焊盘可以保证很高的良率。印刷过程中使用 厚度为100µm的摸板。01005元件同样可以使用盘卷方式包装。回流过程中需要使用氮气环境来促进润湿。由于元件尺寸小造成的焊膏沉积量相对较少，因 此在整个过程中要注意保持助焊剂的活性。下一步的研究课题是对在空气环境中01005元件的回流进行过程优化。

（本文最早刊登在SMTA国际会议论文集中。已经获得授权使用）

参考文献：

D. Shangguan, “0201 Assembly Capability for Miniaturization: From Design to Volume Manufacturing,”Proceedings of 2003 International Printed Circuit&Electronics Assembly Fair Technical Conference and Exhibition, December 2003.

D. Geiger, F. Mattsson, D. Shangguan, M. Ong, P.Wong, M. Wang, T. Castello and S. Yi, “Process Characterization of PCB Assembly Using 0201 Packages With Lead-Free Solder,” Soldering & Surface Mount Technology, 2003. (Also, Nepcon West Proceedings, December 2002.)

D.A. Geiger, M. Wang, D. Shangguan, T. Castello and F. Mattson, “Reliability Study of Solder Joints for 0201 Components,” SMTA International Conference Proceedings, September 2003.

M. Wang, D. Shangguan, M.T. Ong, F. Mattsson, D.Geiger and S. Yi, “Assembly Process Qualification on 0201 Packages for Volume Manufacturing,”

SMTA International Conference Proceedings, September 2002.

M. Wang, D. Shangguan, D. Geiger, F. Mattsson and S.Yi, “PCB Design Optimization of 0201 Packages for Assembly Processes,” SMTA/IMAPS Telecomm Hardware Solutions Conference & Exhibition Proceedings,

May 2002.

M. Wang, D. Shangguan, D. Geiger, K. Nakajima, C.C.Ho and S. Yi, “Board Design and Assembly Process Evaluation for 0201 Components on PCBs,” Apex

Proceedings, January 2002.

M. Wang, D. Geiger, K. Nakajima, D. Shangguan, C.C.Ho and S. Yi, “Investigation of Printing Issues and Stencil Design for 0201 Package,” SMTA International Conference Proceedings, October 2001.