BEOLFrom Wikipedia, the free encyclopedia
Back-end-of-line (BEOL) denotes the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer. BEOL generally begins when the first layer of metal is deposited on the wafer. It includes contacts, insulating layers (dielectrics), metal levels, and bonding sites for chip-to-package connections. After a FEOL step there is a wafer with isolated transistors (without any wires). In BEOL part of fabrication stage contacts (pads), interconnect wires, vias and dielectric structures are formed. For modern IC process, more than 10 metal layers can be added in the BEOL. Steps of the BEOL:
After BEOL there is a "Backend process" (also called post-fab), which is done not in the cleanroom, often by different company. It includes wafer test, wafer backgrinding, die separation, die tests, IC packaging and final test. |
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